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IMAPS 3rd Advanced Technology Workshop on

Printing an Intelligent Future:

Printed Organic and Molecular Electronic Technologies

Loews Hotel Annapolis
Annapolis, Maryland
September 28 - 30, 2004

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
“Everything in electronics between the chip and the system”


&
Technical Association Graphic Arts (TAGA)

General Chair:
Daniel Gamota, Motorola
Schaumburg, IL
Email: gamota@motorola.com

Technical Program Co-Chairs:

Paul Brazis, Motorola
Schaumburg, IL
paul.brazis@motorola.com
Anthony Stanton, Carnegie Mellon University
Pittsburgh, PA
stanton@andrew.cmu.edu
Richard Goodman, RMGC
Briarcliff Manor, NY
RMGConsulting@msn.com
Krishna Kalyan, Motorola
Schaumburg, IL
krishnak@motorola.com
Jie Zhang, Motorola
Schaumburg, IL
jie.zhang@motorola.com
Dan Lawrence, Precisia
Ann Arbor, MI
dan.lawrence@precisia.com
Beng Ong, Xerox
Ontario, Canada
beng.ong@crt.xerox.com
Cathy Curling, Plastic Logic Limited
Cambridge, UK
cathy.curling@plasticlogic.com


Workshop Overview

Today articles identifying organic electronics as a “Top 10 Technology to Watch” appear regularly in widely distributed business and technology publications. Since 2001, the organic electronics community has received greater international attention that has led to the creation of several business ventures and technology-driven consortia that are developing the enabling disruptive technologies to launch organic electronics-based products. Market opportunities for many of these applications depend on cost. To achieve these cost targets, the materials and processes developed in the laboratory must be transferable to the high-volume manufacturing environment. One low cost manufacturing approach that has been proposed is based on traditional graphic arts printing platforms; in addition, the recent development of novel classes of printing inks (conductive, dielectric, and semiconductive inks) demonstrating electrical stability has resulted in the fabrication of organic-based electronic systems. These materials have demonstrated improved processing properties as well as performance when exposed to ambient conditions.

Although many disruptive technologies require novel manufacturing platforms to be developed, opportunities to leverage graphic arts printing platforms can mitigate risk while significantly reducing the time for organic and molecular electronics technology introduction. Many existing graphic arts printing platforms can be used to fabricate organic electronics-based products by integrating various hardware/software motion & vision control systems. This ATW is providing the mechanism to create an international network of organic and molecular electronics developers and systems designers by bringing together representatives from the graphic arts printing and microelectronics industries.

Tuesday, September 28

Registration: 4:30 pm – 7 pm

Reception: 6 pm – 7 pm

Wednesday, September 29

Registration: 7:30 am – 5:30 pm

Continental Breakfast: 7:30 am – 8:30 am

Session 1: Business Opportunities for Printing Organic Electronics
8:30 am – 11:45 am
Chairs: Dan Lawrence, Precisia; Krishna Kalyan, Motorola

Macroelectronics, The Next BIG Thing in Microelectronics
Robert Reuss, DARPA

A Horse of another Color: Printing Electronics
William J. Ray, Group Infotech

Enabling Printed Electronics
Darren Lochun, Eitan Zeira, Nashua Corporation

Break: 10 am – 10:15 am

Accelerating Innovative Manufacturing Technologies and Positioning Flexible Electronics for Tomorrow's Marketplace
Michael Schen, National Institute of Standards and Technology

The Market Implications of the Meeting of Two Great Industries: Printing and Electronics
Dan Lawrence, Precisia

The Plastic Electronics Revolution
Stuart Evans, Plastic Logic Limited

Lunch: 11:45 am – 1 pm

Session 2: Functional Inks for Printing Organic Electronics
1 pm – 4:45 pm
Chairs: Anthony Stanton, Carnegie Mellon University; Beng Ong, Xerox

The use of Polyfluorenes as the Polymeric Semiconductor in Printed Electronics
David J. Brennan, P. H. Townsend, S. R. Kisting, M. G. Dibbs, D. W. Castillo, Y. Chen, S. Feng, J. P. Godschalx, J. L. Miklovich, J. M. Shaw, G. E. Spilman, J. Rogner, The Dow Chemical Company

Digital Printing of Metallic Conductors in Support of the Burgeoning Plastic Electronics Industry
James Caruso, Cabot Corp.

Novel Silicone Sycar Hybrids for Harsh Fluid Resistant Adhesives
Susan Krawiec, Elizabeth Walker, Robert Palmer, Chih-Min Cheng, Kate Pearce, Emerson & Cuming

Break: 2:30 pm – 2:45 pm

Dielectric and Semiconducting Materials for Organic Field-Effect Transistors
Antonio Facchetti, Myung-Han Yoon, Tobin J. Marks, Northwestern University

Conductive Adhesives for High Speed Assembly: Low Temperature, Spot Cure Technology
Chih-Min Cheng, Wanda O ’Hara, Bo Xia, Vito Buffa, Emerson & Cuming

Design of a Printed Gate Dielectric for High-Performing Organic Thin Film Transistors
Toshihide Kamata, T. Kodzasa, S. Uemura, M. Yoshida, S. Hoshino, National Institute of Advanced Industrial Science and Technology

Materials Design for Printed Electronics
Beng Ong, Xerox Research Center of Canada

Dinner: 5 pm – 6:30 pm

Thursday, September 30

Registration: 7:30 am – 5:30 pm

Continental Breakfast: 7:30 am – 8:30 am

Session 3: Printing Technologies and Opportunities
8:30 am – 12:15 pm
Chairs: Richard Goodman, RMG Consulting; Jie Zhang, Motorola

Dot Formation in Contact Printing using a Raised Image Area Photopolymer Test Image
Brian Brollier, International Paper Company; Dan Lawrence, Precisia

New Generation Printhead Technology for Precision Jetting of Organic and Inorganic Fluids
Martin Schoeppler, Spectra

Thermal Laser Direct Imaging for Manufacturing Displays and Electronic Devices
Eran Elizur, CREO

Break: 10 am – 10:15 am

Practical Considerations of Printing Conductive Materials
Jim Parker, Graphic Solutions International

The Effect of Speed and Viscosity on Line Quality in Rotogravure Printing
Tim C. Claypole, G. R. Davies, E. H. Jewell, V. Vigne, University of Wales Swansea

Using High-Volume Printing Techniques to Pattern Materials for Low Cost Device Fabrication
Bruce E. Kahn, Yu Xia, Franz Sigg, Daniel M. Clark, Rochester Institute of Technology

Ink Jet Printed UBM and Lead Free Solder
Kurt P. Wachtler, David Wallace, MicroFab Technologies

Lunch: 12:15 pm – 1:30 pm

Session 4: Product Design and Characterization
1:30 pm – 4:45 pm
Chairs: Cathy Curling, Plastic Logic Limited; Paul Brazis, Motorola

Printed Integrated Circuits as Basis for RFID-Tags
A. Knobloch, A. Bernds, J. Ficker, W. Clemens, W. Fix, PolyIC GmbH & Co., KG

Solution-Processed Organic N-Type Field-Effect Transistors
Kiyoshi Yase, Masayuki Chikamatsu, Shuichi Nagamatsu, Yuji Yoshida, Kazuhiro Saito, National Institute of Advanced Industrial Science and Technology (AIST)

Monitoring Thixotropic Behavior using Impedance Spectroscopy
Martin Seitz, Charles Koehler, Richard Hirthe, Jianxun Hu, Marquette University

Break: 3 pm – 3:15 pm

Characterisation Methods for Printed Thin Film Electronics
Tim C. Claypole, E. H. Jewelld, T. Gethin, University of Wales Swansea

Jetting Fluids for MEMS Sealing, Micro-Encapsulation, and RF Antenna Formation
Alan Lewis, Alec Babiarz, Asymtek

Flexographically Printed RFID Tag Antennae
S. Bose, Dan Lawrence, Precisia

Closing Remarks: 4:45 pm


Housing Deadline: August 27, 2004

Loews Annapolis Hotel
126 West Street
Annapolis, Maryland 21401
P: 800-526-2593; 410-263-7777
www.loewsannapolis.com
Rates: Single/Double $145
When making reservations, please reference IMAPS.

Housing Accommodations MUST be made directly to the hotel. Please make your reservation before August 20, 2004. A one night’s deposit of room charge and tax is required to guarantee your accommodations. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival. After which time, deposit is non-refundable.






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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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