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IMAPS 3rd Advanced Technology Workshop on
Printing an Intelligent Future:
Printed Organic and Molecular Electronic Technologies
Loews Hotel Annapolis
Annapolis, Maryland
September 28 - 30, 2004
Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
“Everything in electronics between the chip and the system”
&
Technical Association Graphic Arts (TAGA)
General Chair:
Daniel Gamota, Motorola
Schaumburg, IL
Email: gamota@motorola.com
Technical Program Co-Chairs:
Workshop Overview
Today articles identifying organic electronics as a “Top 10 Technology
to Watch” appear regularly in widely distributed business and technology
publications. Since 2001, the organic electronics community has
received greater international attention that has led to the creation
of several
business ventures and technology-driven consortia that are developing
the enabling disruptive technologies to launch organic electronics-based
products.
Market opportunities for many of these applications depend on cost.
To achieve these cost targets, the materials and processes developed
in the
laboratory must be transferable to the high-volume manufacturing
environment. One low cost manufacturing approach that has been proposed
is based on
traditional graphic arts printing platforms; in addition, the recent
development of novel classes of printing inks (conductive, dielectric,
and semiconductive
inks) demonstrating electrical stability has resulted in the fabrication
of organic-based electronic systems. These materials have demonstrated
improved processing properties as well as performance when exposed
to ambient conditions.
Although many disruptive technologies require novel manufacturing platforms
to be developed, opportunities to leverage graphic arts printing
platforms can mitigate risk while significantly reducing the time for organic
and
molecular electronics technology introduction. Many existing graphic
arts printing platforms can be used to fabricate organic electronics-based
products
by integrating various hardware/software motion & vision control
systems. This ATW is providing the mechanism to create an international
network
of organic and molecular electronics developers and systems designers
by bringing together representatives from the graphic arts printing and
microelectronics
industries.
Tuesday, September 28
Registration: 4:30 pm – 7 pm
Reception: 6 pm – 7 pm
Wednesday, September 29
Registration: 7:30 am – 5:30 pm
Continental Breakfast: 7:30 am – 8:30
am
Session 1: Business Opportunities for Printing Organic Electronics
8:30 am – 11:45 am
Chairs: Dan Lawrence, Precisia; Krishna Kalyan, Motorola
Macroelectronics, The Next BIG Thing in Microelectronics
Robert Reuss, DARPA
A Horse of another Color: Printing Electronics
William J. Ray, Group Infotech
Enabling Printed Electronics
Darren Lochun, Eitan Zeira, Nashua Corporation
Break: 10 am – 10:15 am
Accelerating Innovative Manufacturing Technologies and Positioning Flexible
Electronics for Tomorrow's Marketplace
Michael Schen, National Institute of Standards and Technology
The Market Implications of the Meeting of Two Great Industries: Printing
and Electronics
Dan Lawrence, Precisia
The Plastic Electronics Revolution
Stuart Evans, Plastic Logic Limited
Lunch: 11:45 am – 1 pm
Session 2: Functional Inks for Printing Organic Electronics
1 pm – 4:45 pm
Chairs: Anthony Stanton, Carnegie Mellon University; Beng Ong, Xerox
The use of Polyfluorenes as the Polymeric Semiconductor in Printed Electronics
David J. Brennan, P. H. Townsend, S. R. Kisting, M. G. Dibbs, D.
W. Castillo, Y. Chen, S. Feng, J. P. Godschalx, J. L. Miklovich, J. M.
Shaw, G. E. Spilman, J. Rogner, The Dow Chemical Company
Digital Printing of Metallic Conductors in Support of the Burgeoning Plastic
Electronics Industry
James Caruso, Cabot Corp.
Novel Silicone Sycar Hybrids for Harsh Fluid Resistant Adhesives
Susan Krawiec, Elizabeth Walker, Robert Palmer, Chih-Min Cheng,
Kate Pearce, Emerson & Cuming
Break: 2:30 pm – 2:45 pm
Dielectric and Semiconducting Materials for Organic Field-Effect Transistors
Antonio Facchetti, Myung-Han Yoon, Tobin J. Marks, Northwestern University
Conductive Adhesives for High Speed Assembly: Low Temperature, Spot Cure
Technology
Chih-Min Cheng, Wanda O ’Hara, Bo Xia, Vito Buffa, Emerson & Cuming
Design of a Printed Gate Dielectric for High-Performing Organic Thin Film
Transistors
Toshihide Kamata, T. Kodzasa, S. Uemura, M. Yoshida, S. Hoshino,
National Institute of Advanced Industrial Science and Technology
Materials Design for Printed Electronics
Beng Ong, Xerox Research Center of Canada
Dinner: 5 pm – 6:30 pm
Thursday, September 30
Registration: 7:30 am – 5:30 pm
Continental Breakfast: 7:30 am – 8:30
am
Session 3: Printing Technologies and Opportunities
8:30 am – 12:15 pm
Chairs: Richard Goodman, RMG Consulting; Jie Zhang, Motorola
Dot Formation in Contact Printing using a Raised Image Area Photopolymer
Test Image
Brian Brollier, International Paper Company; Dan Lawrence, Precisia
New Generation Printhead Technology for Precision Jetting of Organic and
Inorganic Fluids
Martin Schoeppler, Spectra
Thermal Laser Direct Imaging for Manufacturing Displays and Electronic
Devices
Eran Elizur, CREO
Break: 10 am – 10:15 am
Practical Considerations of Printing Conductive Materials
Jim Parker, Graphic Solutions International
The Effect of Speed and Viscosity on Line Quality in Rotogravure Printing
Tim C. Claypole, G. R. Davies, E. H. Jewell, V. Vigne, University
of Wales Swansea
Using High-Volume Printing Techniques to Pattern Materials for Low Cost
Device Fabrication
Bruce E. Kahn, Yu Xia, Franz Sigg, Daniel M. Clark, Rochester Institute
of Technology
Ink Jet Printed UBM and Lead Free Solder
Kurt P. Wachtler, David Wallace, MicroFab Technologies
Lunch: 12:15 pm – 1:30 pm
Session 4: Product Design and Characterization
1:30 pm – 4:45 pm
Chairs: Cathy Curling, Plastic Logic Limited; Paul Brazis, Motorola
Printed Integrated Circuits as Basis for RFID-Tags
A. Knobloch, A. Bernds, J. Ficker, W. Clemens, W. Fix, PolyIC GmbH & Co.,
KG
Solution-Processed Organic N-Type Field-Effect Transistors
Kiyoshi Yase, Masayuki Chikamatsu, Shuichi Nagamatsu, Yuji Yoshida,
Kazuhiro Saito, National Institute of Advanced Industrial Science and
Technology (AIST)
Monitoring Thixotropic Behavior using Impedance Spectroscopy
Martin Seitz, Charles Koehler, Richard Hirthe, Jianxun Hu, Marquette
University
Break: 3 pm – 3:15 pm
Characterisation Methods for Printed Thin Film Electronics
Tim C. Claypole, E. H. Jewelld, T. Gethin, University of Wales Swansea
Jetting Fluids for MEMS Sealing, Micro-Encapsulation, and RF Antenna Formation
Alan Lewis, Alec Babiarz, Asymtek
Flexographically Printed RFID Tag Antennae
S. Bose, Dan Lawrence, Precisia
Closing Remarks: 4:45 pm
Housing Deadline:
August 27, 2004
Loews Annapolis Hotel
126 West Street
Annapolis, Maryland 21401
P: 800-526-2593; 410-263-7777
www.loewsannapolis.com
Rates: Single/Double
$145
When making reservations, please reference IMAPS.
Housing Accommodations MUST be made
directly to the hotel. Please make your reservation before August
20, 2004. A one night’s deposit of room charge and tax
is required to guarantee your accommodations. Deposit refunded
if reservation is cancelled fourteen (14) days prior to arrival.
After which time, deposit is non-refundable.
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