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IMAPS Pittsburgh/Cleveland Chapter

Technical Meeting and Tour

Tuesday, June 30, 2009
Begins at 4:00pm
University of Pittsburgh, Benedum Hall, Room 360
Pittsburgh, Pennsylvania

Please join us for dinner, technical presentations and an optional tour.

Registration closes Friday, June 26 at 5pm EDT

On-line registration has closed


Program:

4:00   Reception, Welcome, and Introductions
                     Brian Schieman, IMAPS and Kevin Chen, University of Pittsburgh

4:30   “Direct 3D waveguide writing in transparent materials for electro-optical device packaging
                      Ben McMillen, University of Pittsburgh

5:00  “Thermomechanical Finite Element Techniques in Multilayer Ceramic Package Design.
                     Adam Schubring, Kyocera America

5:30   Dinner

6:00   “Architectural Design and Considerations for 3D Chips.
                      Dr. Jun Yang, University of Pittsburgh

6:30  “Take Control of Your Sputtering Process.”
                     Jason Hrebik, Angstrom Sciences

7:00  
Wrap-up, future events, future chapter leadership.

7:15  
Optional Tour of the MEMS Laboratories
 
                   Kevin Chen, University of Pittsburgh  


Registration:

RSVP before Friday, June 26 at 5pm EDT
Cost: IMAPS members - $ 15.00.  Non-members - $ 25.00.  Students – $ 5.00

On-line registration has closed

Event Location:

University of Pittsburgh
Benedum Hall, Room 360
3700 O’Hara Street
O'Hara Street Parking Garage (labeled as P)
Directions and Campus Map





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Phone: 202-548-4001