Event Focus:
The objective of the 3D and Conformable Printed Electronic Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics and additive manufacturing as emerging electronic packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
Wednesday, February 22nd
Registration: 7:00 am - 6:30 pm
Continental Breakfast: 7:00 am - 8:00 am
University Student Posters: 12:00 pm - 6:30 pm
Poster Judging at 5:45 pm
Opening Remarks: 8:00 am - 8:30 am
Technical Co-Chair: Dr. Kenneth Church, nScrypt, Inc.
Direct Print Additive Manufacturing as an Alternative for 3D Electronic Packaging
Morning Session:
8:30 am - 12:00 pm
CNT Materials for Printed Electronic Packaging and Printed Flexible Electronics
Wu-Sheng Shih, Liyong Diao, Brewer Science Inc.
Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
Richard Plourde, Mike O'Reilly, Ken Vartanian, Optomec, Inc.; Jeff Leal, Suzette Pangrle, Vertical Circuits, Inc., Vertical Circuits, Inc.
Innovative Process Inspection Tools for Jetted Additive Fabrication Systems
Yair Kipman, ImageXpert, Inc.
Break: 10:00 am - 10:30 am
Screen Printed Circuit Structures on Fabric for Electrical Characterization
Kate Duncan, US ARMY CERDEC; Derek Morris, STCD CERDEC; Larry Holmes, Jared Gardner, WMRD ARL
All-Fiber Electronics by Nanoscale Integration of Inorganics in Textiles
Jesse S. Jur, North Carolina State University
Novel Materials and Devices for Flexible Electronics
Manuel A. Quevedo-Lopez, University of Texas at Dallas
High School Activities: 9:00 am - 2:15 pm
Lunch with attendees: 12:00 pm - 1:30 pm
Welcome by General Chair: 12:00 pm - 12:15 pm
C. Mike Newton, 3D Monolithix & IMAPS VP of Technology
Buffet Lunch: 12:00 pm - 1:30 pm
Afternoon Session
2:15 pm - 5:15 pm
Keynote Speaker: 1:30 pm - 2:15 pm
Why Invest in 3D Manufacturing
“The Role of the Modern University in the 21st Century Global UrbanEenvironment”
Dr. Richard T. Schoephoerster, University of Texas at El Paso (UTEP)
Dean of the College of Engineering
Dr. Richard Schoephoerster has been Dean of the College of Engineering at the University of Texas at El Paso (UTEP) since 2007, where he leads a College of over 80 faculty members in 24 different BS, MS, and PhD degree programs. In his first four years at the College, the student population has grown by 25% (from 2500 to over 3000 students, include over 500 graduate students), and the annual research expenditures for the College have doubled from approximately $7.5 million to over $15 million.
Dr. Schoephoerster maintains an active research program in the area of biofluid mechanics and cardiovascular devices, with a major focus on cardiac applications. He has over 100 journal publications and presentations of his research at regional, national, and international conferences. His research interests run from the basic (role of mechanics on cardiovascular disease development) to the applied (development of novel cardiovascular devices). He has received over $2 million as PI and Co-PI on research project funding from the National Institutes of Health, the American Heart Association, the National Research Council, and the biomedical industry. In 2008 he was elected a Fellow of the American Institute of Medical and Biological Engineering, and in 2011 he was elected a Fellow of the American Heart Association. In 2010 he served as PI on a $9M Texas Emerging Technology Fund program, in partnership with Lockheed Martin Aeronautics and the UT System, to establish the Structural and Printed Emerging-technologies Center (SPEC). He is currently leading efforts to develop doctoral programs in biomedical and manufacturing engineering at UTEP.
Advantages of Fused Deposition Modeling for Structural Electronics Integration Demonstrated in a Circuit for a Space Application
Rudy Salas, Cassie Gutierrez, Dan Muse, Eric MacDonald, Ryan Wicker, The University of Texas at El Paso; Mike Newton, Ken Church, nScrypt, Inc.; Brian Zufelt, COSMIAC
Technology in the CIA - From the Impossible to the Indispensable
John Cork, Central Intelligence Agency
Break: 3:15 pm - 3:45 pm
High Frequency 3D Simulation for High Frequency 3D Printed Electronics
Wade Smith, ANSYS, Inc.
High-Volume Additive Manufacturing of Highly-Miniaturized Metal Devices
Adam Cohen, innoNovo LLC
Microwaves in 3D Printed Electronics
Paul Deffenbaugh, UTEP
Reception: 5:15 pm - 6:30 pm
University Student Poster Judging: 5:45 pm - 6:30 pm
Dinner: On your own
Thursday, February 23rd
Registration: 7:00 am - 3:45 pm
Continental Breakfast: 7:00 am - 8:00 am
Opening Remarks: 8:00 am - 8:30 am
Technical Chair: Dr. Jeremy Palmer, Sandia National Labs
Monolithic Smart Structures at the Nexus of Conformal Electronics and 3D Hyperintegration
Morning Session
8:30 am - 11:30 pm
RF Circuit Design for Inkjet Printing
Janne Jalo, Hannu Sillanpää, Vesa Pynttäri, Riku Mäkinen, Tampere University of Technology
An Electrically-Small, 3-D Cube Antenna Fabricated with Additive Manufacturing
Ibrahim T. Nassar, Thomas M. Weller, University of South Florida
Printed Electromagnetic Structures and the All-Dielectric Revolution
Raymond C. Rumpf, University of Texas at El Paso
Break: 10:00 am - 10:30 am
Unmanned Aerial Vehicle Wing Fabrication: Conformal Integrated Electronics using Additive Processes
Eric MacDonald, Rudy Salas, Dan Muse, Ryan Wicker, Cassie Dennise Gutierrez, The University of Texas at El Paso; Mike Newton, Ken Church, nScrypt, Inc.
Developments in Printed Electronics
Stan Farnsworth, Novacentrix
Buffet Lunch: 11:30 am - 12:30 pm
Afternoon Session
12:40 pm - 3:45 pm
UTEP Keck Center Tour: 12:40 pm - 1:55 pm
Structural Printed Electronics Center
Keynote Speaker: 2:00 pm - 2:45 pm
CubeSAT Electronic Packaging Challenges
Dr. James C. Lyke, USAF AFMC AFRL/RVSE
Technical Advisor, Space Electronics Branch, Space Vehicles Directorate
Dr. James (Jim) Lyke is technical advisor to the Air Force Research Laboratory's Space Electronics Branch (Space Vehicles Directorate) and an AFRL Fellow. Jim has lead over one hundred in-house and contract research efforts involving advanced packaging, radiation-hardened circuits, and scalable, reconfigurable architectures for computing and communications, with recent emphasis on rapid formation of complex systems ("plug-and-play"). He has authored over 90 publications, four receiving best paper awards and has been awarded eleven US patents. He is a senior member of IEEE and associate fellow of AIAA. His BSEE is from the University of Tennessee, MSEE from the Air Force Institute of Technology, and PhD from the University of New Mexico.
Panel Discussion - Global Printed Electronics & Trends
2:45 pm - 3:45 pm
Moderators:
Dr. Kenneth Church, nScrypt, Inc. & Dr. Jeremy Palmer, Sandia National Labs
University Student Poster Winners (winners selected on February 22nd)
Closing Remarks: 3:45 pm
Registration Information:(Early Registration Deadline: January 27, 2012)
Member, Non-member, Speaker/Chair, Student and Chapter Officer registration
fees include: access to all technical sessions, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event.
Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.
Type |
Early Fee
Through 1/27/12 |
Advance/Onsite Fee
After 1/27/12 |
| IMAPS Member |
$525 |
$625 |
| Non-Member |
$625 |
$725 |
| Speaker |
$325 |
$425 |
| Chair |
$325 |
$425 |
| Student |
$125 |
$150 |
| Chapter Officer |
$325 |
$425 |
| Premier Sponsorship (Includes Tabletop) |
$1200 |
$1200 |
| Event Sponsorship (Tabletop not included) |
$500 |
$500 |
