RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Tuesday, September 16
IMAPS SoCal Golf Tournament the morning of September 16, 2008
Registration: 1:00 pm – 8:00 pm
Opening Remarks/Welcome: 2:00 pm – 2:15 pm
Session 1: RF/MW Packaging Assembly
Chairs: Mumtaz Yusuf Bora, Kyocera Wireless Corporation; Sean Cahill, BridgeWave
2:15 pm – 5:15 pm
Lead Free SMT Assembly Qualification for Stack MicroVia Boards
Mumtaz Yusuf Bora, Kyocera Wireless Corporation
Automated Assembly of Millimeter Wave Components
Sam Sadri, Dick Brunsell, Don Hayashigawa, NxGen Electronics, Inc.
Super-Sockets: Integration of Technology from Test Board into Socket Assembly
Tom Bresnan, R & D Circuits, Inc.; Darren Young, Anestel Corporation
Break: 3:45 pm – 4:15 pm
Reliability of Lead-Free and Tin-Lead Solders for PBGA Assemblies
Reza Ghaffarian, Jet Propulsion Laboratory-NASA-CIT
Polymeric Microelectromechanical Millimeter-Wave Systems
Yiin-Kuen Fuh, Firas Sammoura, Liwei Lin, University of California, Berkeley
Welcome Reception: 6:00 pm – 8:00 pm
Live entertainment provided by: Comedy Incorporated.
Comedy Incorporated is a group of professional comedians who provide clean, high quality comedy shows and humorous speakers for corporate meetings and functions, charity benefits, and other events.
Customer testimonials:
“Thanks for the show you put on at the Comedy Store to benefit Leukemia and Lymphoma’s Team in Training. We were worried about comedians being too “blue” but you delivered a clean, quality night of entertainment that had everyone laughing.”
– Keith Turner, Executive Director,
Leukemia and Lymphoma Society
Wednesday, September 17
Registration: 7:00 am – 5:00 pm
Continental Breakfast: 7:00 am – 8:00 am
Keynote Presentation: 8:00 am – 8:45 am
Title: RF/Microwave in Military Electronics
Speaker: James Cook, Plexus
Session 2: RF/Microwave Ceramic Packaging
Chairs; Jerry Aguirre, Kyocera America Inc.; Ed Graddy, Ferro Corporation
8:45 am – 12:30 pm
Ceramic Systems in Package for RF and Microwave
Thomas Bartnitzek, VIA Electronic GmbH; Bernhard Schönlinner, EADS Innovation Works; Joachim Janes, Fraunhofer ISIT; Hermann Schumacher, Tatyana Purtova, University of Ulm; Anders Rydberg, Shi Cheng, University of Uppsala; Tauno Vähä-Heikkilä, VTT Espoo
Full-Wave EM Characterization of LTCC Laminate Waveguides for mm-Wave Applications
Jerry Aguirre, Paul Garland, James Lechiara, John Hatakeyama, Kyocera America Inc.
Microwave Packages
Jerry Carter, StratEdge
Break: 10:15 am – 10:30 am
Enhanced High Frequency LTCC for RF and Microwave Packaging
Ed Graddy, Jim Henry, Bob Gardner, Ed Stadnicar, Aziz Shaikh, Ferro Corporation
Electromagnetic Bandgap Structure Integrated within an LTCC Package For Millimeterwave Parasitic Mode Suppression
William E. McKinzie III, WEMTEC, Inc.
Thermomechanical Finite Element Techniques in LTCC Package Design
Mark Eblen, Kyocera America, Inc.
Leadless Ceramic SMT Substrates and Packages from DC to 30GHz
Nahum Rapoport, Remtec, Inc.
Lunch 12:30 pm – 1:30 pm
Session 3: RF/Microwave Plastic Packaging
Chairs: Mike Zimmerman, Quantum Leap Packaging, Inc.; John Roman, RJR Polymers Inc.
1:30 pm – 5:00 pm
Organic RF Air Cavity Semiconductor Packages
Martin Hart, Mirror Semiconductor, Inc.
Low-Cost High-Bandwidth Millimeter Wave Leadframe Package
Eric A. Sanjuan, Sean S. Cahill, BridgeWave Communications, Inc.
Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
Mark McGrath, Anh-Vu Pham, UC Davis
Break: 3:00 pm – 3:30 pm
High Frequency Packaging of RF Devices
Mike Zimmerman, Chris Lee, Quantum Leap Packaging, Inc.
Liquid Crystal Polymer Packages for Microwave Applications
John W. Roman, RJR Polymers Inc.
An Innovative Multilayer QFN
Charles W. C. Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, Jerry Tan, Bridge Semiconductor Corporation
Thursday, September 18
Registration: 7:00 am – 3:30 pm
Continental Breakfast: 7:00 am – 8:00 am
Keynote Presentation: 8:00 am – 8:45 am
Title: Venture Capital
Speaker: Robert Conn, Enterprise Partners VC
Session 4: RF/Microwave Packaging Design and Simulation
Chairs: Patty Chang-Chien, Northrop Grumman Space Technology; Moshe Gat, Avago Technologies
8:45 am – 12:00 pm
Low Cost Active Phased Array Transceiver for WPAN Application
Alberto Milano, Stacy Joseph, Beam Networks Ltd.
Millimeter-Wave Subsystem Packaging for Low Cost and High Volume
Edward B. Stoneham, Endwave Corporation
High-Efficiency Class-F Amplifier Design with Stacked Stab Structure in Multi-layer Package
Michio Yokoyama, Atsushi Hiraoka, Yamagata University
Break: 10:15 am – 10:30 am
Electrical Performance of Air Core Copper Rectangular Coaxial Line Based Devices
Bill Bulat, Ezekiel Kruglick, ANSYS, Inc.
3D Wafer-Scale Integration for RF and Digital Applications
Patty Chang-Chien, A. Gutierrez-Aitken, K. Tornquist, D. Scott, J. Zhou, P. Nam, C. Geiger, M. Parlee, B. Poust, R. Sandhu, Northrop Grumman Space Technology
MicroCap, WLCSP for RF Filters
Moshe Gat, Avago Technologies
Lunch: 12:00 pm – 1:00 pm
Session 5: Other Aspects in RF/Microwave Packaging
Chairs: Mark Eblen, Kyocera America, Inc.; Franklin Kim, Kyocera America, Inc.
1:00 pm – 3:30 pm
Millimeter-wave Radio System In A Package
Rick Sturdivant, Microwave Packaging Technology
RF Package Thermal Contact Resistance Contribution During CW Operation
Mark Eblen, Larry Chatfield, Kyocera America, Inc.
Use of Cu Heat Spreader for Improved Thermal Spreading
Larry Chatfield, Mark Eblen, Kyocera America, Inc.
Development of High Thermal Conductivity BeO Substrates
Lee Vandermark, Brush Ceramic Products
Study of CuW and CuMo Heat Sinks in Cryogenics Conditions
Zach Wu, Danny Zhu, Jiangsu Dingqi; Ken Kuang, Torrey Hills Technologies, LLC
Closing Remarks: 3:30 pm
Register On-line
Registration Information:(Early Registration Deadline: August 22, 2008)
Member, Non-member, Speaker/Chair, Student and Chapter Officer registration
fees include: access to all technical
sessions, meals, receptions, refreshment
breaks,
an Abstract
Book and one
(1) CD-Rom of the presentations.
Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.
Type |
Early Fee
Through 8/22/08 |
Advance/Onsite Fee
After 8/22/08 |
| IMAPS Member |
$500 |
$600 |
| Non-Member |
$600 |
$700 |
| Speaker |
$375 |
$475 |
| Chair |
$375 |
$475 |
| Student |
$200 |
$300 |
| Chapter Officer |
$375 |
$475 |
Register On-line
