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Advanced Technology Workshop on
RF and Microwave Packaging

September 16-18, 2008
The Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108-2810

IMAPS SoCal Golf Tournament the morning of September 16, 2008


Early Registration and Hotel Deadlines: August 22, 2008

Organizing Committee:

General Chair
Ken Kuang
Torrey Hills technologies, LLC
kkuang@torreyhillstech.com

Technical Co-Chair:
Franklin Kim
Kyocera America, Inc.
franklin.kim@kyocera.com

Technical Co-Chair:
Sean Cahill
BridgeWave
SeanC@Bridgewave.com

Advisory Committee(alphabetical order):

Steve Adamson, Asymtek, Inc.
Mumtaz Bora, Kyocera Wireless Corporation
Ron Barnett, GeoMat Insights
Carl Edwards, Space Micro, Inc.
Mark Eblen, Kyocera America, Inc. 
Aicha Elshabini, University of Idaho
Murat Goksel, Space Micro, Inc.
Bill Ishii, Torrey Hills Technologies, LLC

Guosheng Jiang, China Central South University
Wally Johnson , Coorstek, Inc.
Ho Young Kim, General Optechs
Iris Labadie, Kyocera America, Inc.
Lee Levine, IMAPS VP of Technology
Junkun Ma, Southeastern Louisiana University
Tricia McGough, Norstar Group
Walt Napoleon, KL Marketing

David Shields, Component Surfaces, Inc.
Ron Thiel, retired
Mark Tomei, Kyocera America, Inc.
David Virissimo, SPM
Ziliang Wang, Nanjing Electronics Device Institute
David Zhang, GTSI Corporation
Danny Zhu, Jiangsu Dingqi Sci. & Tech. Co. Ltd



RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.


Tuesday, September 16

IMAPS SoCal Golf Tournament the morning of September 16, 2008

Registration: 1:00 pm – 8:00 pm
Opening Remarks/Welcome: 2:00 pm – 2:15 pm

Session 1: RF/MW Packaging Assembly
Chairs: Mumtaz Yusuf Bora, Kyocera Wireless Corporation; Sean Cahill, BridgeWave
2:15 pm – 5:15 pm

Lead Free SMT Assembly Qualification for Stack MicroVia Boards
Mumtaz Yusuf Bora, Kyocera Wireless Corporation

Automated Assembly of Millimeter Wave Components
Sam Sadri, Dick Brunsell, Don Hayashigawa, NxGen Electronics, Inc.

Super-Sockets: Integration of Technology from Test Board into Socket Assembly
Tom Bresnan, R & D Circuits, Inc.; Darren Young, Anestel Corporation

Break: 3:45 pm – 4:15 pm

Reliability of Lead-Free and Tin-Lead Solders for PBGA Assemblies
Reza Ghaffarian, Jet Propulsion Laboratory-NASA-CIT

Polymeric Microelectromechanical Millimeter-Wave Systems
Yiin-Kuen Fuh, Firas Sammoura, Liwei Lin, University of California, Berkeley

Welcome Reception: 6:00 pm – 8:00 pm
Live entertainment provided by: Comedy Incorporated.

Comedy Incorporated is a group of professional comedians who provide clean, high quality comedy shows and humorous speakers for corporate meetings and functions, charity benefits, and other events.

Customer testimonials:
“Thanks for the show you put on at the Comedy Store to benefit Leukemia and Lymphoma’s Team in Training. We were worried about comedians being too “blue” but you delivered a clean, quality night of entertainment that had everyone laughing.”

– Keith Turner, Executive Director,
Leukemia and Lymphoma Society

Wednesday, September 17

Registration: 7:00 am – 5:00 pm
Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
Title: RF/Microwave in Military Electronics
Speaker: James Cook, Plexus

Session 2: RF/Microwave Ceramic Packaging
Chairs; Jerry Aguirre, Kyocera America Inc.; Ed Graddy, Ferro Corporation
8:45 am – 12:30 pm

Ceramic Systems in Package for RF and Microwave
Thomas Bartnitzek, VIA Electronic GmbH; Bernhard Schönlinner, EADS Innovation Works; Joachim Janes, Fraunhofer ISIT; Hermann Schumacher, Tatyana Purtova, University of Ulm; Anders Rydberg, Shi Cheng, University of Uppsala; Tauno Vähä-Heikkilä, VTT Espoo

Full-Wave EM Characterization of LTCC Laminate Waveguides for mm-Wave Applications
Jerry Aguirre, Paul Garland, James Lechiara, John Hatakeyama, Kyocera America Inc.

Microwave Packages
Jerry Carter, StratEdge

Break: 10:15 am – 10:30 am

Enhanced High Frequency LTCC for RF and Microwave Packaging
Ed Graddy, Jim Henry, Bob Gardner, Ed Stadnicar, Aziz Shaikh, Ferro Corporation

Electromagnetic Bandgap Structure Integrated within an LTCC Package For Millimeterwave Parasitic Mode Suppression
William E. McKinzie III, WEMTEC, Inc.

Thermomechanical Finite Element Techniques in LTCC Package Design
Mark Eblen, Kyocera America, Inc.

Leadless Ceramic SMT Substrates and Packages from DC to 30GHz
Nahum Rapoport, Remtec, Inc.

Lunch 12:30 pm – 1:30 pm

Session 3: RF/Microwave Plastic Packaging
Chairs: Mike Zimmerman, Quantum Leap Packaging, Inc.; John Roman, RJR Polymers Inc.
1:30 pm – 5:00 pm

Organic RF Air Cavity Semiconductor Packages
Martin Hart, Mirror Semiconductor, Inc.

Low-Cost High-Bandwidth Millimeter Wave Leadframe Package
Eric A. Sanjuan, Sean S. Cahill, BridgeWave Communications, Inc.

Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
Mark McGrath, Anh-Vu Pham, UC Davis

Break: 3:00 pm – 3:30 pm

High Frequency Packaging of RF Devices
Mike Zimmerman, Chris Lee, Quantum Leap Packaging, Inc.

Liquid Crystal Polymer Packages for Microwave Applications
John W. Roman, RJR Polymers Inc.

An Innovative Multilayer QFN
Charles W. C. Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, Jerry Tan, Bridge Semiconductor Corporation

Thursday, September 18

Registration: 7:00 am – 3:30 pm
Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
Title: Venture Capital
Speaker: Robert Conn, Enterprise Partners VC

Session 4: RF/Microwave Packaging Design and Simulation
Chairs: Patty Chang-Chien, Northrop Grumman Space Technology; Moshe Gat, Avago Technologies
8:45 am – 12:00 pm

Low Cost Active Phased Array Transceiver for WPAN Application
Alberto Milano, Stacy Joseph, Beam Networks Ltd.

Millimeter-Wave Subsystem Packaging for Low Cost and High Volume
Edward B. Stoneham, Endwave Corporation

High-Efficiency Class-F Amplifier Design with Stacked Stab Structure in Multi-layer Package
Michio Yokoyama, Atsushi Hiraoka, Yamagata University

Break: 10:15 am – 10:30 am

Electrical Performance of Air Core Copper Rectangular Coaxial Line Based Devices
Bill Bulat, Ezekiel Kruglick, ANSYS, Inc.

3D Wafer-Scale Integration for RF and Digital Applications
Patty Chang-Chien, A. Gutierrez-Aitken, K. Tornquist, D. Scott, J. Zhou, P. Nam, C. Geiger, M. Parlee, B. Poust, R. Sandhu, Northrop Grumman Space Technology

MicroCap, WLCSP for RF Filters
Moshe Gat, Avago Technologies

Lunch: 12:00 pm – 1:00 pm

Session 5: Other Aspects in RF/Microwave Packaging
Chairs: Mark Eblen, Kyocera America, Inc.; Franklin Kim, Kyocera America, Inc.
1:00 pm – 3:30 pm

Millimeter-wave Radio System In A Package
Rick Sturdivant, Microwave Packaging Technology

RF Package Thermal Contact Resistance Contribution During CW Operation
Mark Eblen, Larry Chatfield, Kyocera America, Inc.

Use of Cu Heat Spreader for Improved Thermal Spreading
Larry Chatfield, Mark Eblen, Kyocera America, Inc.

Development of High Thermal Conductivity BeO Substrates
Lee Vandermark, Brush Ceramic Products

Study of CuW and CuMo Heat Sinks in Cryogenics Conditions
Zach Wu, Danny Zhu, Jiangsu Dingqi; Ken Kuang, Torrey Hills Technologies, LLC

Closing Remarks: 3:30 pm


Register On-line


Registration Information:(Early Registration Deadline: August 22, 2008)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

Type
Early Fee
Through 8/22/08
Advance/Onsite Fee
After 8/22/08
IMAPS Member
$500
$600
Non-Member
$600
$700
Speaker
$375
$475
Chair
$375
$475
Student
$200
$300
Chapter Officer
$375
$475

Register On-line



Speaker Dates/Information:

  • Extended Abstract or Presentation Material due: August 8, 2008
  • Early Registration and Hotel Deadlines: August 22, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: September 18, 2008
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations: (Hotel Deadline: August 22, 2008)
Reservation must be made directly with the:

Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108

Phone: 800-882-0858.
www.cp-sandiego.com

$131 Single/Double

Please reference International Microelectronics And Packaging Society when making reservations by phone.

 


Corporate Sponsors:

Corporate Sponsor - Brush Ceramic Products

Corporate Sponsor - Teledyne Microelectronics

Corporate Sponsor - Torrey Hills Technologies, LLC


Golf Sponsors:

Golf Sponsor - Accu-Tech Laser Processing

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001