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Advanced Technology Workshop and Tabletop Exhibition on
RF and Microwave Packaging

February 7-8, 2012
The Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108-2810

Early Registration & Hotel Deadlines: January 15, 2012

Organizing Committee:

General Chair
Ken Kuang
Torrey Hills Technologies, LLC
General Co-Chair
Susan Trulli
Raytheon RF Components

Technical Co-Chair:
Michel de Langen
NXP Semiconductors

Technical Co-Chair:
Sean Cahill
BridgeWave Communications

Advisory Committee:

Ron Barnett, National Instruments
Carl Edwards, Space Micro, Inc.
Aicha Elshabini, University of Idaho
Bill Ishii, Torrey Hills Technologies, LLC
Wally Johnson, Coorstek, Inc.
Iris Labadie, Kyocera America, Inc.
Charles Lin, Bridge Semiconductor, Taiwan
Walt Napoleon, KL Marketing

David Shields, Component Surfaces, Inc.
Ziliang Wang, Nanjing Electronics Device Institute
Mumtaz Bora, Peregrine Semiconductor
Kai Cheng, Nanjing Guosheng Electronics

Mark Eblen, Kyocera America
Guosheng Jiang, China Central South Univ.
Mark Tomei, Kyocera America, Inc.
David Virissimo, SPM
Danny Zhu, Jiangsu Dingqi Sci. & Tech. Co. Ltd

RF and Microwave Packaging Workshop Focus:

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Tuesday, February 7, 2012

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Hours: 10:00 am - 2:00 pm & 3:30 pm - 6:30 pm

Opening Remarks: 8:00 am - 8:15 am

Keynote Presentation: 8:15 am - 9:00 am
Dr. Renzhe Zhao, Chief Specialist of Electronics Material, Huawei Technologies

Dr. Renzhe Zhao

Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Bio: Dr. Renzhe Zhao received his B.S. and M.S. degrees from Tianjin University, China, in 1990 and 1995 respectively, and M.S. and Ph.D. degrees from Auburn University, Auburn AL, in 2000 and 2002 respectively. His research at Auburn focused on flip chip assembly with fluxing underfills and with wafer applied underfills. From 2002 to 2009, he was employed by Henkel Corporation in Irvine, CA, where he worked with materials and processes for electronics assembly, specifically underfill, die attach, and molding compound for electronics packaging applications. He joined InvenLux Corporation as Manager of LED Packaging in 2010. He was responsible for LED packaging development and manufacturing. He is working in Huawei Technologies, as Chief Specialist of Electronics Material from Sept. 2010, where he is in charge of material's selection and reliability. Dr. Zhao is a member of IEEE and IMAPS. He is the recipient of The Charles Hutchins Educational Grant from SMTA. He was the columnist of Materials world for Circuits Assembly from 2007 to 2009.

Session 1: Advanced Materials and Interconnect Solutions for RF Packaging
Chair: Susan Trulli, Raytheon RF Components
9:00 am - 12:30 pm

VHF & UHF energy harvesting radio system physical and MAC layer considerations
Xiaohu Zhang, Qualcomm, Inc.; William B. Kuhn, Kansas State University

RF Packaging: Challenges and New Approaches to Achieve Optimal Performance and Cost
Fernando Roa, Amkor Technology 

Break in Exhibit Hall: 10:00 am - 10:30 am

Millimeter Wave Characterization of DuPont (TM) GreenTape (TM) 9K5 LTCC System in 40 to 110 GHz Frequency Range
Deepukumar Nair, K. M. Nair, M. F. McCombs, J. M. Parisi, Michael Smith, Elizabeth Hughes, Tony Orzel, Brad Thrasher, Scott E. Gordon, DuPont

PolyStrata (R): Finally, Microwaves Get Wired
Steve Huettner, Donald Wu, Nuvotronics LLC 

3D Stacked Die SIP Packaging for High Performance Cost Sensitive Applications
Marc Robinson, Jeff Leal, Suzette Pangrle, Vertical Circuits, Inc.

New Developments in Die Attach Film Adhesive for RF and MW Application
Kevin Chung, Fred Lo, AI Technology, Inc.

Lunch in Exhibit Hall: 12:30 pm - 1:30 pm

Session 2: Design and Simulation
Chair: Martin Goetz, Northrop Grumman Corporation
2:00 pm - 3:30 pm

RF/Microwave Packaging Trend and Thermal Challenges
Qian "Angel" Han, Huawei Technologies

Enhancing Overall System Functionality and Performance with the Right Packaging Solution
Nozad Karim, Amkor Technology

Chip in Package on Board Simulations for Balanced RF Power Amplifier Design
Marshall Loewenstein, Tony Donisi, ANSYS, Inc.

Coffee Break in Exhibit Hall: 3:30 pm - 4:00 pm

Session 3: RF Packaging Process and Reliability
Chair: Michel de Langen, NXP Semiconductors
4:00 pm - 6:00 pm

NiPdGold Plating Qualification of QFN RF-IC Packages
Mumtaz Y. Bora, Peregrine Semiconductor

Wedge Bonding for RF and Microwave Devices
Lee Levine, Joseph S. Bubel, Hesse & Knipps, Inc.

PCB Creep Corrosion and Board Design Considerations
Jingqiang He, Huawei Technologies

A Low Cost Sniff Testing Method for RF/MW Products
Hakan P. Partal, Syracuse University & Yildiz Technical University

Wednesday, February 8, 2012

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Hours: 10:00 am - 2:00 pm & 4:00 pm - 6:00 pm

Keynote Presentation: 8:15 am - 9:00 am
Sean Cahill, VP, Technology, BridgeWave Communications, Inc.

Sean Cahill

He will share how to leverage government programs to develop new packaging technology.

Bio: Sean Cahill is VP Technology at BridgeWave Communications, where he is working on next generation millimeter-wave systems. Sean earned his MSEE/Solid State Physics from UC Santa Barbara where he fabricated some of the first surface micromachined MOEMS (Micro-opto-electro-mechanical systems). His undergraduate work culminated in dual BS degrees in ECE/Signals and Systems and Biochemistry/Biophysics from UC Davis. Over his nearly 30 years in industry, Sean has led research and product development efforts focused on micro-fabrication technologies at numerous companies including Exxon Research, NovaSensor, Stanford Research Institute, Teknekron Sensor Development, and Maxim Integrated Products. Sean has served in consulting, advisory, and board member capacities at several Silicon Valley MEMS companies. Sean holds 23 US Patents for micromachined devices addressing many industries including automotive, process control, semiconductor, medical, and communications fields. His released products include a catalytic gas sensor microheater for GasTech; a high-sensitivity capacitive pressure sensor for Omron; scanning force microscope probes with sharpest tips available (Science, 260, pp.1451) for Tencor, and inertial measurement sensors for several companies. He is founder and co-chair of MEPTEC MEMS Symposium, which is now in its 10th year, editor of a book on microelectronics packaging (ISBN 978-1-4419-0983-1) and has been a Principle Investigator on multiple government research and development grants across multiple agencies.

Session 4: Thermal Management
Chair: Dr. Qian "Angel" Han, Huawei Technologies
9:00 am - 11:00 am

Functional Fillers Add Versatility to Silicone Elastomer Systems in Extreme Environments
Michelle Velderrain, Vincent Malave, NuSil Technology, Inc.

Thermal Pyrolytic Graphite Composite with Coefficient of Thermal Expansion Matching for Thermal Management in RF Electronics
Wei Fan, Xiang Liu, John Mariner, Momentive Performance Materials Inc.

Break in Exhibit Hall: 10:00 am - 10:30 am

A Quantitive Oil Bleeding Evaluation Method for Thermal Conductive Gap Pads in Telecom Industry
J. Q. Zhao, J. B. Shen, W. T. Wan, K. Bruzda, Laird Technologies, Thermal BU; Y. Xu, R. Zhao, HuaWei Technologies

Session 5: Academic Research
Chair: Casey Krawiec, Gel-Pak/Quik-Pak
11:00 am - 3:00 pm

Thermal Characterization and Modeling for System on Chip Packages
Justin Deguzman, James Gilstrap, Brian Fang, Jianbiao Pan, California Polytechnic State University

Reliability Analysis of Low-Silver BGA Solder Joints using Four Different Failure Criteria
Erin Kimura, California Polytechnic State University

Lunch & General Presentation in Exhibit Hall: 12:00 pm - 1:00 pm

Artificial Photosynthesis - "Turn Plant Power to Power Plant"
Ke Sun, Deli Wang, University of California, San Diego

Interactive Session with Premier Sponsors in Exhibit Hall: 1:00 pm - 2:00 pm

Premier Sponsors:

Palomar Technologies - Premier Sponsor
ANSYS - Premier Sponsor

Session 5: Academic Research - Continued
Chair: Casey Krawiec, Gel-Pak/Quik-Pak

High Frequency Signal Propagation in Through Silicon Vias
Srinidhi Raghavan Narasimhan, A. Ege Engin, San Diego State University

Printed Impedance Elements by Micro-Dispensing
Ubaldo Robles, Harvey Tsang, Paul Deffenbaugh, Raymond C. Rumpf, University of Texas at El Paso

Virtual Ground Fence for Power Filtering on IC Packages and Printed Circuit Boards
Jesse Bowman, A. Ege Engin, San Diego State University

Reception & Student Award Ceremony in Exhibit Hall: 4:00 pm - 6:00 pm

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at a total of $1,500 in awards checks at the ATW/Conference. The selected student(s) must attend the event to present his or her work and receive the award.

In addition, the RF/Microwave Workshop was selected by the Foundation as a 2012 "Regional Contest" site. The Foundation is awarding 3 students with the "best presentations" of the workshop: $750 (1st place), $500 (2nd), and $250 (3rd). The first place winner will also be invited to submit their paper for IMAPS Annual Symposium - IMAPS 2012 in San Diego. The Foundation will cover the first place regional contest winner's travel to symposium as well as registration fees to allow them to compete at our annual Symposium for the higher society Awards. We are opening this first regional contest to ALL Southern California Universities.

The Microelectronics Foundation

Registration Information:(Early Registration Deadline: January 15, 2012)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 1/15/12
Advance/Onsite Fee
After 1/15/12
IMAPS Member
Chapter Officer
Tabletop Exhibit (Member)
Tabletop Exhibit (Non-Member)
Premier Sponsorship (Includes Tabletop)
Event Sponsorship (Tabletop not included)

Speaker Dates/Information:

  • Abstracts Deadline: December 16, 2011
  • Speaker Notifications Sent: January 7, 2011
  • Extended Abstract or Presentation Material due: January 20, 2012
  • Early Registration and Hotel Deadlines: January 15, 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: February 8, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up emailed to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations: (Hotel Deadline: January 15, 2012)
Reservation must be made directly with the:

Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108

Phone: 800-882-0858.

Single/Double: $125/night + Tax

Please reference International Microelectronics And Packaging Society when making reservations by phone.


Premier Sponsors:

Palomar Technologies - Premier Sponsor

ANSYS - Premier Sponsor

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001