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IMAPS & the Southeast Chapters Announce the

1st Southeastern Microelectronics Packaging Conference
January 17, 2012
Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

General Chair:
Doug Bokil
Namark Process Design LLC

Technical Chair:
Thomas Buschor
Harris Corp

Venky Sundaram
Georgia Institute of Technology (PRC)

Student Activities Chair:
Mike Newton
3D Monolithix
Chapters Organizing Committee:
Mike McEntee (Florida), Tim Davis (Florida), Scott Morris (Carolinas)

Early Registration/Hotel Deadline: December 23, 2011

Download Program PDF
Tabletop Exhibition | 2012 Exhibitors
Hotel Reservations | Speaker Deadlines

(Co-located with the Advanced Technology Conference on Non-Hermetic Packaging Technology for Reliable Microelectronics, January 18, 2012 -

The objective of the Southeast Microelectronics Packaging Conference is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging.

Tuesday, January 17, 2012

Registration: 11:00 am - 8:30 pm

Speakers' Luncheon: 12:00 pm - 12:50 pm

Exhibit Opens: 4:30 pm - 8:30 pm

Opening Remarks: 12:50 pm - 1:00 pm
General Chair: Doug Bokil, IMAPS Florida Chapter President
Namark Process Design LLC

Session 1: Packaging Reliability
Chair: Donny Chen, nScrypt, Inc.
1:00 pm - 2:40 pm

Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds
Richard Share, Share Consulting LLC

How Clean is That Surface? How Do You Know?
Robert K. Lowry, Electronic Materials Characterization

Session 2: Thermal Management Solutions
Chair: Jeff Jennings, Harris Corporation
1:00 pm - 2:40 pm

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, Paul W. Barnes, SST International

Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Brian A. English, EngeniusMicro LLC

Reliability Investigation of Various Au-In TLP Bonds
Brian Grummel, University of Central Florida

* Student Paper

Break: 2:40 pm - 2:55 pm (Refreshments & Networking)

Session 3: High Density (3D) Packaging
Chair: Donny Chen, nScrypt, Inc.
3:00 pm - 4:40 pm

Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders 
Terence Collier, Bal Benavidez, Indira Gubeljic, CV Inc.

Advanced Wedge Bonding Capabilities Enable New Package Developments in RF, Microwave, Optoelectronic and Military Devices
Lee Levine, Joseph S. Bubel, Hesse & Knipps, Inc.

Fine Pitch Die-Level Testing Can Accelerate Development of Multi-Die Packaging Technologies Using Die Bonding Equipment 
David Herndon, Suzanne Dunphy, Harris Corporation

Session 4: Advanced Materials & Packaging
Chair: Jeff Jennings, Harris Corporation
3:00 pm - 4:40 pm

NAMICS Materials for Thin & Advanced Packaging Technology 
Ken Araujo, Brian Schmaltz, Abe Yukinari, NAMICS Technologies, Inc.

Monolithic 3D Printed Electronics - The Next Generation Packaging Technology
C. Mike Newton, Dr. Kenneth Church, 3D Monolithix Corp.

Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications
Ali Karbasi, W. Kinzy Jones, Florida International University

* Student Paper

Exhibit Hall & Cash Bar Open - 4:30-8:30pm

Dinner Buffet Open (hot hors d'oeuvres): 5:00 pm - 8:30pm

Keynote Presentation: 5:30 pm - 5:55 pm

Sharon Starr

Industry and Market Trends in the Electronic Interconnect Supply Chain: Findings from IPC Market Research
This presentation looks at sales, market, production and business trends in the industries that make up the electronic interconnect supply chain - from electronic-grade solder, chemicals and laminate to printed circuit boards (PCBs), electronics manufacturing services (EMS), PCB assembly equipment and electronics OEMs. Analysis is based on original current market research conducted by IPC, the global trade association for these industries, combined with analysis of economic trends and forecasts. Both global and regional trends are covered, with an emphasis on North America.

Sharon Starr, Director of Market Research - IPC, Association Connecting Electronics Industries

Sharon Starr is Director of Market Research at IPC, where she directs all IPC market research studies and statistical programs. She is responsible for expanding and globalizing many of these programs since she joined IPC in 2003. She also spearheaded the cooperative data sharing initiatives of the World Electronic Circuits Council (WECC) organizations and chairs the WECC Statistics and Market Committee. She develops IPC's Executive Market & Technology Conferences and facilitates IPC's long-range planning process. Sharon is a regular featured speaker at industry events, including IPC's annual Executive Summit and other IPC conferences.

Previously, she worked at Underwriters Laboratories (UL) for 15 years in various management positions in marketing, strategic planning and business development. While at UL, she was a recipient of a General Manager's award for new product development and won several national communication awards for UL's annual report.

Sharon earned her MBA from Northwestern University's Kellogg Graduate School of Management in 2000 with concentrations in economics, marketing and strategy. Her B.A. is from the University of Wisconsin, Madison.

IMAPS Florida Chapter President's Closing Remarks: 5:55 pm - 6:00 pm

Conference & Exhibit Hall Closed: 8:30 pm


Tabletop Exhibition

Housing: Hotel Cut-off December 23, 2011

Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Discounted IMAPS Room Rates available - view online or call for rates

Speaker Dates/Information:

  • Abstract(s) due to IMAPS: October 24, 2011
  • Speaker Notification/Confirmation emailed: November 11, 2011
  • Extended Abstract or Presentation Material due: December 14, 2011
  • Early Registration/Hotel Deadlines: December 23, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: January 17, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)



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Phone: 202-548-4001