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IMAPS
Advanced Technology Workshop on
Thermal Management for High Performance Computing and
Telecom/Wireless Applications
Sheraton Palo Alto
Palo Alto, CA USA
April 20 & 21, 2001
General Chair:
Dave Saums
Power Devices, Inc. / Loctite Electronics
Technical Program
Chair:
Herman Chu
Brocade Communications Systems, Inc.
Technical Program Co-Chair:
David Copeland
HAL Computer Systems
Friday, April 20
Registration
Opens: Noon – 9:30 pm
Buffet Lunch: Noon – 2:00 pm
Opening
Remarks: 2:00 pm – 2:15 pm
Dave Saums, Power
Devices, Inc. / Loctite Electronics
Technical Overview: 2:15 pm – 2:30 pm
Herman Chu, Brocade
Communications Systems, Inc.
David Copeland, HAL Computer Systems
Session
1: Market Drivers and Economics in Thermal Management
Chair: Dave Saums, Loctite
Electronics
2:30 pm - 5:30 pm
Convergence
and Criticality in Electronics Thermal Management
Dave Saums, Power Devices, Inc./Loctite Electronics
The Big
Picture
Christian Belady, Hewlett-Packard Company
TBA
Geoff Thyrum, Thermacore International, Inc.
Physical
Design Developments for High-Performance Processors
Tom Dolbear, AMD
New Concepts
for EMI/Thermal Convergence in Processor Packaging
Jim Dietz, Incep Technologies, Inc.
Reception/Dinner:
5:30 pm - 7:30 pm
Session
2: Advances in Thermal Solution Design for Computing Systems
I
Chair: Cullen Bash, Hewlett-Packard Laboratories
8:00 pm - 10:30 pm
Alternative
Cooling Systems for High-Density Computing
Chandrakant Patel, Hewlett-Packard Laboratories
Two-Phase
Pumped Liquid Cooling System for Enterprise Computing
Joe Marsala, Marty Pitasi, Thermal Form & Function
Numerical
Evaluation of Normal and Parallel Micro-Channel Cold Plates
Marlin Vogel, Sun Microsystems
Chassis
Design Considerations Using Active Heat Sinks
Guy Wagner, Agilent Technologies, Inc.
EMI and
Thermal Solutions for Multiprocessor Server
David Wang, NCR Corporation
Saturday
April 21
Registration Opens: 7:30 am –
12:15 pm
Breakfast:
7:30 am - 8:30 am
Session
3: Advances in Thermal Materials
Chair: Dave Saums, Power Devices, Inc./Loctite Electronics
8:30 am - 11:30 am
Alternatives
to AlSiC for Thermal Management
Warren Hunt Jr., ThermAluminum Materials LLC/Osprey Metals
Ltd
New Developments
in EMI and Thermal Integration
Farhad Raiszadeh, Incep Technologies Inc.
Enhanced
Thermal Management AlSiC Microprocessor Lids
Mark A. Occhionero, Ceramics Process Systems
CVD Deposited
SiC
Jitendra S. Goella, Rohm and Haas Advanced Materials
Material
Options for Microelectronic and Optoelectronics
Carl H. Zweben, Georgia Institute of Technology
Lunch:
Noon – 1:00 pm
Registration
Re-Opens: 12:45 pm – 10:00 pm
Session
4: Advances in Thermal Solutions for Computing Systems
II
Chair: David Copeland, HAL Computer Systems
1:00 pm - 4:00 pm
Uncertainty
Analysis for Thermal Measurements
Chris Malone, Hewlett-Packard Company
Looking
Beyond Direct Air Cooling for Next-Generation Computing
Systems
Yogendra Joshi, University of Maryland
Active
Heat Sinks Integrated with MicroJets
Raghav Mahalingam, Georgia Institute of Technology
Engineering
Equation Solver
Andy Delano, Agilent Technologies, Inc.
Reducing
Heat Sink EMI Using Unique Capacitive Coupling
Kristy Merquillo, Hewlett-Packard Company
Quasi-3D
Thermal/Fluid Analysis for Packaging
David Johnson, C&R Technologies
Reception/Dinner:
5:30 pm -7:00 pm
Session 5: System-Level Thermal Management
for Telecom/Wireless Applications
Chair: Tom Branchaud, Wakefield Engineering Inc.
7:00 pm – 9:45 pm
Integrating
Thermal and EMI Design in Telecom
D.P. Johns, Flomerics Inc.
Fin and
Vapor Chamber Structures for Communications Applications
Geoff Thyrum, Thermacore, Inc.
AlSiC
Packaging for High-Power Transmitter/Receiver Modules
Dieter Thumfart, Electrovac
IR Imaging
Comparison with FEA for 4mm GaAs IC
John Nagurny, Motorola Corporation
Performance
of Novel Finned Metal Foam Heat Sinks in Forced and Natural
Convection
Roop Mahajan, University of Colorado
Concluding
Remarks: 9:30 pm
Dave
Saums, Power Devices,
Inc. / Loctite Electronics
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