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IMAPS Advanced Technology Workshop on
Thermal Management for High Performance Computing and
Telecom/Wireless Applications

Sheraton Palo Alto
Palo Alto, CA  USA
April 20 & 21, 2001

 

General Chair:
Dave Saums
Power Devices, Inc. / Loctite Electronics

Technical Program Chair:
Herman Chu
Brocade Communications Systems, Inc.

Technical Program Co-Chair:
David Copeland
HAL Computer Systems

 

Friday, April 20

Registration Opens: Noon – 9:30 pm

Buffet Lunch: Noon – 2:00 pm

Opening Remarks: 2:00 pm – 2:15 pm  
Dave Saums,
Power Devices, Inc. / Loctite Electronics

Technical Overview: 2:15 pm – 2:30 pm  
Herman Chu,
Brocade Communications Systems, Inc.  
David Copeland, HAL Computer Systems 

Session 1: Market Drivers and Economics in Thermal Management
Chair: Dave Saums, Loctite Electronics
2:30 pm - 5:30 pm

Convergence and Criticality in Electronics Thermal Management
Dave Saums, Power Devices, Inc./Loctite Electronics

The Big Picture
Christian Belady, Hewlett-Packard Company

TBA
Geoff Thyrum, Thermacore International, Inc.

Physical Design Developments for High-Performance Processors
Tom Dolbear, AMD

New Concepts for EMI/Thermal Convergence in Processor Packaging
Jim Dietz, Incep Technologies, Inc.

Reception/Dinner: 5:30 pm - 7:30 pm

Session 2: Advances in Thermal Solution Design for Computing Systems I
Chair:  Cullen Bash, Hewlett-Packard Laboratories
8:00 pm - 10:30 pm

Alternative Cooling Systems for High-Density Computing
Chandrakant Patel, Hewlett-Packard Laboratories

Two-Phase Pumped Liquid Cooling System for Enterprise Computing
Joe Marsala, Marty Pitasi, Thermal Form & Function

Numerical Evaluation of Normal and Parallel Micro-Channel Cold Plates
Marlin Vogel, Sun Microsystems

Chassis Design Considerations Using Active Heat Sinks
Guy Wagner, Agilent Technologies, Inc.

EMI and Thermal Solutions for Multiprocessor Server
David Wang, NCR Corporation

Saturday April 21

Registration Opens: 7:30 am – 12:15 pm 

Breakfast: 7:30 am - 8:30 am

Session 3: Advances in Thermal Materials
Chair:  Dave Saums, Power Devices, Inc./Loctite Electronics
8:30 am - 11:30 am

Alternatives to AlSiC for Thermal Management
Warren Hunt Jr., ThermAluminum Materials LLC/Osprey Metals Ltd

New Developments in EMI and Thermal Integration
Farhad Raiszadeh, Incep Technologies Inc.

Enhanced Thermal Management AlSiC Microprocessor Lids
Mark A. Occhionero, Ceramics Process Systems

CVD Deposited SiC
Jitendra S. Goella, Rohm and Haas Advanced Materials

Material Options for Microelectronic and Optoelectronics
Carl H. Zweben, Georgia Institute of Technology

Lunch: Noon – 1:00 pm

Registration Re-Opens: 12:45 pm – 10:00 pm

Session 4:  Advances in Thermal Solutions for Computing Systems II
Chair:  David Copeland, HAL Computer Systems
1:00 pm - 4:00 pm

Uncertainty Analysis for Thermal Measurements
Chris Malone, Hewlett-Packard Company

Looking Beyond Direct Air Cooling for Next-Generation Computing Systems
Yogendra Joshi, University of Maryland

Active Heat Sinks Integrated with MicroJets
Raghav Mahalingam, Georgia Institute of Technology

Engineering Equation Solver
Andy Delano, Agilent Technologies, Inc.

Reducing Heat Sink EMI Using Unique Capacitive Coupling
Kristy Merquillo, Hewlett-Packard Company

Quasi-3D Thermal/Fluid Analysis for Packaging
David Johnson, C&R Technologies

Reception/Dinner: 5:30 pm -7:00 pm

Session 5:  System-Level Thermal Management for Telecom/Wireless Applications
Chair:  Tom Branchaud, Wakefield Engineering Inc.
7:00 pm – 9:45 pm

Integrating Thermal and EMI Design in Telecom
D.P. Johns, Flomerics Inc.

Fin and Vapor Chamber Structures for Communications Applications
Geoff Thyrum, Thermacore, Inc.

AlSiC Packaging for High-Power Transmitter/Receiver Modules
Dieter Thumfart, Electrovac

IR Imaging Comparison with FEA for 4mm GaAs IC
John Nagurny, Motorola Corporation

Performance of Novel Finned Metal Foam Heat Sinks in Forced and Natural Convection
Roop Mahajan, University of Colorado

Concluding Remarks: 9:30 pm

Dave Saums, Power Devices, Inc. / Loctite Electronics

 



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Phone: 202-548-4001

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