Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Microelectronics Foundation
Contact Us
IMAPS Advanced Technology Workshop (ATW) on
Thermal Management for High-Performance Computing and Wireless Applications

Immediately following the System Packaging ATW - October 19 -22*
*Visit for more information.

Sheraton Palo Alto Hotel
Palo Alto, CA 94301
October 22 - 24, 2003

General Chair:
Dave Saums, Ceramics Process Systems
P: 978-499-4990

Technical Program Chair:
Herman Chu, Procket Networks
P: 408-635-7872

Sponsored by:
The International Microelectronics And Packaging Society (IMAPS)

Wednesday, October 22

Registration: Noon - 5:30 pm

Buffet Lunch: Noon - 1:30 pm

Session 1: Market Drivers and Economics
Session Chair: Dave Saums, Ceramics Process Systems
1:30 pm - 5:30 pm

Energy: A Key Market Driver in the Future Computing Utility
Chandrakant D. Patel, Hewlett-Packard Laboratories

The Challenges of Providing a Technically-Based Thermal Solution in Today's World Economy
George Meyer, Thermacore International

Global Implications for the Electronics Thermal Management Supply Base: Structuring Engineering and Sales Staff to Work Effectively with Contract Electronic Manufacturers
David L. Saums, Ceramics Process Systems Corporation

Thermal Issues and Trends for ICs in Telcom and Computer Packaging
E. Jan Vardaman, Linda C. Matthew, TechSearch International, Inc.

Break: 3:30 pm - 4 pm

Thermal Challenges in Embedded Cryptographic Coprocessor Devices
Gabriele Campi, Celestica Italia

The Dust Threat
David A. Moore, Hewlett-Packard

Total Power Requirements for Near-Future Refrigerated Systems
David Copeland, Albert Chan, Fujitsu Laboratories of America

Reception: 5:30 pm - 6 pm
Dinner: 6 pm - 7 pm

Session 2: Mobile and Miniaturized Systems
Session Chair: Guy Wagner, RM Laboratories
7 pm - 9:30 pm

PCB Optimization for SO8 and SO8 Exposed Bottom Packages
Dennis Lang, Fairchild Semiconductor

Thermal Analysis of a 3-D Multi-Chip Package for RF Applications
Sridhar Krishnan, Ron Green, Tessera Inc.

Applying Appropriate Thermal Design to Smart Display Development
Jung Eung Park, Ho Chul Ryu, Jin Woo Lee, Wae Yeul Kim, LG Electronics Inc.

Next Generation PC Cooling Fans
Brad Marshall, USM-III

Electro-Kinetic Microchannel Cooling System for High Heat Flux Microprocessors
Girish Upadhya, Peng Zhou, Ken Goodson, Mark Munch, Cooligy Inc.

Thursday, October 23

Registration: 7 am - 9 pm

Continental Breakfast: 7 am - 8 am

Session 3: Refrigeration and Alternative Cooling Systems
Session Chair: John Peeples, KryoTech, Inc.
8 am - noon

Performance and Life Tests of AlSiC-Based Flat Thin Heat Pipe
Xinhe Tang, Ernst Hammel, Walter Findl, Theodor Schmitt, Dieter Thumfardt, Electrovac GmbH

Cooling Microelectronics with Thermal Raceways
Chris G. Macris, Thomas R. Sanderson, Christopher B. Leyerle, Enerdyne Solutions

Thermal Cooling of High Heat Flux Electronics using Delta Engineers High Performance Cold Plate
Nagui Mankaruse, Delta Engineers

Break: 9:30 am - 10 am

Inkjet Assisted Spray Cooling of Electronics
Ratnesh K. Sharma, Cullen Bash, Chandrakant Patel, Hewlett-Packard Company

Hermetic Evaporative Cooling Systems for Microprocessor and Computer Systems
Robert Lashway, Merrill Wilson, Ceramatec Inc.

Capacity Control in Compressor Driven Cooling Systems
G. Kevin Alston, Glacier Bay, Inc.

Liquid Cooling System
Bob Drake, Panasonic Communications Co., Ltd.

Lunch: noon - 1 pm

Session 4: Advances in Solid Materials
Session Chair: David Copeland, Fujitsu Laboratories of America
1:30 pm - 5:30 pm

Lightweight Carbon-Based Thermal Management Materials
Tim (Zhigang) Lin, Rick Yoon, C. T. Tsai, IJ Research, Inc.

High Thermal Conductivity AlN Filled EMC
Cheng-Yu Hsieh, Shih-Liang Liu, Shyan-Lung Chung, National Cheng Kung University

Extending Selective High Thermal Conductivity Orientation in CTE-Compatible Substrate and Package Component Materials
David L. Saums, Mark Occhionero, Ceramics Process Systems Corporation; Jim Connell, Tony Bennington, Aztex Inc.

Effect of Microstructure on the Thermo-Mechanical Properties of Al-SiC Composites: Theoretical and Experimental Studies
Xinyu Huang, Ken Reifsnider, University of Connecticut; Rene Cooper, Robert Roles, Ted Trutnau, Clive Scorey, Ametek

Break: 3:30 pm - 4 pm

High Performance Heat Spreader for High Power Electronic Packages
Jon Zuo, Advanced Cooling Technologies, Inc.

Fabrication of Heat Sinks and Heat Pipes by Metal Injection Molding
John L. Johnson, AMellect, Inc.

Optimization of Discontinuous Pitch Graphite Fiber Reinforced Copper Alloys for Thermal Expansion Matched Thermal Management Applications
James A. Cornie, Metal Matrix Cast Composite, LLC

Reception: 5:30 pm - 6 pm
Dinner: 6 pm - 7 pm

Session 5: Telcom Networking Systems
Session Chair: Bill Maltz, Electronic Cooling Solutions, Inc.
7 pm - 9:30 pm

Optimization of Acoustics, EMI and Airflow in Electronic Enclosures
Susheela Narasimhan, Cisco Systems

Extending Air Cooling as Heat Rejection Methodology
Bret Sleicher, Torrington Research Company

Thermal Design Requirements for Future T/R Module Packaging
Mark Eblen, Andy Piloto, Kyocera America, Inc.

Flexible Thermal Management Circuits Bonded Directly to Aluminum Heat Sinks
Jim Fraivillig, Fraivillig Technologies

Low Temperature Co-Fired Ceramics on Metal (LTCC-M): A Thermal Management Solution for High Power Microwave and LED Array Packaging
Edmar Amaya, Joe Mazzochette, Lamina Ceramics Inc.

Friday, October 24

Registration: 7 am - 9 pm

Continental Breakfast: 7 am - 8 am

Session 6: Advances in Thermal Interface Materials
Session Chair: Herman Chu, Procket Networks
8 am - Noon

The Development of a Solder Based Material Solution for High Power Thermal Transfer Applications
Gary Nicholls, Northrop Grumman Kester

Filling the Market Gap at Thermal Interfaces: Thick Thermal Interface Materials with Low Thermal Resistance
Andrew P. Collins, Chih-Min Cheng, Emerson and Cuming

Thermal Adhesives as Replacements to Mechanical Fasteners in Power Electronics
Gurmeet S. Bhutani, Astec International Inc.

Break: 9:30 am - 10 am

Critical Appraisal of High Thermal Conductivity Epoxies as Alternatives to Solders for Packaging of High Power Devices
Satbir Madra, WJ Communications, Inc.

Thermal Behavior of a Soldered Cu-Si Interface
Timothy P. Weihs, D. Van Heerden, O.M. Knio, Reactive NanoTechnologies, Inc.; D.W. Gailus, Aavid Thermalloy

Solder Connection Materials for Heat Sink Construction
William Avery, Northrop Grumman Kester

Characterization of the Thermal Performance of a Heat Sink Reactively-Soldered to an IC Package
Omar M. Knio, D. Van Heerden, T.P. Weihs, Reactive NanoTechnologies; A.C. Pfahnl, Teradyne Connection Systems

Lunch: Noon - 1 pm

Session 7: Computing Systems
Session Chair: Cullen Bash, Hewlett-Packard Laboratories
1:30 pm - 5 pm

High-Performance Press-On-Fin Heat Sink for IC Cooling
Guy R. Wagner, RM Laboratories

Automatic Optimization of Data Center Spaces with Computational Fluid Dynamics
Byron Blackmore, Flomerics, Inc.

Continuous Fan Speed Monitoring
Andy D. Delano, Hewlett-Packard Company

Break: 3 pm - 3:30 pm

A Passive Solution to Data Center High Temperature Rise Problem
David Wang, NCR Corporation

Thermal Characterization and Optimization of a High Performance Centrifugal Blower Active Heat Sink for Small Form Factor Desktop PC Applications
Ross Armstrong, Automation Tooling Systems

Development and Applications of CPU Socket Models
Chia-Pin Chiu, Don Le, Intel Corporation

Concluding Remarks

Register On-Line and $ave

Don't miss out on the System Packaging 2003 ATW
held in conjuction with this event.

Hotel Information:

Hotel Cut-off is September 12, 2003
Hotel accommodations must be made directly to:

Sheraton Palo Alto Hotel
625 El Camino Real
Palo Alto, CA 94301
Phone: 800-874-3516
When making reservations, please reference IMAPS.

Single/Double: $179

Sheraton Palo Alto Hotel requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival. After which time, deposit is non-refundable.

The Sheraton Palo Alto Hotel is located 400 meters (1/4 mile) from the Palo Alto Caltrain station. Caltrain and connecting shuttle buses provide frequent service to San Jose and San Francisco airports. Downtown Palo Alto, centered on University Avenue, is within easy walking distance. This is an alternate method to car rental for getting around between Bay Area airports and the hotel where the workshop will be held. More detailed step-by-step directions and useful links to the different transit systems will be provided shortly. Please check back soon.

Transportation to/from the Sheraton

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>