IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
IMAPS Advanced Technology Workshop on
Thermal Management
download program pdf

Sheraton Palo Alto Hotel
Palo Alto, California 94301 USA
October 25-27, 2004

General Chair:
Dave Saums, DS&A
Newburyport, MA USA
Tel: 978-499-4990
Email: dsaums@dsa-thermal.com

Program Chair:
David Copeland, Fujitsu Laboratories
Sunnyvale, CA USA
Tel: 408-530-4693
Email: copeland@fla.fujitsu.com

(held in conjunction with the ATW on High-Speed Interconnect, EMC and Power aspects of System Packaging for High Performance Computing, Telecom and Semiconductor Capital Equipment
October 27-29 - Sheraton Palo Alto)


Program by Day: Monday | Tuesday | Wednesday
Program by Session: 1 | 2 | 3 | 4 | 5 | 6 | 7a | 7b | 8 | 9
Register On-line | Hotel Information | System Packaging Workshop

Monday, October 25

Registration: 8 am – 9 pm
Continental Breakfast: 8 am – 9 am

Session 1: Market Drivers
9 am - 12:30 pm
Session Chair: Dave Saums, DS&A

Sustainability: A Key Market Driver of the Future Information Technology Industry
Chandrakant D. Patel, Hewlett Packard Laboratories

Bringing Together the Microelectronics / Packaging and Building Cooling Industries
Donald L. Beaty, DLB Associates, Consulting Engineers, P.C.; Roger Schmidt, IBM

64-bit Server Cooling Requirements
David Copeland, Fujitsu Laboratories of America

Break: 10:30 am – 11 am

Challenges and Development Areas for Thermal Management of Next Generation Microprocessors
Thomas P. Dolbear, Sridhar Sundaram, Advanced Micro Devices

Market Drivers and Applications for Engineered Thermal Materials
Dave Saums, DS &A

Thermal Management of Graphics Processors
Joe Walters, nVidia

Lunch: 12:30 pm - 1:30 pm

Session 2: Refrigeration and Liquid Cooling
1:30 pm - 5 pm
Session Chair: John Peeples, The Citadel

High Performance Heat Spreader for High Power Electronics
Jon Zuo, Chanwoo Park, David Sarraf, Advanced Cooling Technologies, Inc.

Thermal Performance of Fluorinated Fluids in Pool Boiling with Application to Thermosyphons
Phillip E. Tuma, 3M

Miniature Loop Heat Pipes – A Promising Means for Cooling Electronics
Jay M. Ochterbeck, Yury F. Maydanik, Sergey V. Vershinin, Mikhail A. Korukov, Clemson University

Break: 3:00 pm - 3:30 pm

High Performance, Reliable Liquid Cooling Components and Systems for Computing and Electronics Devices Utilizing Standard Materials and Manufacturing Processes
William Ott, PAR Technologies

New Efficient Liquid Cooling Technologies for Computer Systems
Peter Prechtl, HTP Microsystems GmbH; Olaf Kurtz, Atotech Deutschland GmbH

Liquid Metal Cooling Loops for Mobile Applications
Bob Mayer, nanoCoolers

Reception: 5:30 pm – 6:00 pm
Dinner: 6:00 pm - 7:00 pm

Session 3: Solid State Refrigeration and Power-Aware Design
7:00 pm - 9:00 pm
Session Chair: Guy Wagner, RM Laboratories

Integration of Thermoelectric and Phase Change (Liquid/vapor) Devices with Application to CPU Cooling
Ioan Sauciuc, Hakan Erturk, Jim Williams, Greg Chrysler, Ravi Mahajan, Intel Corporation

Leakage and Variations Aware Thermal Management of Nanometer Scale ICs
Kaustav Banerjee, Sheng-Chih Lin, Vineet Wason, University of California at Santa Barbara

Development of a High-Efficiency, Solid-State Cooling Chip
Rodney T. Cox, Avto Tavkhelidze, Isaiah W. Cox, Cool Chips plc

MicroPelt®: Leading Edge Thermoelectric Micro Devices - Technology and Applications
Karl-Heinz Schlereth, Infineon Technologies AG; Bernhard Loibl, Inheco GmbH


Tuesday, October 26

Registration: 8 am – 9 pm
Continental Breakfast: 8 am – 9 am

Session 4: Metallic Interface Materials
9:00 am - 12:30 pm
Session Chair: Herman Chu, Cisco Systems

Advancements in Heat Transfer Via Direct Soldering of Copper to Aluminum
Bryce Watson, Bill Avery, Kester

Enhanced Thermal Performance by Direct Solder Attach of Silicon Dies
Jai S. Subramanian, T. Rude, J. Newson, J. He, T. P. Weihs, RNT

Active Metal Brazing Copper to Ceramic Substrates Solving Thermal Challenges of Power Devices
Keith Easler, Kyocera America

Break: 10:30 am – 11 am

Development of Die Attach Solder with Improved Thermal
Mitch Holtzer, John Laughlin, Brian Lewis, Tony Ingham, Cookson Electronics

Thermal Properties of Active Solder Bonds
Randall Redd, Ronald W. Smith, S-Bond Technologies LLC

Reliability and Performance of a Low Melt Alloy-based Thermal Interface System
Chris G. Macris, Thomas R. Sanderson, Robert R. Ebel, Christopher B. Leyerle, Enerdyne Solutions

Lunch: 12:30 pm - 1:30 pm

Session 5: Nonmetallic Interface Materials
1:30 pm - 2:30 pm
Session Chair: Dave Saums, DS&A

Thermally Conductive Materials: How Material Properties Relate to Application Performance
Jim Bacorn, Sanjay Misra, Kasyap Seethamraju, The Bergquist Company

Carbon Black Thermal Pastes that Surpass Solder and Best Commercial Thermal Pastes in providing High Thermal Contact Conductance
Chia-Ken Leong, D. D. L. Chung, University at Buffalo, State University of New York

Session 6: Fan Optimization
2:30 pm - 4:00 pm
Session Chair: Cullen Bash, Hewlett-Packard Laboratories

A Practical Engineering Approach to Extract Fan Curves Based on Skin-to-Skin Distance, Plenum Size and Fan Speed from a Single Fan Curve Data
M. Baris Dogruoz, Attila Aranyosi, Juan Cruz, William Maltz, Electronic Cooling Solutions Inc.; Andre Ali, Apple Computer

Break: 3:00 pm - 3:30 pm

Pushing Fan Performance to the Limit - Integration of Fan Electronics and Thermal Controller Electronics
Glenn Warren, Cisco Systems Inc.

Session 7A: High Conductivity, Low Expansion Materials
4:00 pm - 5:00 pm
Session Chair: David Copeland, Fujitsu Laboratories

Performance of High Conductivity Heat Spreaders in Flip Chip Thermal Packages
Martin W. Weiser, Nancy F. Dean, Honeywell Electronic Materials

Fabrication of CuSiC Metal Matrix Composites: Thermal Management Materials for the Next Generation Power Electronics
Pradeep Paul, Changmo Sung, Glenn Sundberg, Thomas Vasilos, University of Massachusetts at Lowell

Reception: 5:30 pm – 6:00 pm
Dinner: 6:00 pm – 7:00 pm

Session 7B: High Conductivity, Low Expansion Materials
7:00 pm - 9:00 pm
Session Chair: David Copeland, Fujitsu Laboratories

Ultrahigh-Thermal-Conductivity Packaging Materials
Carl Zweben, Independent Consultant

Thermal Performance of Experimental Hybrid Graphite Reinforced Al and Cu Matrix Composite Heat Sinks
James A. Cornie, Stephen S. Cornie, Shiyu Zhang, Eugene Chen, Larry Ballard, Metal Matrix Cast Composites, LLC

New Generation of Thermal Management Materials
Arndt Luedtke, Plansee AG; Frank Polese, Polese Company

Natural Graphite Based Materials for Electronics Cooling
Julian Norley, GrafTech

Wednesday, October 27

Registration: 7:30 am – 12:30 pm
Continental Breakfast: 7:30 am – 8:30 am

Session 8: Telecommunications and Computing Systems
8:30 am - 10:30 am
Session Chair: William Maltz, Electronic Cooling Solutions

Thermal Characterization of the Advanced Graphics Card in a Real Operating Environment
Yean-Der Kuan, Kuang Wu Institute of Technology; Tsorng-Dih Yuan, Hsin-Yu Pan, Taiwan Semiconductor Company

Case Study of a Thermal Compromise on a Crowded PC Board
Marc Weideman, CoFan USA

An Open-System, Exergy-Based Analysis of Data Center Thermal Management Components
Amip Shah, Van Carey, University of California at Berkeley; Cullen Bash, Chandrakant Patel, Hewlett-Packard Laboratories

Scalable and Adaptive Cooling Solutions for Data Centers
Izuh Obinelo, Degree Controls Inc.

Break 10:30 am – 11:00 am

Session 9: Heatsink Design and Manufacturing
11:00 am - 12:30 pm
Session Chair: Cullen Bash, Hewlett-Packard Laboratories

Advances in High Watt Density (HWD) Thermoelectrics and Implications for CPU cooling
Jim Bierschenk, Dwight Johnson, Marlow Industries

Thermal Modeling of the Press-on-Fin Heat Sink for IC Cooling
Guy R Wagner, RM Laboratories

Novel Manufacturing Process for Heatsinks using Powder Injection Molding Technology
Lye-King Tan, Advanced Materials Technologies

Lunch: 12:30 pm - 1:30 pm


Register On-line

(held in conjunction with the ATW on High-Speed Interconnect, EMC and Power aspects of System Packaging for High Performance Computing, Telecom and Semiconductor Capital Equipment
October 27-29 - Sheraton Palo Alto)


Housing (Hotel Cut-off is September 24, 2004)

Housing Accommodations must be made directly to:

Sheraton Palo Alto Hotel
625 El Camino Real
Palo Alto, CA 94301
P: 800-874-3516 or 650-328-2800
E: SheratonReservation@pahotel.com

When making reservation, please reference IMAPS
Single/Double: $179
Sheraton Palo Alto Hotel requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival. After which time, deposit is non-refundable.




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>