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Advanced Technology Workshop on
Thermal Management

Download a pdf of the program

Dinah's Garden Hotel
Palo Alto, California USA
October 23– 26, 2005

(Colocated with the ATW on Power LEDs)

General Chair
Dave Saums, DS&A LLC

Program Chair
David Copeland, Sun Microsystems

Program Committee:
Cullen Bash, Hewlett-Packard Laboratories
Herman Chu, Cisco Systems
Vadim Gektin, Sun Microsystems
Bill Maltz, Electronics Cooling Solutions
George Meyer, Peninsula Components
John Peeples, The Citadel
Guy Wagner, RM Laboratories and Cornice, Inc.


Register On-line | Hotel Info | Transportation
Early Registration/Hotel Deadline - October 10, 2005

Sunday, October 23

Registration: 6:00 pm – 8:00 pm

Opening Reception: 7:00 pm – 8:00 pm

Monday, October 24

Registration: 7:30 am – 9:00 pm

Continental Breakfast: 7:30 am – 8:30 am

Session 1: Market Drivers
8:30 am - 10:00 am
Chair: Dave Saums, DS &A LLC

Minimizing the Burdened Cost of Power: A Key Market Driver of the Future Information Technology Industry
Chandrakant D. Patel, Amip Shah, Hewlett-Packard Laboratories

Mobile Thermal Challenges in Future Platforms
Rajiv Mongia, Intel Corporation

TIM Material Testing in Practice and Future Directions
Dave Saums, Robert A. Rauch, DS&A LLC; Cameron Murray, 3M Company; Marta Rencz, Micred; Clemens Lasance, Philips

Break: 10:00 am – 10:30 am

Session 2: Thermal Interface Testing
10:30 am - 12:30 pm
Chair: Vadim Gektin, Sun Microsystems

TIM2 Engineering Qualification Guidelines
Stanley Pecavar, Don Kearns, Margaret Stern, John Dunn, Vadim Gektin, Brett Ong, Tony Chen, Sun Microsystems

Performance Evaluation of Advanced Thermal Materials
Margaret B. Stern, Don Kearns, Robert Melanson, Gawtam Jhoty, Vadim Gektin, Stan Pecavar, Sun Microsystems

* A Thermal Interface Material Characterization Test Apparatus
Ni Zhou, Fred Barez, San Jose State University

* Design and Verification of an Apparatus for Thermal Resistance and Conductivity Measurements for a Thermal Interface Material
Kaustubh Kalkundri, Frank Andros, Bahgat Sammakia, State University of New York at Binghamton

Lunch: 12:30 pm - 1:30 pm

Session 3: Data Center Cooling
1:30 pm - 3:30 pm
Chair: Cullen Bash, Hewlett-Packard Laboratories

Dynamic Thermal Management of Air Cooled Data Centers
Cullen Bash, Chandrakant Patel, Ratnesh Sharma, Hewlett-Packard Laboratories

Hotspots in Data Centers: 3-Dimensional Thermal Measurements
Hendrik F. Hamann, James Lacey, Martin O’Boyle, Roger Schmidt, Mahdusudan Iyengar, IBM T.J. Watson Research Center

Partial Cold-Aisle Isolation for Raised-Floor Data Centers
James W. VanGilder, American Power Conversion

Vision of the Data Center Cooling Roadmap into the Future
Steven Madara, Emerson Network Power / Liebert

Break: 3:30 pm – 4:00 pm

Session 4: System Level Cooling
4:00 pm - 6:00 pm
Chair: Herman Chu, Cisco Systems

Air and Liquid Cooling Solutions for Orthogonal Card Packaging Architectures
Andreas C. Pfahnl, Chris Heard, Teradyne Inc.

High Performance Liquid Cooled Hybrid Composite Enclosures
James C. Calder, Material Innovations Inc.

Composite Enclosure for High Power Avionics
Roland Watts, Amanda Colleary, Mark Kistner, AFRL Materials and Manufacturing Directive

Heat Sink Thermal Performance in Next Generation RF Amplifiers
Nader Nikfar, George Meyer, Powerwave Technologies, Inc.

Reception: 6:00 pm – 6:30 pm
Dinner: 6:30 pm – 7:30 pm

Session 5: Organic Thermal Interfaces
7:30 pm - 9:00pm
Chair: Vadim Gektin, Sun Microsystems

Carbon Nanofibers for Thermal Interface Materials in Pressure Contacts
Ernst Hammel, Xinhe Tang, Markus Trampert, Juergen Schulz - Harder, Michael Haberkorn, Andreas Meyer, Electrovac GmbH

High-Conductivity Adhesives for Power Device Packaging
Alan Grieve, M. Albert Capote, Arsenia Soriano, Aguila Technologies, Inc.

Reliability and Performance of Thermally Conductive Adhesives
Brian J. Toleno, James J. Earle, Henkel Corporation

Tuesday, October 25

Registration: 7:30 am – 9:00 pm

Continental Breakfast: 7:30 am – 8:30 am

Session 6: Testing and Modeling
8:30 am - 10:00 am
Chair: Guy Wagner, RM Laboratories and Cornice, Inc.

Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results
Ephraim Suhir, University of California at Santa Cruz and Nanoconduction, Inc.

Identification of Thermocouple Error as a Function of Mounting Technique
Guy R. Wagner, RM Laboratories

* Influence of Thermal Contact Resistance on Thermal Impedance of Microelectronic Structures
Bjorn Vermeersch, Gilbert De Mey, University of Ghent

Break: 10:00 am – 10:30 am

Session 7: Metallic Thermal Interfaces
10:30 am - 12:30 pm
Chair: Bill Maltz, Electronics Cooling Solutions

Metal TIMs for High Power Cooling Applications
Bruce K. Furman, P. A. Lauro, D. Y. Shih, T. Van Kessel, Y. Martin, E. G. Colgan, W. Zou, S. Iruvanti, J. Wakil, R. Schmidt, M. K. Iyengar, IBM

Semiconductor to Copper Bonding by Microwave Selective Heating Technology
Nasser Budraa, Boon Ng, Microwave Bonding Instruments

Microprocessor Performance and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System
Chris G. Macris, Enerdyne Solutions

Solder Die Attach using Active Solder Materials
Randall Redd, Ronald Smith, S-Bond Technologies LLC

Lunch: 12:30 pm - 1:30 pm

Session 8A: Liquid Cooling
1:30 pm - 3:30 pm
Chair: George Meyer, Peninsula Components

Next Generation Technologies in Two Phase Cooling
Scott D. Garner, Chanwoo Park, Advanced Cooling Technologies

Next Generation Spray Cooling: Compact, High-performance and Reliable
Timothy A. Shedd, University of Wisconsin-Madison

Indirect Thermosyphon Technology using 3M Fluorinated Heat Transfer
Phillip E. Tuma, 3M Company

Computer CPU Two Phase Cooling
Nagui Mankaruse, Delta Engineers

Break: 3:30 pm – 4:00 pm

Session 8B: Liquid Cooling
4:00 pm - 6:00 pm
Chair: George Meyer, Peninsula Components

Second Generation Porous Metal Cold Plate Technology for Single-Phase Liquid Cooling
Kevin L. Wert, C. Scott Schaeffer, Thermacore International, Inc.

Performance of Foamed Graphite in Cold Plates, Heat Pipes, and Heat Sinks
Ronald Smith, Randall Redd, Lee Weichmann, Materials Resources International

* FC-72 Spray in Electronics Cooling: A Numerical Tool to Study the Heat Transfer between a Microdroplet and a Solid Surface
Rajneesh Bhardwaj, Daniel Attinger, State University of New York at Stony Brook
* Theoretical Modeling of Gravity Influence on Oscillating Heat Pipe
Shibin Liang, University of Missouri-Columbia and Sun Microsystems

Reception: 6:00 pm - 6:30 pm

Dinner: 6:30 pm – 7:30 pm

Session 9A: High Conductivity Composites
7:30 pm - 9:00 pm
Chair: Dave Saums, DS &A LLC

Composite Heat Spreaders for High Power Package Cooling
Sushumna Iruvanti, Amilcar Arvelo, Hilton Toy, Gregory Martin, Garry Benarr, Kamal Sikka, IBM

Manufacture of High Thermal Conductivity (+700W/mK) Cu-Graphite Composites with Reaction Bonded Carbide Formation to Improve Wetting
Glenn Sundberg, Nirupama Kattamuri, University of Massachusetts at Lowell

Development of CTE Matched High Conductivity Discontinuous Graphite Fiber Reinforced Cu: The Role of Melt Chemistry and Fiber Architecture
James A. Cornie, Eugene Chen, Shiyu Zhang, Metal Matrix Cast Composites, LLC

Wednesday, October 26

Registration: 7:30 am – 12:30 pm

Continental Breakfast: 7:30 am – 8:30 am

Session 9B: High Conductivity Composites
8:30 am - 10:00 am
Chair: Dave Saums, DS &A LLC

Implementation of Diamond Pins as Thermal Vias for High Heat Flux Spreading in CTE-Compatible Lids and Substrates for Semiconductor Packaging
David L. Saums, DS&A LLC; Jerry Zimmer, sp3 Diamond Technologies Inc.; Kevin P. Fennessy, CPS Technologies Inc.

High Thermal Dissipation Upcoming Materials for Microelectronics Packaging
Juan L. Sepulveda, Intertec Advanced Materials; Lee Vardermark, Brush Ceramic Products

Affordable CTE Modified Carbon Composites for Thermal Management Applications
Wei Shih, J. D. Hwang, Allcomp Inc.

Break: 10:00 am – 10:30 am

Session 10: Thermoelectric Coolers
10:30 am - 12:00 pm
Chair: John Peeples, The Citadel

Embedded Thermoelectric Devices for Hot-Spot and other High-Flux Cooling Applications
David A. Koester, Robert Conner, Nextreme Thermal Solutions, Inc.

Chip Design Methodology for Thermal Optimization
Dave Rosato, Dave Koester, Marco Soto, Bob Conner, Harvard Thermal

* Is ZT the Main Performance Factor for Hot Spot Cooling using 3D Microrefrigerators?
Yan Zhang, Gehong Zeng, Ali Shakouri, Avram Bar-Cohen, University of California at Santa Cruz

Workshop Closing and Discussion: 12:00 pm - 12:15 pm

Lunch: 12:15 pm – 1:15 pm


* Student Competition Winners
Sponsored by:
DS&A LLC
Electronics Cooling Solutions
Hewlett-Packard Laboratories

Register On-line

 


Hotel Accommodations (Hotel Cut-off is October 10, 2005)
Housing Accommodations must be made directly to:

Dinah’s Garden Hotel
IMAPS "host hotel" has sold out.

IMAPS does not offer another room block at any other hotels. Howerever, here are some other nearby hotels that might have availability:

Crowne Plaza Palo Alto
4290 El Camino Real
Palo Alto, CA 94306
Tel: (650) 857-0787
Sheraton Palo Alto Hotel
625 El Camino Real
Palo Alto, California 94301
Tel: (650) 328-2800
 
Creekside Inn
El Camino near Page Mill Road
3400 El Camino Real
Palo Alto, CA 94306
Reservations: 800 492-7335
Tel: (650) 493-2411

Dinah’s Garden Hotel
4261 El Camino Real
Palo Alto, CA 94306
Room Rate: $125

On-line Reservations:
- Go to www.dinahshotel.com
- Click on “Check Room Availability Here”
- On the bottom center of the page, click Group Reservation
- In Attendee Code enter “IMAPS05”
- Enter arrival date, number of nights, etc... and when you hit Continue it pulls up the group rate.

Telephone Reservations:
P: 650-493-2844 or 800-227-8220
Please reference IMAPS when making reservations.

Dinah’s Garden Hotel requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival.

 

Transit Information

Public Transportation - Dinah's Garden Hotel from San Jose and San Francisco Airports

San Jose Airport http://www.sjc.org/
Go to the Airport Flyer bus stop (different from the Inter-Terminal/ Long Term Parking bus stops) http://www.sjc.org/travelers/ground_trans.html VTA (Valley Transportation Authority) http://www.vta.org/ #10 Airport Flyer http://www.vta.org/schedules/SC_10.html is free and operates every 15 minutes daytime and evenings. The bus stops in front of both Terminals A and C http://www.vta.org/schedules/SC_10_MAP.GIF be sure to ride the Eastbound bus going to Santa Clara Transit Center (NOT to Metro Light Rail Station). The ride from Terminal A takes about 19 minutes, the sunday schedule is shown here http://www.vta.org/schedules/SC_10WE_SU.html From Santa Clara Transit Center, the VTA #22 bus operates every 15 minutes and costs $1.75, no change is available so have correct fare ready. Be sure to ride the Westbound bus going to Palo Alto Caltrain Station or Menlo Park Caltrain Station (NOT to Eastridge Transit Center). The Westbound and Eastbound #22 bus stops are at different locations at Santa Clara Transit Center, with the final destination indicated on the sign, so be sure to get on the correct bus. The ride takes about 50 minutes, get off at Dinah's Garden Hotel, which is less than a kilometer past the large shopping center at San Antonio Road.

San Francisco Airport http://www.flysfo.com/
Within the airport, go to the International Terminal, either by walking http://www.flysfo.com/guide_nonflash/gettingaround/terminalmaps.htm or by free AirTrain
http://www.flysfo.com/guide_nonflash/gettingaround/airtrain.htm The red line is faster. From the International Terminal, BART (Bay Area Rapid Transit) http://www.bart.gov/index.asp train operates every 20 minutes daytime and evenings on sundays http://www.bart.gov/stations/schedules/lineSchedules_ROUTE11_SU.asp be sure to get on the train going to Millbrae. Fare is $1.50, tickets can be purchased for any amount so a $3.00 ticket for a roundtrip may be a good idea. The ride to Millbrae takes 6 minutes. At Millbrae, transfer to the Caltrain, being sure to go to the southbound track (furthest from BART tracks) for trains to San Jose. On sundays http://caltrain.org/timetable_effective_8_1_05.html#weekend-southbound the trains depart every hour at 24 minutes after the hour. The weekday schedule will change on 10 October and is shown here http://caltrain.org/pdf/timetable_effective_10_10_05.pdf Caltrain fare is
$3.50, be sure to buy a ticket from Zone 2 to Zone 3. The ride to Palo Alto takes 38 minutes. From Palo Alto Transit Center, the VTA #22 bus operates every 15 minutes and costs $1.75, no change is available so have correct fare ready. Be sure to ride the Eastbound bus going to Eastridge Transit Center (NOT to Menlo Park Caltrain Station ). The Westbound and Eastbound #22 bus stops are at different locations at Palo Alto Transit Center, with the final destination indicated on the sign, so be sure to get on the correct bus. The ride takes about 17 minutes, get off across the street from Dinah's Garden Hotel, which is less than half a kilometer past Arastradero Road.

The hotel website is: www.dinahshotel.com. The hotel direct telephone from overseas or within the U.S. is: +1 650 493 2844. The address is: Dinah’s Garden Hotel, 4261 El Camino Real, Palo Alto CA 94306 USA.

 


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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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