Advanced Technology Workshop on
Thermal Management
Download a pdf of the program
Dinah's Garden Hotel
Palo Alto, California USA
October 23– 26, 2005
(Colocated with the ATW
on Power LEDs)
General Chair
Dave Saums, DS&A LLC
Program Chair
David Copeland, Sun Microsystems
Program Committee:
Cullen Bash, Hewlett-Packard Laboratories
Herman Chu, Cisco Systems
Vadim Gektin, Sun Microsystems
Bill Maltz, Electronics Cooling Solutions
George Meyer, Peninsula Components
John Peeples, The Citadel
Guy Wagner, RM Laboratories and Cornice, Inc.
Register
On-line
| Hotel Info | Transportation
Early Registration/Hotel Deadline - October
10, 2005
Sunday, October 23
Registration:
6:00 pm – 8:00 pm
Opening
Reception: 7:00 pm – 8:00
pm
Monday, October 24
Registration:
7:30 am – 9:00 pm
Continental
Breakfast: 7:30 am – 8:30
am
Session 1: Market Drivers
8:30 am - 10:00 am
Chair: Dave Saums, DS &A LLC
Minimizing the Burdened Cost of Power: A Key Market Driver of the
Future Information Technology Industry
Chandrakant D. Patel, Amip Shah, Hewlett-Packard Laboratories
Mobile Thermal Challenges in Future Platforms
Rajiv Mongia, Intel Corporation
TIM Material Testing in Practice and Future Directions
Dave Saums, Robert A. Rauch, DS&A LLC; Cameron Murray, 3M Company;
Marta Rencz, Micred; Clemens Lasance, Philips
Break:
10:00 am – 10:30
am
Session 2: Thermal Interface Testing
10:30 am - 12:30 pm
Chair: Vadim Gektin, Sun Microsystems
TIM2 Engineering Qualification Guidelines
Stanley Pecavar, Don Kearns, Margaret Stern, John Dunn, Vadim
Gektin, Brett Ong, Tony Chen, Sun Microsystems
Performance Evaluation of Advanced Thermal Materials
Margaret B. Stern, Don Kearns, Robert Melanson, Gawtam Jhoty,
Vadim Gektin, Stan Pecavar, Sun Microsystems
*
A Thermal Interface Material Characterization Test Apparatus
Ni Zhou, Fred Barez, San Jose State University
* Design and
Verification of an Apparatus for Thermal Resistance and Conductivity
Measurements for a Thermal Interface Material
Kaustubh Kalkundri, Frank Andros, Bahgat Sammakia, State University
of New York at Binghamton
Lunch: 12:30 pm - 1:30 pm
Session 3: Data Center Cooling
1:30 pm - 3:30 pm
Chair: Cullen Bash, Hewlett-Packard Laboratories
Dynamic Thermal Management of Air Cooled Data Centers
Cullen Bash, Chandrakant Patel, Ratnesh Sharma, Hewlett-Packard
Laboratories
Hotspots in Data Centers: 3-Dimensional Thermal Measurements
Hendrik F. Hamann, James Lacey, Martin O’Boyle, Roger Schmidt,
Mahdusudan Iyengar, IBM T.J. Watson Research Center
Partial Cold-Aisle Isolation for Raised-Floor Data Centers
James W. VanGilder, American Power Conversion
Vision of the Data Center Cooling Roadmap into the Future
Steven Madara, Emerson Network Power / Liebert
Break:
3:30 pm – 4:00
pm
Session 4: System Level Cooling
4:00 pm - 6:00 pm
Chair: Herman Chu, Cisco Systems
Air and Liquid Cooling Solutions for Orthogonal Card Packaging Architectures
Andreas C. Pfahnl, Chris Heard, Teradyne Inc.
High Performance Liquid Cooled Hybrid Composite Enclosures
James C. Calder, Material Innovations Inc.
Composite Enclosure for High Power Avionics
Roland Watts, Amanda Colleary, Mark Kistner, AFRL Materials and
Manufacturing Directive
Heat Sink Thermal Performance in Next Generation RF Amplifiers
Nader Nikfar, George Meyer, Powerwave Technologies, Inc.
Reception:
6:00 pm – 6:30 pm
Dinner: 6:30 pm – 7:30 pm
Session 5: Organic Thermal Interfaces
7:30 pm - 9:00pm
Chair: Vadim Gektin, Sun Microsystems
Carbon Nanofibers for Thermal Interface Materials in Pressure Contacts
Ernst Hammel, Xinhe Tang, Markus Trampert, Juergen Schulz - Harder,
Michael Haberkorn, Andreas Meyer, Electrovac GmbH
High-Conductivity Adhesives for Power Device Packaging
Alan Grieve, M. Albert Capote, Arsenia Soriano, Aguila Technologies,
Inc.
Reliability and Performance of Thermally Conductive Adhesives
Brian J. Toleno, James J. Earle, Henkel Corporation
Tuesday, October 25
Registration:
7:30 am – 9:00 pm
Continental
Breakfast: 7:30 am – 8:30
am
Session 6: Testing and Modeling
8:30 am - 10:00 am
Chair: Guy Wagner, RM Laboratories and Cornice, Inc.
Analytical Thermal Stress Modeling in Physical Design for Reliability
of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges,
Results
Ephraim Suhir, University of California at Santa Cruz and Nanoconduction,
Inc.
Identification of Thermocouple Error as a Function of Mounting Technique
Guy R. Wagner, RM Laboratories
*
Influence of Thermal Contact Resistance on Thermal Impedance of
Microelectronic
Structures
Bjorn Vermeersch, Gilbert De Mey, University of Ghent
Break:
10:00 am – 10:30
am
Session 7: Metallic Thermal Interfaces
10:30 am - 12:30 pm
Chair: Bill Maltz, Electronics Cooling Solutions
Metal TIMs for High Power Cooling Applications
Bruce K. Furman, P. A. Lauro, D. Y. Shih, T. Van Kessel, Y. Martin,
E. G. Colgan, W. Zou, S. Iruvanti, J. Wakil, R. Schmidt, M. K. Iyengar,
IBM
Semiconductor to Copper Bonding by Microwave Selective Heating Technology
Nasser Budraa, Boon Ng, Microwave Bonding Instruments
Microprocessor Performance and Reliability Utilizing a Phase Change
Metallic Alloy Thermal Interface System
Chris G. Macris, Enerdyne Solutions
Solder Die Attach using Active Solder Materials
Randall Redd, Ronald Smith, S-Bond Technologies LLC
Lunch: 12:30 pm - 1:30 pm
Session 8A: Liquid Cooling
1:30 pm - 3:30 pm
Chair: George Meyer, Peninsula Components
Next Generation Technologies in Two Phase Cooling
Scott D. Garner, Chanwoo Park, Advanced Cooling Technologies
Next Generation Spray Cooling: Compact, High-performance and Reliable
Timothy A. Shedd, University of Wisconsin-Madison
Indirect Thermosyphon Technology using 3M Fluorinated Heat Transfer
Phillip E. Tuma, 3M Company
Computer CPU Two Phase Cooling
Nagui Mankaruse, Delta Engineers
Break:
3:30 pm – 4:00
pm
Session 8B: Liquid Cooling
4:00 pm - 6:00 pm
Chair: George Meyer, Peninsula Components
Second Generation Porous Metal Cold Plate Technology for Single-Phase
Liquid Cooling
Kevin L. Wert, C. Scott Schaeffer, Thermacore International,
Inc.
Performance of Foamed Graphite in Cold Plates, Heat Pipes, and Heat
Sinks
Ronald Smith, Randall Redd, Lee Weichmann, Materials Resources
International
*
FC-72 Spray in Electronics Cooling: A Numerical Tool to Study the
Heat Transfer
between a Microdroplet and a Solid Surface
Rajneesh Bhardwaj, Daniel Attinger, State University of New York
at Stony Brook
*
Theoretical Modeling of Gravity Influence on Oscillating Heat Pipe
Shibin Liang, University of Missouri-Columbia and Sun Microsystems
Reception: 6:00 pm - 6:30 pm
Dinner:
6:30 pm – 7:30
pm
Session 9A: High Conductivity Composites
7:30 pm - 9:00 pm
Chair: Dave Saums, DS &A LLC
Composite Heat Spreaders for High Power Package Cooling
Sushumna Iruvanti, Amilcar Arvelo, Hilton Toy, Gregory Martin,
Garry Benarr, Kamal Sikka, IBM
Manufacture of High Thermal Conductivity (+700W/mK) Cu-Graphite Composites
with Reaction Bonded Carbide Formation to Improve Wetting
Glenn Sundberg, Nirupama Kattamuri, University of Massachusetts
at Lowell
Development of CTE Matched High Conductivity Discontinuous Graphite
Fiber Reinforced Cu: The Role of Melt Chemistry and Fiber Architecture
James A. Cornie, Eugene Chen, Shiyu Zhang, Metal Matrix Cast
Composites, LLC
Wednesday, October 26
Registration:
7:30 am – 12:30 pm
Continental
Breakfast: 7:30 am – 8:30
am
Session 9B: High Conductivity Composites
8:30 am - 10:00 am
Chair: Dave Saums, DS &A LLC
Implementation of Diamond Pins as Thermal Vias for High Heat Flux
Spreading in CTE-Compatible Lids and Substrates for Semiconductor Packaging
David L. Saums, DS&A LLC; Jerry Zimmer, sp3 Diamond Technologies
Inc.; Kevin P. Fennessy, CPS Technologies Inc.
High Thermal Dissipation Upcoming Materials for Microelectronics Packaging
Juan L. Sepulveda, Intertec Advanced Materials; Lee Vardermark,
Brush Ceramic Products
Affordable CTE Modified Carbon Composites for Thermal Management Applications
Wei Shih, J. D. Hwang, Allcomp Inc.
Break:
10:00 am – 10:30
am
Session 10: Thermoelectric Coolers
10:30 am - 12:00 pm
Chair: John Peeples, The Citadel
Embedded Thermoelectric Devices for Hot-Spot and other High-Flux Cooling
Applications
David A. Koester, Robert Conner, Nextreme Thermal Solutions,
Inc.
Chip Design Methodology for Thermal Optimization
Dave Rosato, Dave Koester, Marco Soto, Bob Conner, Harvard Thermal
*
Is ZT the Main Performance Factor for Hot Spot Cooling using
3D Microrefrigerators?
Yan Zhang, Gehong Zeng, Ali Shakouri, Avram Bar-Cohen,
University of California at Santa Cruz
Workshop Closing and Discussion: 12:00 pm - 12:15 pm
Lunch:
12:15 pm – 1:15
pm
* Student
Competition Winners
Sponsored by:
DS&A LLC
Electronics Cooling Solutions
Hewlett-Packard Laboratories
Register
On-line
Hotel Accommodations (Hotel
Cut-off is October 10, 2005)
Housing Accommodations must be made directly to:
Dinah’s
Garden Hotel
IMAPS "host hotel" has sold out.
IMAPS does not offer another room block at any other hotels. Howerever,
here are some other nearby hotels that might have availability:
Crowne
Plaza Palo Alto
4290 El Camino Real
Palo Alto, CA 94306
Tel: (650) 857-0787 |
Sheraton
Palo Alto Hotel
625 El Camino Real
Palo Alto, California 94301
Tel: (650) 328-2800
|
Creekside
Inn
El Camino near Page Mill Road
3400 El Camino Real
Palo Alto, CA 94306
Reservations: 800 492-7335
Tel: (650) 493-2411
|
Dinah’s Garden
Hotel
4261 El Camino Real
Palo Alto, CA 94306
Room Rate: $125
On-line Reservations:
- Go to www.dinahshotel.com
- Click on “Check Room Availability Here”
- On the bottom center of the page, click Group Reservation
- In Attendee Code enter “IMAPS05”
- Enter arrival date, number of nights, etc... and when you hit Continue it
pulls up the group rate.
Telephone Reservations:
P: 650-493-2844 or 800-227-8220
Please reference IMAPS when making reservations.
Dinah’s Garden
Hotel requires a deposit for the first night's room and tax to
hold your room. Deposit refunded if reservation is cancelled fourteen
(14) days prior to arrival.
Transit Information
Public Transportation - Dinah's Garden Hotel from San Jose and
San Francisco Airports
San Jose Airport http://www.sjc.org/
Go to the Airport Flyer bus stop (different from the Inter-Terminal/
Long Term Parking bus stops) http://www.sjc.org/travelers/ground_trans.html
VTA (Valley Transportation Authority) http://www.vta.org/ #10 Airport
Flyer http://www.vta.org/schedules/SC_10.html is free and operates every
15 minutes daytime and evenings. The bus stops in front of both Terminals
A and C http://www.vta.org/schedules/SC_10_MAP.GIF be sure to ride the
Eastbound bus going to Santa Clara Transit Center (NOT to Metro Light
Rail Station). The ride from Terminal A takes about 19 minutes, the sunday
schedule is shown here http://www.vta.org/schedules/SC_10WE_SU.html From
Santa Clara Transit Center, the VTA #22 bus operates every 15 minutes
and costs $1.75, no change is available so have correct fare ready. Be
sure to ride the Westbound bus going to Palo Alto Caltrain Station or
Menlo Park Caltrain Station (NOT to Eastridge Transit Center). The Westbound
and Eastbound #22 bus stops are at different locations at Santa Clara
Transit Center, with the final destination indicated on the sign, so
be sure to get on the correct bus. The ride takes about 50 minutes, get
off at Dinah's Garden Hotel, which is less than a kilometer past the
large shopping center at San Antonio Road.
San Francisco Airport http://www.flysfo.com/
Within the airport, go to the International Terminal, either by walking
http://www.flysfo.com/guide_nonflash/gettingaround/terminalmaps.htm or
by free AirTrain
http://www.flysfo.com/guide_nonflash/gettingaround/airtrain.htm The
red line is faster. From the International Terminal, BART (Bay Area Rapid
Transit) http://www.bart.gov/index.asp train operates every 20 minutes
daytime and evenings on sundays http://www.bart.gov/stations/schedules/lineSchedules_ROUTE11_SU.asp
be sure to get on the train going to Millbrae. Fare is $1.50, tickets can
be purchased for any amount so a $3.00 ticket for a roundtrip may be a
good idea. The ride to Millbrae takes 6 minutes. At Millbrae, transfer
to the Caltrain, being sure to go to the southbound track (furthest from
BART tracks) for trains to San Jose. On sundays http://caltrain.org/timetable_effective_8_1_05.html#weekend-southbound
the trains depart every hour at 24 minutes after the hour. The weekday
schedule will change on 10 October and is shown here http://caltrain.org/pdf/timetable_effective_10_10_05.pdf
Caltrain fare is
$3.50, be sure to buy a ticket from Zone 2 to Zone 3. The ride to
Palo Alto takes 38 minutes. From Palo Alto Transit Center, the VTA
#22 bus operates every 15 minutes and costs $1.75, no change is available
so
have correct fare ready. Be sure to ride the Eastbound bus going
to Eastridge Transit Center (NOT to Menlo Park Caltrain Station ).
The Westbound and
Eastbound #22 bus stops are at different locations at Palo Alto Transit
Center, with the final destination indicated on the sign, so be sure
to get on the correct bus. The ride takes about 17 minutes, get off
across the street from Dinah's Garden Hotel, which is less than half a
kilometer
past Arastradero Road.
The hotel website is: www.dinahshotel.com. The hotel direct
telephone from overseas or within the U.S. is: +1 650 493 2844. The address
is: Dinah’s Garden Hotel, 4261 El Camino Real, Palo Alto
CA 94306 USA.
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