Advanced
Technology Workshop on
Thermal Management
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Holiday Inn San Jose
San Jose, California USA
September 24-27, 2007
Advance Program
Hotel Cutoff and Early Registration Deadline: Extended to August 28th
General
Chair
Dave Saums
DS&A LLC
dsaums(AT)dsa-thermal.com
Tel: 978-499-4990
|
Program
Chair
David Copeland
Sun Microsystems, Inc.
david.copeland(AT)sun.com
Tel: 408-276-6528
|
Program Committee:
Cullen Bash, Hewlett-Packard Laboratories
Vadim Gektin, Sun Microsystems
Bill Maltz, Electronics Cooling Solutions
George Meyer, Celsia Technologies
John Peeples, The Citadel
Guy Wagner, RM Laboratories
|
Register On-Line | Hotel Reservations
Sessions: Market Drivers | Pumped Liquid Cooling | System Cooling | Air Cooling | Thermal Interface Materials |
Datacenter Cooling | Test and Equipment | High Conductivity Materials | Passive Phase-Change
Registration Fees
Monday, September 24
Registration: 5:30 pm - 6:30 pm
Opening Reception: 5:30 pm - 6:30 pm
Tuesday, September 25
Registration: 7:30 am - 5:30 pm
Continental Breakfast: 7:30 am - 8:30 am
Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:30 am - 10:00 am
Liquid Cooling Viability for Mainstream Microelectronics Thermal Management
Monem Alyaser, Asetek USA
Sustainable Information Technology Ecosystem
Cullen Bash, Chandrakant Patel, Hewlett-Packard Laboratories
Applications, Developments, and Forecast for Engineered Thermal Materials
David L. Saums, DS&A LLC
Break: 10:00 am - 10:30 am
SESSION 2: PUMPED LIQUID COOLING
Chair: John Peeples, The Citadel
10:30 am - 12:00 pm
SESSION 3: SYSTEM COOLING
Chair: William Maltz, Electronics Cooling Solutions
12:00 pm - 12:30 pm
Improved Thermal Management of Telecommunications
Cabinets using Surface Treatments
David Forder, TAG Technology
Lunch: 12:30 pm - 1:30 pm
SESSION 3: SYSTEM COOLING (Continues)
Chair: William Maltz, Electronics Cooling Solutions
1:30 pm - 4:00 pm
Evaluation of Cooling Solutions for Outdoor Electronics
Mahendra S. Wankhede, S. D. Mahajan, Vivek B. Khaire, Avijit
Goswami, PIET’s College of Engineering (COEP)
Thermally Driven Diffusion in Copper-Wirebonded Packages
Amip Shah, Hewlett Packard
Break: 3:00 pm - 3:30 pm
Thermal Characterization of Copper Contact Interconnect for
DRAM Package Stacking
Hongyu Ran, Tessera, Inc.
SESSION 4: AIR COOLING
Chair: Guy Wagner, RM Laboratories
4:00 pm - 5:30 pm
Optimization & Comparison of Techniques for the Heat Sink
Selection using Operations Research Methods
S. Manivannan, S. Prasanna Devi, Raja Rajeswari Engineering
College
Synthetic Jet Based Thermal Management Solutions with
High Reliability and Low Acoustics
Raghav Mahalingam, Nuventix, Inc.
Investigation of the Effects of Single Fan Failure in a Series
Fan Arrangement with Two Fans
Guy Wagner, RM Laboratories
Wednesday, September 26
Registration: 7:30 am - 5:30 pm
Continental Breakfast: 7:30 am - 8:30 am
SESSION 5: THERMAL INTERFACE MATERIALS
Chair: Dave Saums, DS&A LLC
8:30 am - 12:00 pm
Phase Change Metallic Alloy TIM2 Performance and
Reliability
Chris G. Macris, Robert G. Ebel, Christopher B. Leyerle, John C.
McCullough, Enerdyne Solutions
Silicone Thermal Interface Materials: High-Performance Heat
Dissipation Solutions
Jason D. Clark, Martin Stephan, Dow Corning Corporation
Break: 10:00 am - 10:30 am
Full Metal TIMs
Bob Jarrett, Jordan Ross. Indium Corporation of America
Effect of Single-Walled Carbon Nanotube Purity on the
Thermal Conductivity of Carbon Nanotube-Based Composites
Aiping Yu, Mikhail E. Itkis, Elena Bekyarova, Robert C. Haddon,
University of California – Riverside
Rheo-Mechanical Properties of Thermally Conductive Materials
Sanjay Misra, Kevin Hanson, The Bergquist Company
Lunch: 12:30 pm - 1:30 pm
SESSION 6: DATACENTER COOLING
Chair: Cullen Bash, Hewlett Packard Laboratories
1:30 pm - 3:00 pm
Thermal Zone Mapping: Data Center Design and
Assessment Automated Visualization Tool for Thermal Metric
Analysis
Christian J. Bonilla, Ernesto Ferrer, Cullen Bash, Hewlett-Packard
Laboratories
Mining Environmental Data in Data Centers
Lola Bautista, Ratnesh Sharma, Hewlett-Packard Laboratories
Analysis of Alternative Data Center Cooling Approaches
Herman Chu, Robert Hannemann, Cisco Systems, Inc.
Break: 3:00 pm - 3:30 pm
SESSION 7: TEST AND EQUIPMENT
Chair: Vadim Gektin, Sun Microsystems
3:30 pm - 5:30 pm
Si/SiGe Quantum Well Thermoelectric Materials and Devices
for Waste Heat Recovery From Vehicles and Industrial Plants
Saeid Ghamaty, Norbert B. Elsner, Hi-Z Technology, Inc.
High Performance Test Validation Tool Design for Debugging
Engineer in Chip-Maker Industry
Michael Spokoiny, Xinliang Qiu, Vladimir Zrodnikov, James M.
Kerner, United States Technology Consortium
Application-Specific Evaluation of Heatpipe Performance using Electrical Transient Testing Method
Yan Zhang, Hongyu Ran, Tessera, Inc.; Jimmy He, Flomerics Inc.
Thursday, September 27
Registration: 7:00 am - 12:30 pm
Continental Breakfast: 7:30 am - 8:30 am
SESSION 8: HIGH CONDUCTIVITY MATERIALS
Chair: David Copeland, Sun Microsystems
8:30 am - 10:00 am
A Preliminary Study of Optimization Techniques for Compact Thermal Model Development of Multi-Heat Source Components
Arun P. Raghupathy, Electronic Cooling Solutions Inc.
Graphite Reinforced Al with 750 W/mK Thermal Conductivity
and Controllable Thermal Expansion: Materials Behavior and
Prototype Modeling and Performance
James A. Cornie, Himanshu Pokharna, Mark J. Montesano, Metal
Matrix Cast Composite, LLC and WmK, LLC
Innovative Thermal Design for High Power LED Applications
Claus Peter Kluge, CeramTec AG
Break: 10:00 am - 10:30 am
SESSION 9: PASSIVE PHASE-CHANGE
Chair: George A. Meyer IV, Celsia Technologies LLC
10:30 am - 12:30 pm
Advanced Liquid Cooling Design and Performance
Geoff Lyon, CoolIT Systems Inc.
High Temperature and High Heat Flux Cooling for Electronics
William G. Anderson, Advanced Cooling Technologies, Inc.
Practical Application Guidelines for Vapor Chambers for
Electronics Thermal Management
George A. Meyer IV, Celsia Technologies LLC; David L. Saums,
DS&A LLC
Workshop Registration Fees
| Registration Type |
On or before 8/24 |
After 8/24 |
| IMAPS Member |
$615 |
$715 |
| Non-Member |
$715 |
$815 |
| Speaker, Chair, Chapter Officer |
$350 |
$450 |
| Student |
$200 |
$300 |
| Workshop Fees include an Abstract Book, all meals listed and a CD of Presentations. CD of Presentations will be mailed 3-4 weeks after the event. All registrations fees above also include a complimentary one-year membership for non-members or a membership extension/renewal for existing members. |
Register On-Line
Hotel Information -- Cut-off date extended to Tuesday, August 28, 2007.
Holiday Inn San Jose
1740 North First Street
San Jose, CA 95112
$129 + tax per night, single/double
Reservations:
On-line Reservations
Phone - (866) 241-9878 or (408) 793-3300
Rooms held Monday, Sept. 24 – Thursday Sept. 27. Rooms on hold for “IMAPS”. Cut-off date is Tuesday, August 28, 2007. Cancellations accepted without penalty up to 72 hours in advance. After 72 hours, guest will be billed one night’s room & tax.
