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Advanced Technology Workshop and Tabletop Exhibition on
Thermal Management

The Cabaña Hotel & Resort (A Crowne Plaza Resort)
Palo Alto, California - USA
October 13 - 16, 2008

Advance Program

Early Registration Deadline: October 3, 2008
Hotel Deadline: September 15, 2008

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Sun Microsystems, Inc.
Tel: 408-276-6580

Program Committee:
David Copeland, Sun Microsystems Inc.
Vadim Gektin, Sun Microsystems, Inc.
William Maltz, Electronic Cooling Solutions
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Jun Shen, Redback Networks, Inc. (An Ericsson Company)
Guy R. Wagner, Storage Genetics, Inc.

Registration Information | Register On-Line
Download Program PDF | Speaker Information | Hotel Reservations | Directions/Transportation

Tabletop Exhibition Information | Exhibiting Companies
Reserve Tabletop(s) (Sold Out)

Monday, October 13

Registration: 5:00 pm - 6:30 pm

Opening Reception: 5:30 pm - 6:30 pm

Tuesday, October 14

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: Noon – 5:00 pm

Opening Remarks: 8:30 am – 8:40 am

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:40 am – 12:00 pm

Mobile PCI Express Graphics Module (MXM) 3.0 specification:  Thermo-Mechanical Interchangeability
Joe Walters, Mohammed Tantoush, nVidia

Data Center Cooling: Comparison of Thermal Resistance and Pump Power for Circulating Air, Water, and Freon (Phase Change) Coolants
Ronald C. Crane, Clustered Systems Co.

Thermal Management in the Renewable Energy Market
Kevin Closson, Nerac

Break: 10:10 am – 10:30 am

An Overview of the Water Cooling System for the IBM Power 575 Supercomputer
Michael J. Ellsworth, Jr., International Business Machines Corporation

Preliminary Specification for a Closed Loop Liquid Cooling System Product Reliability Test Plan
Margaret B. Stern, David Copeland, Marlin Vogel, John Dunn, Don Kearns, Steve Lindquist, Sun Microsystems

Thermoelectric Power Harvesting from Small Engines
John Langley, Bor Yann Liaw, Ambient Micro; William Maltz, Electronic Cooling Solutions, Inc.; Guy Wagner, Storage Genetics, Inc.

Lunch: 12:00 pm – 1:30 pm

Session 2:  Thermal Interface Materials
Chair: Guy Wagner, Storage Genetics, Inc.
1:30 pm – 5:00 pm

Thermal Interface Material Market Outlook
Melanie Wuthenow, Prismark

Thermally Conductive Adhesives for Electronics Applications
John Timmerman, The Bergquist Company

Application and Performance Characteristics of Soft Metal Thermal Interface Materials for IGBT Applications
Dave Saums, DS&A LLC; Bob Jarrett, Jordan Ross, Indium Corporation; Alan Fairbairn, Indium Corporation UK; Wolfgang Bloching, GPS Technologies GmbH

Break: 3:00 pm – 3:30 pm

Equipment and Methodology for Consistent High Quality Stencil Printing of Phase Change Thermal Interface Material
Andrew D. Delano, Richard Xu, Honeywell

Stress Minimization during Deflection of Thermally Conductive Gap Pads
Karen Bruzda, Laird Technologies

Materials and Substrates for LED Thermal Management
Justin Kolbe, Sanjay Misra, The Bergquist Company

Dinner: 5:00 pm – 6:30 pm

Session 3: Equipment and Test
Chair: Jun Shen, Redback Networks, Inc. (An Ericsson Company)
6:30 pm – 8:00 pm

Thermal Test Chip - Definition, Design and Applications
Bernie Siegal, Thermal Engineering Associates, Inc.

Thermo-Mechanical Design Challenges in Validation Platforms
Rahima K. Mohammed, Ashok Kabadi, Intel Corporation

Thermal Management System with Passive Cooling Modules
Michael Spokoiny, Vladimir Zrodnikov, Xinliang Qiu, James M. Kerner, United States Technology Consortium

Wednesday, October 15

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: 10:00 am – 3:00 pm

Session 4: Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
8:30 am – 12:00 pm

Thermal Interface Materials Characterization and Development by Computer Modeling and in Package Testing
David A. Zoba, LORD Corporation

Thermal Characterization of a Half mPCI Express Card and Associated Devices
Raj Bahadur, Carlton Hanna, Upendra Sheth, Intel Corporation

Why Mathematical Modeling is a Necessity to Manage the Cooling/Energy Efficiency in Today’s Mission Critical Facilities
Sherman Ikemoto, Akhil Docca, Future Facilities Inc.

Break: 10:00 am – 10:30 am


Transient Multiscale Thermal Modeling of Electronic Enclosures*
Qihong Nie, Yogendra Joshi, Georgia Institute of Technology


Experimental and Numerical Study of Thermal Interface Material Performance*
Parisa Pour Shahid Saeed Abadi, Chuangang Lin, D.D.L. Chung, University at Buffalo, State University of New York

Enabling Dynamic Voltage & Frequency Scaling In Next-GenerationMicroprocessors: Thermal & Reliability Considerations
Sai Ankireddi, David Copeland, Sun Microsystems Inc.

Lunch: 12:00 pm – 1:30 pm

Session 5: Thermal Analysis II
Chair: George A. Meyer IV, Celsia Technologies
1:30 pm – 5:00 pm


Development of Boundary Condition Independent Reduced Order Models using POD*
Arun P. Raghupathy, Attila Aranyosi, William Maltz, Electronic Cooling Solutions Inc.; Karman Ghia, Urmila Ghia, University of Cincinnati

Solving Transient Non-Linear Heat Transfer Problems using a Spreadsheet
Guy R. Wagner, Storage Genetics, Inc.

Unraveling the Mystery of Equivalent Thermal Conductivities for Heat Pipe and Vapor Chambers
George A. Meyer IV, Sobo Sun, Celsia Technologies

Break: 3:00 pm – 3:30 pm


Heat Sink Effect of a Gold Wire Bond Next to Hot Spots on a Microchip*
Michael McCracken, Michael Mayer, John Persic, University of Waterloo - Microjoining Laboratory


Bias-Dependent MOS Transistors Thermal Resistance and Non-uniform Self-heating Temperature*
Xi Wang, James Chritofferson, Ali Shakouri, University of California Santa Cruz

Competitive Advantage through Strategic System Thermal Design
Denise Pliskin, Speck Design

Dinner: 5:00 pm – 6:30 pm

Session 6: System Cooling
Chair: William Maltz, Electronic Cooling Solutions
6:30 pm – 8:00 pm

Sub-Ambient Cooling System Overview
Gerald Wyatt, Dick Weber, Raytheon


Chimney Effect on Natural Convection Cooling of Electronic Components*
Bjorn Vermeersch, G. De Mey, M. Wojcik, J. Pilarski, M. Lasota, J. Banaszczyk, A. Napieralski, M. De Paepe, University of Ghent

Advances in Telecommunications Thermal Management Solutions
Rick Schmidt, Dantherm Air Handling, Inc.

Thursday, October 16

Registration: 7:30 am – 4:50 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 7: High Conductivity Materials
Chair: Dave Saums, DS&A LLC
8:30 am – 12:00 pm

Natural Graphite Reinforced Al and Cu Alloys with Thermal Conductivity 2 x Cu and Thermal Expansion Matched to Advanced Semiconductors
James A. Cornie, Rob Hay, Steve Cornie, Shiyu Zhang, Metal Matrix Composite, LLC and WmK LLC

The use of Diamond Composite Baseplates for Thermal Management of Power Electronic Modules
Svetlana Levchuk, G. Mitic, M. Poebl, Siemens AG

High Performance Pyrolytic Graphite Heat Spreaders – Near Isotropic Structures with Metallization
Richard J. Lemak, R. J. Moskaitis, MINTEQ International, Inc.; D. Pickrell, D. Kupp, A. M. Yocum, Omega Piezo Technologies, Inc.

Break: 10:00 am – 10:30 am

Diamond Materials for Thermal Applications
Thomas Obeloer, David Rowcliffe, Harris International

Thermal Reliability of Advanced Metal Diamond Composites
Ravi Bollina, Janet Linke, Tobias Mrotzek, Sven Knippscheer, Plansee SE

Advances in Material Design and Processing for Thermal Management Solutions
Birol Sonuparlak, Rogers Corporation

Lunch: 12:00 pm – 1:30 pm

Session 8: Liquid Cooling
Chair: John Peeples, The Citadel
1:30 pm – 4:50 pm

Vaporizable Dielectric Fluid Cooling for IGBT and Power Semiconductor Applications
Dave Saums, DS&A LLC; David Levett, Infineon Technologies; Jeremy Howes, Parker Hannifin; Joe Marsala, Thermal Form & Function Inc.

Automatic Purging of Non-Condensable Gases from 2-Phase Immersion Cooling Systems
Phillip E. Tuma, 3M Company

Immersion Cooling of Power Electronics in Segregated Hydrofluoroether Liquids
Cindy Barnes, Phillip E. Tuma, 3M Company

Break: 3:00 pm – 3:20 pm


Flow Study in Magnetic Micro-Channel Heat Pipe*
B. J. Wang, C. R. Chen, J. R. Tsai, W. F. Lee, C. H. Chen, C. Y. Chen, NSPO/NYUST/NKIT/NCTU

Passive Phase Change Tower Heat Sink & Pumped Coolant Technologies for Next Generation CPU Module Thermal Designs
Marlin Vogel, David Copeland, Andrew Masto, Sun Microsystems Inc.; Sukhvinder Kang, Brad Whitney, Aavid Thermalloy; Matt Connors, Thermacore; Joe Marsala, Thermal Form and Function


Model for Energy Transport in Nanofluids*
Vijaya Kumar Kollipar, Emmanuel C. Nsofor, Southern Illinois University

Closing Remarks: 4:50 pm

Registration Information:(Early Registration Deadline: October 3, 2008)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

Early Fee
Through 10/3/08
Advance/Onsite Fee
After 10/3/08
IMAPS Member
Chapter Officer
Exhibits Only

Register On-line

Speaker Dates/Information:

  • Abstract due: August 22, 2008
  • Speaker Notification/Confirmation emailed: August 29, 2008
  • Extended Abstract or Presentation Material due: September 12, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: October 16, 2008
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)

Hotel Information -- Cut off: Monday Sept. 15, 2008

The Cabana Hotel Palo Alto – A Crowne Plaza Resort
4290 El Camino Real
Palo Alto, CA 94306

Rate: Single/Double $190

Phone Reservations: (800) 593-5447, mention International Microelectronics and Packaging Society

Online Reservations – Group Code – IMA


From/To San Jose Airport:

The Valley Transportation Authority (VTA) operates the Airport Flyer, a free shuttle bus which operates every 15 minutes. The bus stops twice at the airport, once at Terminal A (actually a little bit east of Terminal A, to the right of and across the street from the building with the landing gates and to the left of and on the same side of the street as the building with baggage claim.

The stop for Terminal C is across from the exit from baggage claim, a little bit to the west, left after exiting. Be sure to get on the Westbound bus going to Santa Clara Transit Center, not the Eastbound bus to Metro/Airport Light Rail Station. This is also the same stop as the shuttle buses for Long Term Parking and Rental Cars, so avoid those buses as well. The Westbound bus schedule is also posted on signs at the bus stops.

At the Santa Clara Transit Center, go to the stop for bus number 22 Westbound to Palo Alto, being sure to avoid riding the 22 Eastbound to Eastridge. The stops for Westbound 22 to Palo Alto and Eastbound 22 to Eastridge are at different locations, so be sure to wait at the correct stop. The bus runs about every 12 minutes and a schedule is also posted at the bus stop. The bus ride costs $1.75 and no change is given, so be sure to have exact fare.

The bus ride takes about 45 minutes. The hotel is located at 4290 El Camino Real, Palo Alto CA 94306, just across the street from Dinah's Court. After stopping at a major bus terminal at El Camino Real and Showers Drive, next to a large shopping center, the bus will pass San Antonio Road, Del Medio Avenue, Cesano Court (there will be a bus stop at Cesano Court), Monroe Drive and Dinah's Court. The nearest bus stop is just after Dinah's Court, pull the cord to inform the driver that you wish to stop after passing the Cesano Court bus stop. Between San Antonio Road and Dinah's Court the bus will pass the San Antonio Inn, Holiday Inn Express, Country Inn Motel, Motel 6 and Oak Motel on the right before the bus stop at Dinah's Garden Hotel. The Crowne Plaza Cabana is directly across the street from Dinah's.

From/To San Francisco Airport:

The San Francisco subway system, Bay Area Rapid Transit (BART) has a station in the International Terminal. The trip from the airport to Millbrae station takes 11 minutes and costs $1.50.

From the airport, take the train four minutes to the first stop, San Bruno. At San Bruno, change to the train across the platform for Millbrae. There is only a four minute wait. From San Bruno to Millbrae requires five minutes. Trains operate every 15 minutes most of the day, detailed schedules are found at

From Millbrae, the next ride is on Caltrain to Palo Alto, which takes 30 or 32 minutes mid-day (longer on evenings and weekends) and costs $4.00. Be sure to ride the Southbound train toward San Jose and not the Northbound train toward San Francisco. Tickets must be purchased before boarding the train. Schedules are found at

From Palo Alto Transit Center, go to the stop for bus number 22 Eastbound to Eastridge. The bus runs about every 12 minutes and costs $1.75. No change is given, so be sure to have exact fare. The bus ride takes about 16 minutes. The bus will pass Page Mill Road, Super 8 Motel, Creekside Inn and Townhouse Inn on the right, then cross Arastradero Road, then pass America's Best Value Inn and Days Inn. The Crowne Plaza Cabana will be on the right with a bus stop in front. Please pull the cord to inform the driver that you wish to stop shortly after passing the bus stop near Arastradero Road.


Student Stipend Funding provided by:

Celsia Technologies


Electronic Cooling Solutions, Inc.

Hewlett-Packard Laboratories

International Microelectronics And Packaging Society

Sun Microsystems

The Microelectronics Foundation

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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