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Advanced Technology Workshop and Tabletop Exhibition on
Thermal Management

Dinah's Garden Hotel
Palo Alto, California - USA
October 6 - 8, 2009

Advance Program

Early Registration Deadline: September 18, 2009
Hotel Cut-off: September 18, 2009

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Sun Microsystems, Inc.
vadim.gektin@sun.com
Tel: 408-276-6580

Program Committee:
David Copeland, Sun Microsystems Inc.
Vadim Gektin, Sun Microsystems, Inc.
William Maltz, Electronic Cooling Solutions
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Guy R. Wagner, Storage Genetics, Inc.


Registration Information | Register On-Line
Download Program PDF | Speaker Information | Hotel Reservations | Directions/Transportation

Tabletop Exhibit Application | Reserve Tabletop(s) | 2009 Exhibiting Companies


Tuesday, October 6

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: Noon – 5:30 pm

Opening Remarks: 8:25 am – 8:30 am

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:30 am – 11:30 am

Thermal Challenges and Requirements in Designing for Telco/Telcom Equipment in the NEBS Environment
Herman Chu, Cisco Systems, Inc.

Thermal Management Challenges for Hybrid Vehicle Powertrain Drives
David Saums, DS&A LLC

Advanced Module Concepts
Andreas Schletz, M. März, E. Shimaneck, Fraunhofer IISB

Break: 10:00 am – 10:30 am

Thermal Characterization of High Power LEDS - An Introduction to the Issues
Bernie Siegal, Thermal Engineering Associates, Inc.

Pool-Boiling Based Heat Sink Solutions
Jesse Kim, S.M. You, Joo H. Kim, Vapro Inc.

Session 2:  Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm

Student
Competition
Winner

Chronicles from the Frequency Domain: Benefits and Applications of AC Thermal Modeling, Simulation and Measurement
Bjorn Vermeersch, Gilbert De Mey, Jedrzej Banaszczyk, Ali Shakouri, Kofi Makinwa, Ghent University

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)

Student
Competition
Winner

Multi Objective Optimization of Force Fed Microchannel Heat Sinks
Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi, University of Maryland


Thermal Management Requirements of Photonic Nanohole Array Sensors
Mehmet Sen, Gregory J. Kowalski, Dale Larson, Northeastern University

Characterization of Single-Phase Heat Transfer and Hydraulic Performance in Non-Uniformly Heated Microgap Channels
Ihab Andre Ali, Avram Bar-Cohen, University of Maryland; Ceferino Sanchez, William Maltz, Electronic Cooling Solutions Inc.

Break: 3:00 pm – 3:30 pm

Session 3: Liquid Cooling
Chair: John Peeples, The Citadel
3:30 pm – 5:30 pm

Student
Competition
Winner

System Package Embedded Active Liquid Cooling using 3D-MID Technology (Molded Interconnect Devices)
Thomas Leneke, Sören Hirsch, TEPROSA - Otto-von-Guericke-University Magdeburg

Cooling for IGBTs in Small Channels Based on Velocity and Length Using Common Cooling Liquid
Christopher A. Soule, Thermshield LLC

Development of Heat Pipe Loop Technology for Electronics Cooling
Xudong Tang, Jens Weyant, Scott Garner, Jon Zuo, Advanced Cooling Technologies, Inc.

Surface Roughness Effects on Boiling Heat Transfer
Benjamin J. Jones, Suresh V. Garimella, Purdue University

Dinner: 5:30 pm – 7:00 pm

Session 4: System Cooling
Chair: John Peeples, The Citadel
7:00 pm – 8:30 pm

Low Profile Heat Pipe Heat Sink and Green Performance Characterization for Next Generation CPU Module Thermal Designs
Marlin Vogel, G. Xu, D. Copeland, Sun Microsystems, Inc.; S. Kang, B. Whitney, Aavid Thermalloy; G. Meyer, Celsia; K. Kawabata, Furukawa; M. Connors, Thermacore

Thin Film Thermoelectric Heat Pump Chip Cooler
John Archibald, Northfield Engineering Company

Student
Competition
Winner

Simulation of a Thermoelectric Adsorption Heat Pump for Harsh Environment Electronics Cooling
Ashish Sinha, Yogendra K. Joshi, Georgia Institute of Technology


Wednesday, October 7

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: 10:00 am – 3:00 pm

Session 5: Data Center Cooling
Chair: George A. Meyer IV, Celsia Technologies
8:30 am – 11:30 am

The Energy Efficiency Advantage of Water Cooling IT Equipment in the Data Center
Michael J. Ellsworth, Jr., IBM Corporation

A Scalable Thermal Management Architecture for Energy Efficient Containerized Data Center Cooling
Joe Marsala, Rob Hannemann, Thermal Form & Function Inc.

KRATOS: Automated Management of Data Center Cooling Capacity with Adaptive Vent Tiles
Alan McReynolds, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Monem Beitelmal, Rocky Shih, Hewlett Packard

Break: 10:00 am – 10:30 am

Cold Aisle Containment and Energy Efficiency of the Data Center
Ali Heydari, Veerendra Mulay, Facebook Inc.

A Cold Plate Cooling System for Servers and other Electronic Enclosures
Phil Hughes, Robert Lipp, Clustered Systems Company, Inc.

Session 6: Thermal Analysis II
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm

Thermomechanical Optimization of a Novel High Density Interconnect (HDI) Substrate
Brian R. Smith, Peter Kwok, Andrew Mueller, Livia Racz, Draper Laboratory

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)

Thermal Analysis of High Power LEDs at Dynamic Conditions
Bohan Yan, Nguyen Tran, Frank G. Shi, University of California-Irvine

Capturing PCB Artwork for Thermal Design
John Wilson, Mentor Graphics Corporation

Operating ICs Hotter to Dissipate Power
James J. Wang, Power Gold LLC

Break: 3:00 pm – 3:30 pm

Session 7: Thermal Interface Materials
Chair: Guy R. Wagner, Storage Genetics, Inc.
3:30 pm – 5:30 pm

Lead-Free Sintered Adhesives for High-Brightness Light Emitting Diode (HB-LED) Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Thermal Interface Material Performance of Commercial Particle-Filled Products with Carbon-Based Nanostructure Inclusions
Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Drazen Fabris, Cary Y. Yang, Santa Clara University

Thermally Conductive Liquid Materials for Electronics Packaging
Sanjay Misra, John Timmerman, The Bergquist Company

Metallic Thermal Interface and Die Attach Materials for IGBT Power Semiconductor Modules
Amanda Hartnett, Jordan Ross, Indium Corporation; David L. Saums, DS&A LLC; Wolfgang Bloching, Indium Corporation of Europe

Dinner: 5:30 pm – 7:00 pm

A Highly Thermally Conductive No Pump-Out Grease: Properties and Applications
Sara N. Paisner, LORD Corporation

Session 8: High Conductivity Materials I
Chair: William Maltz, Electronic Cooling Solutions
7:30 pm – 8:30 pm

Comparison of Temperature Cycling Behavior of Power Substrates Based on Different Advanced Joining Technologies and Substrate Materials
Alexander Roth, Marianna Ponomarenko, Matthias Knörr, Andreas Schletz, Fraunhofer IISB

Alkali Silicate Glass Based Hermetic Thermal Coatings
Ross Wilcoxon, Nathan Lower, Rockwell Collins, Inc.

Session 8 continues Thursday morning


Thursday, October 8

Registration: 7:30 am – 12:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 8: High Conductivity Materials I (continues)
Chair: William Maltz, Electronic Cooling Solutions
8:30 am – 9:30 am

Thermophysical Properties Measurements of High Thermal Conductive Organic Hybrid Materials by Sinusoidal Heating Thermoreflectance Technique
S. H. Firoz, T. Yagi, N. Taketoshi, T. Baba, AIST

Optimal Micro Heat Pipe Configuration for High Performance Heat Spreaders
Seema Singh, Nicole Okamoto, San Jose State University

Session 9: High Conductivity Materials II
Chair: William Maltz, Electronic Cooling Solutions
9:30 am – 12:00 pm

Recent Advances in the Development and Application of Higher Thermal Conductivity Graphite Heat Spreader Materials
Julian Norley, GrafTech International Ltd.

Break: 10:00 am – 10:30 am

Thermal Cycling Stability of High Thermal Conductive Diamondmetal Matrix Composites
Michael Kitzmantel, Vienna University of Technology; Neubauer Erich, Kapaun Wolfgang, Austrian Institute of Technology GmbH; Angerer Paul, CEST-Kompetenzzentrum für elektrochemische Oberflächentechnologie GmbH; Ivi Smid, Kristina Cowan-Giger Kristina, Pennsylvania State University

Natural Graphite Reinforced Aluminum: A Cost/Performance Paradigm Changing Technology for High Heat Flux Thermal Management
James A. Cornie, Rob Hay, Kevin Fennessy, Steve Cornie, Metal Matrix Composites

Closing Remarks: 11:30 pm

Register On-line


Registration Information:(Early Registration Deadline: September 18, 2009)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

Type
Early Fee
Through Sep 18, 2009
Advance/Onsite Fee
After Sep 18, 2009
IMAPS Member
$650
$750
Non-Member
$775
$875
Speaker
$425
$525
Chair
$425
$525
Student
$225
$325
Chapter Officer
$425
$525
Exhibits Only and Additional Booth Personnel
Complimentary Hall Pass

Lunch Tickets - $35/day

All Meals - $100/day
Complimentary Hall Pass

Lunch Tickets - $35/day

All Meals - $100/day

Register On-line


Speaker Dates/Information:

  • Extended Abstract or Presentation Material due: September 4, 2009
  • Powerpoint/Presentation file for CD-Rom due not later than: October 8, 2009
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Information -- Cut off: September 18, 2009

Dinah’s Garden Hotel
4261 El Camino Real
Palo Alto, CA 94306

Room Rate: $120 per night plus tax (Single/Double)

Call: 1-800-227-8220 or Local: 1-650-493-2844, ask for “IMAPS October Meeting”
www.dinahshotel.com


Directions/Transportation

From/To San Jose Airport:

The Valley Transportation Authority (VTA) http://www.vta.org/ operates the Airport Flyer, a free shuttle bus http://www.vta.org/schedules/SC_10.html which operates every 15 minutes. The bus stops twice at the airport, once at Terminal A (actually a little bit east of Terminal A, to the right of and across the street from the building with the landing gates and to the left of and on the same side of the street as the building with baggage claim.

The stop for Terminal C is across from the exit from baggage claim, a little bit to the west, left after exiting. Be sure to get on the Westbound bus going to Santa Clara Transit Center, not the Eastbound bus to Metro/Airport Light Rail Station. This is also the same stop as the shuttle buses for Long Term Parking and Rental Cars, so avoid those buses as well. The Westbound bus schedule http://www.vta.org/schedules/SC_10WE_WK.html is also posted on signs at the bus stops.

At the Santa Clara Transit Center, go to the stop for bus number 22 http://www.vta.org/schedules/SC_22.html Westbound to Palo Alto, being sure to avoid riding the 22 Eastbound to Eastridge. The stops for Westbound 22 to Palo Alto and Eastbound 22 to Eastridge are at different locations, so be sure to wait at the correct stop. The bus runs about every 12 minutes http://www.vta.org/schedules/SC_22WE_WK.html and a schedule is also posted at the bus stop. The bus ride costs $1.75 and no change is given, so be sure to have exact fare.

The bus ride takes about 45 minutes. The hotel is located at 4290 El Camino Real, Palo Alto CA 94306, just across the street from Dinah's Court. After stopping at a major bus terminal at El Camino Real and Showers Drive, next to a large shopping center, the bus will pass San Antonio Road, Del Medio Avenue, Cesano Court (there will be a bus stop at Cesano Court), Monroe Drive and Dinah's Court. The nearest bus stop is just after Dinah's Court, pull the cord to inform the driver that you wish to stop after passing the Cesano Court bus stop. Between San Antonio Road and Dinah's Court the bus will pass the San Antonio Inn, Holiday Inn Express, Country Inn Motel, Motel 6 and Oak Motel on the right before the bus stop at Dinah's Garden Hotel. The Crowne Plaza Cabana is directly across the street from Dinah's.

From/To San Francisco Airport:

The San Francisco subway system, Bay Area Rapid Transit (BART) http://bart.gov/ has a station in the International Terminal. The trip from the airport to Millbrae station takes 11 minutes and costs $1.50.

From the airport, take the train four minutes to the first stop, San Bruno. At San Bruno, change to the train across the platform for Millbrae. There is only a four minute wait. From San Bruno to Millbrae requires five minutes. Trains operate every 15 minutes most of the day, detailed schedules are found at http://bart.gov/schedules/index.aspx

From Millbrae, the next ride is on Caltrain http://caltrain.org/ to Palo Alto, which takes 30 or 32 minutes mid-day (longer on evenings and weekends) and costs $4.00. Be sure to ride the Southbound train toward San Jose and not the Northbound train toward San Francisco. Tickets must be purchased before boarding the train. Schedules are found at http://caltrain.org/timetable.html

From Palo Alto Transit Center, go to the stop for bus number 22 http://www.vta.org/schedules/SC_22.html Eastbound to Eastridge. The bus runs about every 12 minutes http://www.vta.org/schedules/SC_22EA_WK.html and costs $1.75. No change is given, so be sure to have exact fare. The bus ride takes about 16 minutes. The bus will pass Page Mill Road, Super 8 Motel, Creekside Inn and Townhouse Inn on the right, then cross Arastradero Road, then pass America's Best Value Inn and Days Inn. The Crowne Plaza Cabana will be on the right with a bus stop in front. Please pull the cord to inform the driver that you wish to stop shortly after passing the bus stop near Arastradero Road.

 


Sponsored by:


Hewlett-Packard Laboratories


Student Stipend Funding provided by:


Electronic Cooling Solutions, Inc.

Sun Microsystems

DS&A


The Microelectronics Foundation

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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