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Advanced Technology Workshop on
Thermal Management

Dinah's Garden Hotel
Palo Alto, California - USA
November 7-9, 2011

Extended Early Registration Deadline: October 26, 2011
Hotel Deadline: October 14, 2011

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
atw11.programchair@gmail.com

Program Committee:
David Copeland, Oracle
Andrew Delano, Honeywell Electronic Materials
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATD
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.


Purchase Workshop CD-Rom

Download Program PDF | Tabletop Exhibit Information | 2011 Exhibitors
Speaker Info | Hotel

Co-located with ATW on System Level Packaging (Nov 10-11)


This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems. 

Monday, November 7, 2011

Registration:  1:00 pm - 8:30 pm

Opening Remarks:  1:55 pm - 2:00 pm

Session 1:  Market Drivers
Chair:  Dave Saums, DS&A LLC
2:00 pm - 3:30 pm

Thermal Packaging - The Inward Migration
Avram Bar-Cohen, DARPA-MTO

Market Needs for Thermal Materials Developments for Semiconductor Packaging
David L. Saums, DS&A LLC

Unique Engineering Concept to Extend Future of Active Cooling
Roger Dickinson, Bergquist Company

Break:  3:30 pm - 4:00 pm

Session 2:  Thermal and Packaging Materials I
Chair: Guy R. Wagner, Electronic Cooling Solutions
4:00 pm - 5:30 pm

Nanoscale Polymer Coatings for Enhanced Bonding and Thermal Conductance in Carbon Nanotube Array Interfaces
Baratunde A. Cola, John H. Taphouse, Thomas L. Bougher, Georgia Institute of Technology

The Art of TIM Thermal Measurements
Bernie Siegal, Thermal Engineering Assocites, Inc.

Direct Aluminum Soldering Paste
William Avery, Superior Flux and Mfg. Co.

Dinner: 5:30 pm - 7:00 pm

Session 3:  Thermal and Packaging Materials II
Chair: Guy R. Wagner, Electronic Cooling Solutions
7:00 pm - 8:30 pm

Applications of Thermal Interface Materials in Test of IC Packages
Jaime A. Sanchez, Intel Corporation

Liquid Adhesive Selection and Performance in Electronics Applications
John Timmerman, Sanjay Misra, Bergquist Company

Indium Heat-Spring® and Its Use In RF Flangeless Packages
Ben Samples, Dick Frey, Microsemi; Seth Homer, Indium Corporation


Tuesday, November 8, 2011

Registration:  8:00 am - 9:00 pm

Continental Breakfast:  8:00 am - 9:00 am

Exhibit Opens:  During Breaks & Lunch

Session 4:  Thermal and Packaging Materials III
Chair:  Andrew Delano, Honeywell Electronic Materials
9:00 am - 10:30 am

Thermal Pyrolytic Graphite Composite with Coefficient of Thermal Expansion Machining for Advanced Thermal Management 
Wei Fan, Xiang Liu, John Mariner, Momentive Performance Materials

Advances in High Performance Pyrolytic Graphite Heat Spreaders
Robert J. Moskaitis, Richard J. Lemak, MINTEQ International; Yoshi Nogami, THERMOGRAPHITICS Inc.

Copper MetGraf™ Composite Cores for PCB Thermal Control
Robert A. Hay, M. Ryals, K. Fennessy, Metal Matrix Cast Composites, LLC

Break:  10:30 am - 11:00 am

Session 5:  Thermal Analysis and Modeling I
Chair:  David Copeland, Oracle
11:00 am - 12:30 pm

Student
Competition
Presentation

Mitigating Transient Hotspots Using Dynamic Thermal Management and Two-Phase Microfluidic Heat Exchangers
Josef L. Miler, Kenneth E. Goodson, Stanford University

Effect of Packaging Miniaturization on Heat Sinking COTS Processors
Brian Smith, Peter Kwok, Draper Laboratory

High-Speed Thermoreflectance Imaging for Thermoelectric Device and Semiconductor Material Characterisation
Bjorn Vermeersch, Je-Hyeong Bahk, James Christofferson, Ali Shakouri, University of California, Santa Cruz

Lunch:  12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Session 6:  Thermal Analysis and Modeling II
Chair: David Copeland, Oracle
2:00 pm - 3:30 pm

Driving Down Data Center Power Consumption Through Thermal Management Optimization
Timothy A. Shedd, Jacqueline Rehagen, University of Wisconsin-Madison

Calibration and Temperature Sensitivity in Thermoreflectance and Infrared Imaging
Kazuaki Yazawa, Dustin Kending, MicrosanJ LLC; Ali Shakouri, UC Santa Cruz

Characterization of Thermo-Electric Coolers and Applications to Test of IC Packages
Jaime A. Sanchez, Intel Corporation

Break: 3:30 pm - 4:00 pm

Session 7:  Thermal Analysis and Modeling III
Chair: Tannaz Harirchian, Intel ATD
4:00 pm - 5:30 pm

Student
Competition
Presentation

Performance of Liquid-Based Microchannel Cooling with Application to Electronics on Aircraft
Bryce Shaffer, Eckhard Groll, Purdue University

Identifying Thermal Bottlenecks and Shortcut Opportunities in Electronics Cooling Applications
Travis Mikjaniec, Robin Bornoff, Mentor Graphics Corporation

Elevator Shaft Vapor Intrusion Modeling using Computational Fluid Dynamics
Charles R Ortloff, CFD Consultants International; Guy R Wagner, Electronic Cooling Solutions, Inc.

Dinner: 5:30 pm – 7:00 pm

Session 8: System Cooling I
Chair: Marlin Vogel, Juniper Networks
7:00 pm - 9:00 pm

Student
Competition
Presentation

Concentrated Solar Thermoelectric Co-Generation Systems
Vernon K. Wong, Kazuaki Yazawa, Ali Shakouri, University of California, Santa Cruz

Moisture Control for Electronic Packaging
Kenneth Credle, Sam Incorvia, Multisorb Technologies

Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Brian A. English, Michael R. Whitley, Michael S. Kranz, EngeniusMicro LLC; Tracy Hudson, U.S. Army RDECOM AMRDEC

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes with Rectangular Shape Evaporators
Z. R. Lin, Z. Y. Lee and L. W. Zhang, Novark Technology Inc.; S. F. Wang, China Southern University of Technology


Wednesday, November 9, 2011

Registration: 8:00 am - 5:30 pm

Continental Breakfast: 8:00 am - 9:00 am

Exhibit Opens: During Breaks & Lunch

Session 9:  System Cooling II
Chair: Marlin Vogel, Juniper Networks
9:00 am - 10:30 am

Development of a Piezo-Actuator Cooling Technology with Applications to Low Power Electronics
Parisa Foroughi, Ioan Sauciuc, Ketan R. Shah, Intel Corporation; Hiroaki Wada, Gaku Kamitani, Murata Manufacturing Co., Ltd.

Improving Cooling System Acoustics, Power and Reliability Using Synjets for Fan Augmentation
Raghav Mahalingam, Nuventix

Modeling of Fan Failures in Networking Enclosures
Susheela Narasimhan, Cisco Systems Inc.; Gokul Shankaran, Ansys Inc.

Break:  10:30 am - 11:00 am

Session 10:  Data Center Cooling
Chair: George A. Meyer IV, Celsia Technologies
11:00 am - 12:30 pm

Passive 2-Phase Immersion of Datacom Equipment - A Comparison to Water Cooling
Phillip Tuma, 3M Company

Economizer Based Server Liquid Cooling to Enable Significant Data Center Energy Savings
Madhusudan Iyengar, Timothy Chainer, Michael Gaynes, Pritish R Parida, Mark Schultz, Milnes P. David, David Graybill, Vinod Kamath, Bejoy J. Kochuparambil, IBM Corporation

Thermodynamic Performance of Containerized Eco-POD Data Centers
Niru Kumari, Wade Vinson, Tahir Cader, Amip Shah, Cullen Bash, Matt Slaby, Zhikui Wang, Carlos Felix, Abdiel Aviles, Miguel Figueroa, Hewlett-Packard Company

Lunch:  12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Session 11:  Liquid, Phase-Change, and Refrigeration Cooling I
Chair:  John Peeples, The Citadel
2:00 pm - 3:30 pm

A Study of Thermal Transport of Nanofluids and Their Suitability for Electronics Cooling
Dong Liu, Leyuan Yu, University of Houston

Server Power Reduction Through On-Chip Liquid Cooling
Geoff Lyon, Coolit Systems

Thermal and Hydraulic Performance of Metal Oxide - Based Nanofluids in Heat Exchangers
Sanjida Tamanna, Ehsan Yakhshi-Tafti, Howard Pearlman, Advanced Cooling Technologies

Break:   3:30 pm - 4:00 pm

Session 12:  Liquid, Phase-Change, and Refrigeration Cooling II
Chair:  John Peeples, The Citadel
4:00 pm - 5:00 pm

Highly Efficient Electronics Thermal Management Using Two-Phase Impinging Jets
Timothy A. Shedd, University of Wisconsin-Madison

Collider Jets Cooling Method of Microprossesors
Mikhail Spokoyny, A.J. Drexel University; Vladimir Trofimov, Odessa National Polytechnic University - Ukraine

An Open Power and Cooling Architecture
Phil Hughes, Clustered Systems Company, Inc.

Closing Remarks:  5:00 pm

 

 


Speaker Dates/Information:

  • Abstracts due: September 19, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: November 9, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Information -- Hotel Reservation Deadline: October 14, 2011

Dinah’s Garden Hotel
4261 El Camino Real
Palo Alto, CA 94306
www.dinahshotel.com

Single/Double: $130+ tax per night
Rooms include complimentary wireless internet and parking as well as 15% off meals at Trader Vic's onsite.

Check-in: 3:00pm
Check-out: 12:00pm


Directions/Transportation

From/To San Jose Airport:

The Valley Transportation Authority (VTA) http://www.vta.org/ operates the Airport Flyer, a free shuttle bus http://www.vta.org/schedules/SC_10.html which operates every 15 minutes. The bus stops twice at the airport, once at Terminal A (actually a little bit east of Terminal A, to the right of and across the street from the building with the landing gates and to the left of and on the same side of the street as the building with baggage claim.

The stop for Terminal C is across from the exit from baggage claim, a little bit to the west, left after exiting. Be sure to get on the Westbound bus going to Santa Clara Transit Center, not the Eastbound bus to Metro/Airport Light Rail Station. This is also the same stop as the shuttle buses for Long Term Parking and Rental Cars, so avoid those buses as well. The Westbound bus schedule http://www.vta.org/schedules/SC_10WE_WK.html is also posted on signs at the bus stops.

At the Santa Clara Transit Center, go to the stop for bus number 22 http://www.vta.org/schedules/SC_22.html Westbound to Palo Alto, being sure to avoid riding the 22 Eastbound to Eastridge. The stops for Westbound 22 to Palo Alto and Eastbound 22 to Eastridge are at different locations, so be sure to wait at the correct stop. The bus runs about every 12 minutes http://www.vta.org/schedules/SC_22WE_WK.html and a schedule is also posted at the bus stop. The bus ride costs $1.75 and no change is given, so be sure to have exact fare.

The bus ride takes about 45 minutes. The hotel is located at 4290 El Camino Real, Palo Alto CA 94306, just across the street from Dinah's Court. After stopping at a major bus terminal at El Camino Real and Showers Drive, next to a large shopping center, the bus will pass San Antonio Road, Del Medio Avenue, Cesano Court (there will be a bus stop at Cesano Court), Monroe Drive and Dinah's Court. The nearest bus stop is just after Dinah's Court, pull the cord to inform the driver that you wish to stop after passing the Cesano Court bus stop. Between San Antonio Road and Dinah's Court the bus will pass the San Antonio Inn, Holiday Inn Express, Country Inn Motel, Motel 6 and Oak Motel on the right before the bus stop at Dinah's Garden Hotel. The Crowne Plaza Cabana is directly across the street from Dinah's.

From/To San Francisco Airport:

The San Francisco subway system, Bay Area Rapid Transit (BART) http://bart.gov/ has a station in the International Terminal. The trip from the airport to Millbrae station takes 11 minutes and costs $1.50.

From the airport, take the train four minutes to the first stop, San Bruno. At San Bruno, change to the train across the platform for Millbrae. There is only a four minute wait. From San Bruno to Millbrae requires five minutes. Trains operate every 15 minutes most of the day, detailed schedules are found at http://bart.gov/schedules/index.aspx

From Millbrae, the next ride is on Caltrain http://caltrain.org/ to Palo Alto, which takes 30 or 32 minutes mid-day (longer on evenings and weekends) and costs $4.00. Be sure to ride the Southbound train toward San Jose and not the Northbound train toward San Francisco. Tickets must be purchased before boarding the train. Schedules are found at http://caltrain.org/timetable.html

From Palo Alto Transit Center, go to the stop for bus number 22 http://www.vta.org/schedules/SC_22.html Eastbound to Eastridge. The bus runs about every 12 minutes http://www.vta.org/schedules/SC_22EA_WK.html and costs $1.75. No change is given, so be sure to have exact fare. The bus ride takes about 16 minutes. The bus will pass Page Mill Road, Super 8 Motel, Creekside Inn and Townhouse Inn on the right, then cross Arastradero Road, then pass America's Best Value Inn and Days Inn. The Crowne Plaza Cabana will be on the right with a bus stop in front. Please pull the cord to inform the driver that you wish to stop shortly after passing the bus stop near Arastradero Road.

 

Sponsored by:

Corporate Sponsor - Bergquist Company

Student Stipend Funding provided by:

Student Compention Stipend by Honeywell

The Microelectronics Foundation


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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