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Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Register On-Line | Technical Program

Toll House
Los Gatos, California - USA
November 5-7, 2013

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee:
David Copeland, Oracle
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATTD
Niru Kumari, HP Labs
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.

Early Registration/Exhibit Deadlines: October 18, 2013
Hotel Deadline: October 11, 2013

Register On-Line | Technical Program
Speaker Info | Hotel
Tabletop Exhibit Information | 2013 Exhibitors | 2012 Exhibitors

Purchase 2012 Workshop CD of Presentations

Thank you to our Workshop Premier Sponsors:
Premier Sponsor - Bergquist Company Premier Sponsor - SAMJIN TECH

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year. Information will be available on transportation methods by train and/or bus from area airports.


Samsung Electronics | Sung Ki Kim

HP Labs, Hewlett-Packard Co. | Cullen Bash, Distinguished Technologist and Director of Software-Defined Systems Research Group

Intel Corporation | Gaurang N. Choksi, Director, Core Competency, Assembly & Test Technology Development

Tuesday, November 5, 2013

Registration: 7:30 am - 8:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: 9:00 am - 5:30 pm (During Breaks & Lunch)

Opening Remarks: 9:00 am - 9:15 am

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:15 am - 10:00 am

The Needs and Opportunities for Thermal Management in Consumer Electronics
Sung Ki Kim, Samsung Electronics

Abstract: Thermal issues have gained significant importance, and thermal management technology has evolved to make consumer electronics devices more versatile and powerful in a compact enclosure. In this presentation, we will share the trend of consumer electronics for the past ten years and corresponding development of thermal management technologies to solve the cooling challenges therein. In this presentation, we will show how the needs for thermal management have evolved. For example, the advancement of projection display devices initiated the development of high-performance robust heat dissipating devices, and the miniaturization technology of a liquid cooling system enabled thermal management of high-power LEDs and Xenon lamps with higher brightness, lower acoustics and longer life time. In addition, as more devices incorporate sleek design and portability becomes increasingly important for devices such as smart phones, it led to the development of very thin heat spreaders to manage heat from sources. In response, graphite products and heat pipes have evolved every year, achieving high conductivity of over 1500 W/mK and thickness of 0.6 mm respectively. The trend of high-power density in consumer electronics is expected to continue and we will discuss how these evolving thermal management needs can be met with future technologies. Finally, we will propose how inter disciplinary cooperation between academia and industry can contribute to the successful implementation of consumer electronics technologies.

Session 1: TIM Testing Methods and Requirements
Session Chair: Dave Saums, DS&A LLC
10:00 am - 12:30 pm

Practical Aspects of Thermal Interface Material Testing Methods
Dave Saums, DS&A LLC

Break in the Exhibits: 10:30 am - 11:00 am

An Application-Oriented TIM Thermal Measurement Approach
George Meyer, Celsia Inc; Bernie Siegal, Thermal Eng Assoc. (Tom Tarter, Erin Chen)

Challenges of Thermal Interface Materials in Test of IC Packages
Jaime Sanchez, Intel Corporation

Device Level Thermal Characterization for Photonics and Power Devices
Kazuaki Yazawa, Microsanj LLC (Dustin Kendig, Ali Shakouri)

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Lunch Presentation - 12:45pm - 1:15pm:
Ancient Engineers Constructed Elaborate Water Supply and Distribution Systems
Charles Ortloff

Abstract: Ancient engineers constructed elaborate water supply and distribution systems for their cities using fluid mechanics technologies predating "official" discovery" by western science by thousands of years. By application of modern CFD methods, the engineering used in ancient water systems can be revealed for the first time. Example cases of surprising technical applications in water engineering used in 300 BC-600 AD Petra (Jordan), 300 BC-1100 AD Tiwanaku (Bolivia), 400- 850 AD Angkor (Cambodia), 100 AD Pont du Gard Aqueduct (Roman France), 400 BC-100 AD Priene (Turkey) and 800 AD coastal Peru illustrate aspects of ancient technology only being discovered in recent times.

Session 2: Thermal Analysis and Modeling I
Session Chair: David Copeland, Oracle
2:00 pm - 3:30 pm

Modeling Thermoelectric Power Generation
John Langley, Ambient Micro LLC (Kristof Hovaten)

Heatsink Thermal Analysis and Optimization using BOE Calculations
Ernest Thurlow, San Jose State University

Micro-Channel MicroCooling Simulation Code
Matt Reeves, Wolverine Tube Inc. - MicroCool Division (Scott Holland, Dwight Brown)

Break in the Exhibits: 3:30 pm - 4:00 pm

Session 3: Advancements in Packaging Materials
Session Chair: George Meyer, Celsia Technologies
4:00 pm - 5:30 pm

Advances in the Use of AuSn Solder for Die Attach
Richard Koba, Materion Corporation

Wide Surface Aluminum Soldering
William Avery, Superior Flux & Mfg. Co. (Yehuda Baskin)

Ultra-Thin B-staged Thermoplastic Polyimide Bondfilm
Jim Fraivillig, Fraivillig Technologies Company

Dinner: 5:30 pm - 7:00 pm

Dinner Sponsored by:

Corporate Sponsor - Bergquist Company
Premier Sponsor - SAMJIN TECH


Session 4: Advanced TIM Research
Session Chair: Tannaz Harirchian, Intel ATTD
7:00 pm - 8:30 pm

Thermal Expansion in Bonded Carbon Nanotube Forest Interfaces
John Taphouse, Georgia Institute of Technology (Baratunde Cola)

Enhancing and Manipulating Thermal Transport in Thermal Interface Materials Through Molecular-level Engineering
Tengfei Luo, University of Notre Dame (Teng Zhang)

New Developments in Flexible Graphite Thermal Interface Materials
Martin Smalc, Graftech International Holdings Ltd. (Mathew Getz)


Wednesday, November 6, 2013

Registration: 8:00 am - 8:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: During Breaks & Lunch (10:30-11, 12:30-2, 3:30-4)

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:00 am - 9:45 am

The Future of Computer Architecture and Implications on Thermal Management
Cullen Bash, HP Labs

Abstract: The way in which computer systems are designed and built has gone largely unchanged over the past 50-plus years. While components have gotten smaller and more integrated, enabling significant performance and efficiency improvements, the basic architecture of machines continues to be based on traditional compute, memory and storage hierarchies that use copper wires for communication. This design paradigm is in the process of undergoing several “tectonic shifts” that will change the way in which computer systems are assembled and programmed, and which will enable new ways to interact with the explosion of data that is expected over the next decade. This talk will explore three fundamental technologies that are expected to converge and provide the foundation for the next generation of system architecture within the next decade. In particular, it will explore the emergence of non-volatile memory and its role in the flattening of the traditional storage-memory hierarchy. Evolutionary changes in microprocessor design, particularly with respect to chip-level integration will also be discussed. Additionally, the role of photonics as a potential replacement for copper wires in communication fabrics will be examined. Finally, for each technology shift, the impact on thermal architecture and energy management will be explored and challenges and opportunities will be highlighted.

Session 5: Thermal Components Research
Session Chair: Marlin Vogel, Juniper Networks
9:45 am - 12:30 pm

Thermal Management of COB LED Arrays Using an Advanced Cooling Technology
Brandon Noska, Bridgelux, Inc.

Break in the Exhibits: 10:15 am - 11:00 am

The effects of bending on heat pipes and vapor chambers: Guidelines from real products
George Meyer, Celsia Inc

Energy Efficient Cooling vs Waste Energy Recovery using Thermoelectrics
Kazuaki Yazawa, Purdue University (Ali Shakouri)

Enhancing Fan Efficiency to Lower Power and Improve Acoustics
Roger Dickinson, Bergquist Torrington Company

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Lunch Presentation - 12:45pm - 1:15pm:
AT&T Network 2020 – Revolutionizing the Telecommunications Network - Engineering Advances Required to Realize the Transformation
Dave Redford, AT&T, Principle Network Design Engineer

Abstract: AT&T has committed to spend 16 Billion dollars by 2020 to revolutionize their communications network. Gone will be the time worn point to point network that your grandparents depended on for dial tone only.

Replacing the old network will be a completely new, built from the ground up, fully integrated IP cloud based network like no other. The new network will fully integrate mobile communications, land lines, video and cloud based distribution services. The effort is well underway, but significant challenges require creative solutions to make the deployment a reality. Network equipment suppliers need to redouble their efforts in developing enhanced platforms, more powerful yet more energy efficient systems. Systems will be deployed in all ranges of environments; from the tops of remote mountains, to the extremes of desert valleys; from pristine data centers to enclosures hanging off distribution towers. The mobile access IP centric network of the future will require the best of what equipment engineers have designed and more.


Session 6: Thermal Interface Materials and Testing
Session Chair: Guy Wagner, Electronic Cooling Solutions
2:00 pm - 3:30 pm

Liquid Dispensed Thermally Conductive Materials
Sanjay Misra, The Bergquist Company

Correlation between Hardness and Storage Modulus of Silicone Gels for Thermal Interface Materials
Kristina Chano, NuSil Silicone Technology (Robert Krizan, Robert Naggs)

Development of a Novel Reliable TIM1
Jason L. Strader, Laird Technologies

Break: 3:30 pm - 4:00 pm

Session 7: Single & Two-Phase Cooling
Session Chair: John Peeples, The Citadel
4:00 pm - 5:30 pm

Transient Heat Exchanger Compact Models for Data Center Applications Using Artificial Neural Networks
Marcelo del Valle, Villanova University (Alfonso Ortega)

Experiments and Modeling of a Cabinet Level Two-Phase Thermosyphon Based Thermal Management System for Rack Mounted Servers
Benjamin Zuk, Villanova University (Alfonso Ortega, Steven Schon, David Santoleri)

Managing Temperature Difference Between Critical Components
Guy Wagner, Electronic Cooling Solutions Inc. (Guy Diemunsch)

Dinner: 5:30 pm – 7:00 pm

Dinner Sponsored by:

Corporate Sponsor - Bergquist Company
Premier Sponsor - SAMJIN TECH


Session 8: High Conductivity Materials and Structures
Session Chair: Tannaz Harirchian, Intel ATTD
7:00 pm - 8:00 pm

High Thermal Conductivity Low CTE Thermal Management Products
Aaron Rape, Momentive Performance Materials (Wei Fan, Xiang Liu)

Latest Developments in Diamond Cooling of GaN RF Devices
Brooke Locklin, Element Six Technologies US Corporation (Dan Twitchen)


Thursday, November 7, 2013

Registration: 8:00 am - 1:00 pm
Continental Breakfast: 8:00 am - 9:00 am

Market Drivers: KEYNOTE
Session Chair: Dave Saums, DS&A LLC
9:00 am - 9:45 am

Enabling Innovation and Integration in Electronic Packaging: Are Modeling, Simulation and Measurement Capabilities Falling Behind?
Gaurang Choksi, Intel Corporation

Abstract: Advances in electronic packaging have supported silicon technology scaling and the package has evolved to become an important enabler of product performance and differentiation. The various market segments ranging from consumer electronics, hand held devices such as phones, tablets, UltrabooksTM and convertibles, to high performance servers; result in an extremely diverse set of designs, multiple levels of integration, materials, and manufacturing processes, extending from 2D, 2.5 to 3D packaging architectures. The engineering of semiconductor packaging has advanced over the past decades and has kept pace with supporting higher performance and cheaper computing devices with hundreds of millions of transistors. The rate of progress in this area will continue to require significant improvements in the collaterals required to enable time-sensitive and cost-effective technology development. This includes appropriate modeling/simulation software tools and measurement tools /techniques for the analysis, characterization, validation and optimization of the different steps of the assembly manufacturing and test process, materials used, mechanical integrity, signal integrity, power delivery and thermal management. Given the pace of feature scaling, level of functional integration, drive to ubiquitous computing, and smaller devices and form factors, are these tools losing the race? Are the modeling, simulation and metrology tools and methods keeping pace with electronic packaging technologies that are required to sustain Moore's Law? Do they provide the right level of capability to help understand and quantify responses to enable cost/performance effective trade-offs and drive decisions across design, materials and manufacturing process parameters for current and future technologies? A critical review of this area will be presented. This presentation will first provide an overview of typical current and future package technologies and associated demands across the different market segments. Challenges that need to be addressed for facilitating the effective analysis and characterization to enable efficient design, materials selection and associated assembly and test manufacturing processes will then be reviewed. This will be mapped to an assessment of the current state-of-the-art and the areas of opportunities where analysis and measurement tools and methods do not provide adequate capability. The role of inter-disciplinary solutions and the need for new competencies will be discussed. A broad perspective of the need for improved solutions, including multi-physics and multi-scale approaches, will be reviewed. Recent trends in technologies, advanced analysis / simulation tools and metrologies and their applications to electronic packaging will be comprehended.

Session 9: 2.5D & 3D Packaging
Session Chair: Vadim Gektin, Futurewei Technologies
9:45 am - 10:45 am

Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
Ron Zhang, Invensas Corporation (John Tseng, Hala Shaba, Ellis Chau, Wael Zohni, Laura Mirkarimi)

Thermal Performance Enhancement of Glass Interposers with Copper Vias Similar to Silicon Substrates
Sangbeom Cho, Georgia Institute of Technology (Yogendra Joshi, Venky Sundaram, Rao Tummala)

Break: 10:45 am - 11:00 am

Session 10: Thermal Analysis and Modeling II
Session Chair: David Copeland, Oracle
11:00 am - 1:00 pm

Determining the Limits of Natural Convection Cooling for Hand-Held Consumer Electronics Products
Guy Wagner, Electronic Cooling Solutions

A Discrete Tangent based Sensitivity Analysis Method for Electronics Packaging Thermal Management
Prabhu Sathyamurthy, Amoeba Technologies Inc. (Sanjay Mathur)

Thermal Test Chip - the Update
Bernie Siegal, Thermal Engineering Associates, Inc.

Assessing Thermal Management Methods in System-on-Package (SOP) Systems for Electronic Packaging
Edwin Okoampa Boadu, University of Electronics Science and Technology of China (Eric Ashalley)

Closing Remarks: 1:00 pm


Questions:  Contact Brian Schieman with questions or 412-368-1621. You may also contact the workshop chairs.

Download Program PDF

Register On-Line

Speaker Dates/Information:

  • Abstracts Deadline Extended: September 20, 2013
  • Hotel Deadline: October 11, 2013
  • Early Registration Deadlines: October 18, 2013
  • Speaker BIO Due (emailed to October 30, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: November 6, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Hotel Information -- Hotel Reservation Deadline: October 11, 2013

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $169 + tax per night

Phone Reservations - Contact hotel directly: 800-238-6111

On-Line Reservations

TAXI from SJC airport is a reasonable proposition, as rental car taxes and fees at SJC are now very high (my cost at the moment is $256 + 141 in taxes = $407, for nine days). The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.


Premier Sponsors:

Premier Sponsor - Bergquist Company

Premier Sponsor - SAMJIN TECH


Student Stipend Funding provided by:

Hewlett-Packard Laboratories

The Microelectronics Foundation

Congratulations to Student Stipend Winners:


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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