Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Register On-Line | Exhibits | Exhibiting Companies

Toll House
Los Gatos, California - USA
October 28-30, 2014

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee:
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATTD
George A. Meyer IV, Celsia Technologies
Nader Nikfar, Qualcomm
Bill Maltz, Electronic Cooling Solutions
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.

Early Registration Deadline: October 15, 2014
Hotel Deadline: October 10, 2014

Registration | Speaker Info | Hotel
Tabletop Exhibit Information | 2014 Exhibitors | 2013 Exhibitors

Thank you to our 2014 Premier Sponsor:

Premier Sponsor - Bergquist Company


Thank you to our 2014 Corporate Sponsor:

Premier Sponsor - Huawei


Contact or Register Online

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year.


Tuesday, October 28, 2014

Registration: 7:00 am - 7:30 pm
Continental Breakfast: 7:30 am - 8:30 am
Exhibits Open: During Breaks & Lunch (10:00 am - 4:00 pm)

Session 1: Handheld and Mobile Devices I
Session Chair: Dave Saums, DS&A LLC
8:30 am - 10:00 am

Thermal Design Optimization of SoC Packages and Handheld Systems
Tannaz Harirchian, Intel Corporation

Flexible Thermal Ground Planes with Thicknesses Below Quarter-mm
Ryan Lewis, University of Colorado at Boulder (Shanshan Xu, Li-Anne Liew, Collin Coolidge, Ching-Yi Lin, Ronggui Yang, Y.C. Lee)

Ultra Thin-Light Titanium Based Thermal Ground Plane
Payam Bozorgi, PiMEMS, Inc

Break in the Exhibits: 10:00 am - 10:30 am


10:30 am - 11:30 am: KEYNOTE SPEAKER - Qualcomm

Riko Radojcic
Senior Director of Technology
Qualcomm Technologies

Managing Thermal & Mechanical Interactions with 2.5D and 3D IC’s

Abstract: Current 2.5D and 3D chip integration technologies, targeting high performance and high density die-to-die interconnect, are reviewed. State of the Art is summarized, and the principal value propositions opportunities , and technology tradeoffs are highlighted. Principal implementation challenges are outlined, with focus on managing the thermal and mechanical interactions. It is concluded that whereas the thermal and mechanical challenges are not unique and specific to 2.5D and/or 3D stacks, use of these integration technologies does exacerbate the interactions. Possible methodologies for addressing and managing the thermal and mechanical challenges are outlined and discussed.

Biography: Riko Radojcic is a Senior Director of Technology at Qualcomm Technologies, and a leader of the 2.5D and 3D Technology Integration team. He has led a number of Design-for-Technology initiatives at Qualcomm; including Design-for-3D, Design-for-Multiphysics, Design-for-Manufacturability & Variability, etc.. Radojcic has more than thirty years of experience in the semiconductor industry, specializing in process-design integration. Before joining Qualcomm, he was a consultant to semiconductor and EDA companies providing engineering and business development services. He was a director of business development and marketing for DFM Solutions at PDF Solutions, and a Business Manager and an Architect with Tality and Cadence, specializing in design technology integration and process characterization and modeling. Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.

Radojcic has authored and co-authored a number of books and papers, since he received his BSc and PhD degrees from University of Salford, UK.


Session 2: Vapor Chamber Technologies
Session Chair: Bill Maltz, ECS
11:30 am - 12:30 pm

Development of Heat Pipe/Vapor Chamber Heat Spreader Thermal Measurement JEDEC Standard
Bernie Siegal, George Meyer, Thermal Engineering Associates, Inc.

Experimental and Computational Characterization of Vapor Chamber Heatsinks
Darryl Moore, Electronics Cooling Solutions (Arun Raghupathy, William Maltz; Juan Cruz , Ericsson)

Lunch: 12:30 pm - 1:30 pm

Session 3: Thermal Analysis and Modeling I
Session Chair: Tannaz Harirchian, Intel ATTD
1:30 pm - 5:00 pm

What do you Characterize with Thermal Imaging?
Kazuaki Yazawa, Microsanj LLC. (Dustin Kendig, Ali Shakouri)

Reworkable Power Module Design for Low Thermal Resistance
Nathan Young, Sandia National Laboratories (Robert Kaplar, Jack Flicker, Ryan Shaffer)

Design of Optimum Plate-fin Applicable for Natural Convection Augmentation
Roody Charles, National Chiao Tung University (Wang Chi-Chuan)

Assessment of the Mechanical Integrity of the Si/TSV Interfacial Region in 3D Stacked Die Packages – A Hierarchical Approach
Fahad Mirza, University of Texas, Arlington (A R Nazmus Sakib; Pavan Rajamane; Dereje Agonafer)

Break in the Exhibits: 3:30 pm - 4:00 pm

Session 4: RF and Power Thermal Solutions I
Session Chair: Ross Wilcoxon, Rockwell Collins
4:00 pm - 5:30 pm

Application of Conduction-Cooled PCBs and Composite Housing Materials in an Aerospace Electronic System
David Saums, DS&A LLC (Rob Hay, MMCC LLC; Brian Edward, Pete Ruzicka, Saab Defense & Security)

Use of Various Flip-Chip BGAs in Applications such as RRU
Yuan Li, Altera Corp.

Enhanced Thermal Management Solutions for RF Power Amplifiers
Bruce Bolliger, Element Six Technologies (Brooke Locklin, Felix Ejeckam, Daniel Twitchen, Thomas Obeloer)

Session 5: Thermal Analysis and Modeling II
Session Chair: Vadim Gektin, Futurewei
5:30 pm - 9:00 pm

Effect of Warm Water Cooling for an Isolated Hybrid Liquid Cooled Server
Alekhya Addagatla, University of Texas at Arlington (Divya Mani, John Fernandes, Richard Eiland, Dereje Agonafer, Veerendra Mulay)

Dinner: 6:00 pm - 7:30 pm

Thank you to our 2014 Dinner Sponsors:

Premier Sponsor - Bergquist Company

Premier Sponsor - Huawei


Session 5: Thermal Analysis and Modeling II - Continued

Mapping Chip-Package-System Thermal Crosstalk Effects
Steven Groothuis, Micron Technology, Inc.

Ballistic Heat Conduction Challenges in High-Speed Electronics
Bjorn Vermeersch, Purdue University (Ali Shakouri)

Using CFD for Modeling Enclosures - A Comparison of Exact vs Abstract Geometries
James Petroski, Mentor Graphics


Wednesday, October 29, 2014

Registration: 7:00 am - 7:30 pm
Continental Breakfast: 7:30 am - 8:30 am
Exhibits Open: During Breaks & Lunch (10:00 am – 4:00 pm)

Session 6: RF and Power Thermal Solutions II
Session Chair: George Meyer, Celsia Technologies
8:30 am - 10:00 am

High Power Laser Diodes cooling
Thilo Vethake, TRUMPF Photonics (Stefan Heinemann, Phillip Albrodt

Diamond Thin Films with Tailored Microstructures for Thermal Management of Power Electronics
Nirmal Govindaraju, Oklahoma State University (Raj Singh)

Development and Application of Clad Stainless Steel Thermal Management Components for Handheld, Mobile, and LED Systems
Aaron Vodnick, Materion Corporation (Joseph Kaiser)

Break in the Exhibits: 10:00 am - 10:30 am


10:30 am - 11:30 am: 2014 KEYNOTE SPEAKER - Intel

Ashish Gupta, Ponniah Ilavarasan
Intel Corporation

Thermal and Mechanical Considerations and Challenges for Mobile and Handheld Products - System to Silicon

Abstract: Consumers are drawn towards mobile devices (tablets, phablets, and phones) which provide thinner form factors, richer and bigger displays and better multimedia capabilities. The functionality crammed into mobile devices will only continue to grow as consumers turn to their mobile devices to do more of their complex and rich functionality tasks. Thermal management and control of these passively cooled devices is of prime importance given the chassis design constraints and thermodynamic space limitations. At the same time, end users expect high levels of performance from their hand-held and mobile devices, and the trend from one generation to the next is increased performance while reducing thermodynamic space (thinner devices). The intersection of these two design philosophies meets at the end-user expectations: is the user willing to trade ergonomics (hotter devices) for increased performance, or is the end user willing to sacrifice performance for better ergonomics & battery life? These questions bring unique challenges for the thermo-mechanical community. This talk discusses most of these major challenges for current and next-generation mobile devices from an industry perspective and also various approaches that need to be taken to balance performance with ergonomics in a quantifiable manner.

Biography: Dr. Ponniah Ilavarasan recently joined Intel China Platform Engineering Group (CPEG) focusing on enabling silicon partners to deliver IA as part of their SOC that can be used in Smartphones and Tablets. Before joining CPEG, he managed the Power, Performance, and Thermal team in Intel’s Mobile Communication Group (MCG) in Portland, Oregon. He holds a Ph.D. degree in Electrical Engineering from Michigan State University. His group is responsible for delivering maximum performance in a thermally constrained environment such as Tablet, Phablet, and Smartphone. This includes delivering cost optimized system thermal solutions for maximum sustainable component and system thermal power envelope in a thin form factor devices, and collaborating with power/silicon architects to minimize power for high stress use cases. Ponniah also managed various disciplines such as EMI/ESD, wireless/antenna design, and signal integrity.

Dr. Ashish Gupta holds a Ph.D. degree in Mechanical Engineering from Purdue University and manages the Thermals and Fluids Core Competency Team at Intel Corporation. His group is responsible for the R&D of advanced package thermal and cooling technologies, modeling methodologies and metrologies for Intel’s current and future generations of processors for product segments during the discovery, definition, development and certification stages of technology maturity. The team‘s scope cover the entire gambit of Intel product segments across all market segments ranging from hand held devices in constrained physical/thermal environments to higher power server products.


Session 7: Liquid, Phase-Change, and Refrigeration I
Session Chair: George Meyer, Celsia Technologies
11:30 am - 12:30 pm

Fabrication and Measurement Challenges in Testing Single-Phase Water-based Microchannel and Galinstan-based Minichannel Cooling at High Heat Fluxes
Rui Zhang, Tufts University (Marc Hodes; Nate Lower, Ross Wilcoxon, Rockwell Collins)

Phase Change Enhanced Liquid Metal Cooling
Ross Wilcoxon, Rockwell Collins (Nate Lower)

Lunch: 12:30 pm - 1:30 pm

Session 8: Liquid, Phase-Change, and Refrigeration II
Session Chair: Dave Saums, DS&A LLC
1:30 pm - 3:30 pm

High Performance 3-D Printed Thermal Management Solutions
Timothy Shedd, Ebullient, LLC

Complementary Orifice and Surface Enhancement Geometries for Jet Impingement Boiling Heat Transfer
Matthew Rau, Purdue University (Suresh Garimella)

Making Device Level Liquid Cooling in the Real World
Timothy Shedd, Ebullient, LLC

Pumped Two-Phase Cooling Loops for High Heat Flux Cooling
Howard Pearlman, Advanced Cooling Technologies, Inc. (Tadej Semenic, Seung-Mun You, Ehsan Yakhshi-Tafti)

Break in the Exhibits: 3:30 pm - 4:00 pm

Session 9: Liquid, Phase-Change, and Refrigeration III
Session Chair: Guy Wagner, ECS
4:00 pm - 6:00 pm

Nucleate Boiling Heat Transfer Enhancement with Electrowetting
Dong Liu, University of Houston (Aritra Sur, Yi Lu, Carmen Pascente, Paul Ruchhoeft)

Evaluating Liquid Cooling at the Rack: Comparing Distributed and Centralized Pumping
John Fernandes, University of Texas at Arlington (M. Sahini, D. Agonafer, V. Mulay, J. Na, P. McGinn, M. Soares, C. Turner)

Flow Boiling of Water at Reduced Pressure in Micro Pin-Fin Heat Sink
Xuefei Han, Georgia Institute of Technology (Yogendra Joshi)

Automated Design of Optimized Arrays for Single Phase Jet Impingement Heat Transfer
Brett Lindeman, University of Wisconsin – Madison (Jeff Kollasch, Timothy Shedd)

Dinner: 6:00 pm - 7:30 pm

Thank you to our 2014 Dinner Sponsors:

Premier Sponsor - Bergquist Company

Premier Sponsor - Huawei


Session 10: TIM Performance and Testing
Session Chair: Nader Nikfar, Qualcomm
7:30 pm - 9:00 pm

Reliability Testing of Nano Sintered Silver Die Attach Materials
Ross Wilcoxon, Rockwell Collins (Mark Dimke, Chengang Xie)

Liquid Thermal Interface Materials for Mobile Electronics
Sanjay Misra, The Bergquist Company (Ryan Verhulst)

GE Technologies in Advanced Thermal Management of Packaging
David Shaddock, General Electric Global Research (Brian Rush, Gamal Refai-Ahmed, Arun Gowda)


Thursday, October 30, 2014

Registration: 7:00 am - 4:00 pm
Continental Breakfast:
7:30 am - 8:30 am

Session 11: Handheld and Mobile Devices II
Session Chair: Nader Nikfar, Qualcomm
8:30 am - 10:00 am

Thermal Test Vehicle (TTV) Testing and Simulation of Package-on-Package (PoP) and Single-Die (SD) BGA Packages
Youmin Yu, Taravat Khadivi, Nader Nikfar, Qualcomm (Bohan Yan, Eduardo De Los Heros, Amkor Technology)

Cooling Efficiency of Popular Tablets in a Natural Convection Environment
Guy Wagner, Electronic Cooling Solutions

Thermal Management of Forced Convection Tablets; An Experimental and Computational Study
Irvin Romero, Electronic Cooling Solutions (Bharath Nagendran, Arun Raghupathy, William Maltz)

Break in Foyer: 10:00 am - 10:30 am

Session 12: Data Center and Telcom Thermal Management I
Session Chair: Marlin Vogel, Juniper Networks
10:30 am - 12:00 pm

Reducing Noise from Fan-Cooled Equipment
David Nelson, Nelson Acoustics

Dynamic Thermal Management of Data Centers with Hybrid Air-Liquid Cooling Systems
Alfonso Ortega, Villanova University (Marcelo Del Valle, Luis Silva; Baghat Sammakia, Tianyi Gao, Sami Alkharabsheh, Binghamton University)

Thermodynamic Analysis of Data Center Power and Water Utilization Across ASHRAE Environmental Envelopes for Different Cooling Technologies
Marianna Vallejo, University of Texas at Arlington (John Fernandes, Richard Eiland, Dereje Agonafer, Veerendra Mulay)

Lunch: 12:00 pm - 1:00 pm

Session 13: Data Center and Telcom Thermal Management II
Session Chair: Marlin Vogel, Juniper Networks
1:00 pm - 2:30 pm

Thermal Performance of a High Density Mineral Oil Immersion Cooled Server System
Richard Eiland, University of Texas at Arlington (Marianna Vallejo, John Fernandes, Dereje Agonafer, Veerendra Mulay)

Thermodynamic Analysis of Full Liquid-cooled Data Centers
Anish Bhalerao, Villanova University (Aaron Wemhoff)

Does My Equipment Meet OSHA?
David Nelson, Nelson Acoustics

Break in Foyer: 2:30 pm - 3:00 pm

Session 14: Data Center and Telcom Thermal Management III
Session Chair: Marlin Vogel, Juniper Networks
3:00 pm - 4:30 pm

Two-Phase Cooling Coupled with Waste Heat Energy Capture for Data Center Environments: Investigation of Two-Phase Boiler Performance
Daniel Fritch, Villanova University (Alfonso Ortega, Amy Fleischer, Gerard Jones)

Improving Ducting to Increase Cooling Performance of High-End Web Servers subjected to significant Thermal Shadowing – An Experimental and Computational Study
Divya Mani, University of Texas at Arlington (John Fernandes, Richard Eiland, Derege Agonafer, Veerendra Mulay)

Repeatable Surface Temperature Measurements Under High Heat Flux Conditions
Eduardo De Los Heros, Amkor Technology (Jesse Galloway)


Register On-Line

Engineering and Science University Student Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

2014 Student Competition and Stipends Sponsored by:


Premier Sponsor - Huawei
Celsia Technologies
The Microelectronics Foundation


Speaker Dates/Information:

  • Abstracts Deadline Extended to: September 15, 2014
  • Hotel Deadlines: October 10, 2014
  • Early Registration Deadlines: October 15, 2014
  • Powerpoint/Presentation file for CD-Rom due not later than: October 30, 2014
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: October 15, 2014) | Register Online

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one CD/Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 24, 2014. No refunds will be issued after that date.

Early Fee
Through 10/15/2014
Advance/Onsite Fee
After 10/15/2014
IMAPS Member
Chapter Officer
Exhibits Only NO MEALS
Tabletop Exhibit Booth - IMAPS Members
Tabletop Exhibit Booth - Non-Members

Register Online



Hotel Information -- Hotel Reservation Deadline: October 10, 2014

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $169 + tax per night

IMAPS has oversold our room block and the hotel is providing us more rooms. For that reason, it is best to CALL and mention IMAPS instead of using the old ONLINE LINK.

Phone Reservations - Contact hotel directly: 800-238-6111


TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic