Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Exhibits | Exhibiting Companies

Toll House
Los Gatos, California - USA
September 22-24, 2015

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee:
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATTD
George A. Meyer IV, Celsia Technologies
Nader Nikfar, Qualcomm
Bill Maltz, Electronic Cooling Solutions
Kamal Mostafavi, CoolIt Systems Calgary
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.

Early Registration & Hotel Deadline: September 4, 2015

Speaker Info
Tabletop Exhibit Information | 2015 Exhibitors | 2014 Exhibitors

Thank you to our 2015 Premier Sponsor:

Premier Sponsor - Henkel Bergquist


Thank you to our 2015 Corporate Sponsor:

Premier Sponsor - Huawei

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge. Beginning in 1992, this Workshop is one of the most successful of the IMAPS ATWs that are held each year on a variety of technical topics.

Tuesday, September 22, 2015

Registration: 7:00 am - 7:30 pm
Continental Breakfast: 8:00 am - 8:45 am
Exhibits Open: During Breaks & Lunch (10:00 am - 4:00 pm)

Opening Comments
Dave Saums, DS&A LLC (General Chair) & Vadim Gektin, Futurewei Technologies (Program Chairs)
8:45 am - 9:00 am


9:00 am - 10:00 am: KEYNOTE SPEAKER - University of Texas at Arlington
Keynote Chair: Bill Maltz, Electronic Cooling Solutions

Dereje Agonafer
Jenkins Garrett Professor
University of Texas, Arlington

Thermal and Mechanical Challenges in Data Center

Abstract: In this presentation, I will discuss research activities of my team that address thermal, mechanical and contamination challenges in data centers. Majority of data centers are equipped with Direct Expansion (DX) cooling unit with account for a major part of the total energy usage. Considering the rapid advancement in Data centers that strive for 7/24/365 operation, use of energy efficient evaporative cooling strategies that can replace DX units will be addressed. The study includes the building of an Aztec ASC-15 cooling unit in collaboration with Mestex, an NSF IUCRC member company , attachment of the cooling unit to an IT Pod, construction of internal details of the IT pod, construction of a duct and subsequent testing various cooling pads, creation of CFD model for the IT pod and the ASC-15 unit. The cooling unit, ASC-15, which is capable of operating in pure air-side economization, in direct evaporative cooling, in indirect evaporative cooling, and/or in hybrid modes, contains two blowers which can deliver up to 7000 CFM to the IT pod. Best practices of using airside economization with or without direct and indirect evaporative cooling will be identified in this project. I will also discuss our study in particulate and gaseous contaminants, which is a key concern in using airside economizers especially with the newly expanded ASHRAE environmental envelope. At the board-level, we are concerned with thermal management of high-power modules through design and experimental testing of a first-ever "dynamic cold plate" concept (indirect liquid cooling). Through implementation of sensing and control, this solution will distribute the cooling resource to different sections within its body depending on local power dissipation from the adjoining module. Related to immersion cooling, an experimental study will be presented on a single server fully submerged horizontally in white mineral oil. In addition, the reliability challenges of mineral oil will also be addressed. In another study, a potentially energy efficient practice is identified, to reduce server cooling power by replacing conventional chassis enclosed smaller fans with larger rack mount fans. Related to structural aspects, failure of a rack due to vibrations could result in injury to people, damage to IT equipment and interruption of services that depend on proper functioning of the networking equipment in the rack. Protecting data centers form unexpected vibrations such as earthquakes and while transporting them is a major problem in the industry. Our work to date on this topic collaborating with Commscope, an NSF IUCRC member company, will be discussed. All of the above projects are funded by NSF IUCRC.


Break in the Exhibits: 10:00 am - 10:30 am

Session 1: Advances in Thermal Interface Materials
Session Chair: George Meyer IV, Celsia Technologies
10:15 am - 12:15 pm

Evaluating and Selecting Metallic and Well-Performing Thermal Interface Materials
Dave Saums, DS&A LLC

A Low Thermal Resistance and Highly Durable Carbon nanotube-polymer composite Thermal Interface Material for Burn in and Device Testing Applications
Leonardo Prinzi, Georgia Institute of Technology (Baratunde Cola, Craig Green)

Alternative High Thermal Conductive Solid Type TIM
Hiroyuki Ryoson, Dexerials Corporation (Keisuke Aramaki)

Hybrid Thermally Conductive and EMI Absorbing Materials
John Timmerman, Henkel

Lunch: 12:15 pm - 1:30 pm

Session 2: Thermal Materials and Stacked Die Packaging
Session Chair: George Meyer IV, Celsia Technologies
1:30 pm - 3:00 pm

Reliability of Multilayered Molybdenum-Copper-Composites for Thermal Management Applications
M. Seiss, Plansee SE (T. Mrotzek, W. Knabl)

Tools for Thermal Analysis: Thermal Test Chips
Tom Tarter, Package Science Services (Bernie Segal)

Effect of Temperature and Humidity on the Corrosion Rates of Copper and Silver in an IT Equipment
Kanan Pujara, University of Texas, Arlington (P. J. Singh, Dereje Agonafer)

Break in the Exhibits: 3:00 pm - 4:00 pm

Session 3: Advances in Two-Phase Liquid Cooling
Session Chair: Bill Maltz, Electronic Cooling Solutions
4:00 pm - 5:30 pm

Can you get too close to the fire? Cooling Efficiency From Air-Cooled Heat Sinks to Bare-Die Direct Liquid Impingement
Timothy Shedd, Ebullient, LLC

Chillerless liquid cooled 350 kW GPU cluster
Chris Nykamp, Chilldyne (Steve Harrington, Peter DeAngelis, Derek Dreblow)

Comparison of Three Liquid Cooling Methods for High-Power Processors
Guy Wagner, Electronic Cooling Solutions Inc. (William Maltz, David Copeland, Kamal Mostafavi, Justin Dixon, Gary Chan)

Dinner: 5:30 pm - 7:00 pm

Thank you to our 2015 Dinner Sponsors:

Premier Sponsor - Henkel Bergquist

Premier Sponsor - Huawei


Session 4: System Cooling Challenges
Session Chair: John Peeples, The Citadel
7:00 pm - 8:00 pm

Mitigation of Static Cold Plate Design Employed To Cool A Multichip Module with Highly Non-Uniform Power Distribution
Ruturaj Kokate, University of Texas at Arlington (Devi Prasad Gorrepati, John Fernandes, Dereje Agonafer)

Kinetic Cooling for Thermal Management of High Power Electronics
Lino Gonzalez, CoolChip Technologies, Inc. (Steve Stoddard, Ben Kessel, Mike Spieler)


Wednesday, September 23, 2015

Registration: 7:00 am - 7:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: During Breaks & Lunch (10:00 am – 4:00 pm)


9:00 am - 10:00 am: KEYNOTE SPEAKER - HP Laboratories
Keynote Chair: Dave Saums, DS&A LLC

Niru Kumari
Senior Research Engineer, Systems Research Lab
Hewlett-Packard Company, HP Laboratories

Thermal Engineers' Role in New Data-centric Computing Architecture

Abstract: Computing is facing a critical inflection point. In the 21st century, a number of important trends have converged, leading to the emergence of alternative approaches to the traditional computer architecture model that has underpinned computing for decades. The first trend is the explosion of Big Data with the advent of pervasive mobile technology and the internet of things. A very recent IDC prediction is that the digital universe will increase by a factor of 10x by 2020. This deluge of data needs storing, processing and, in turn, movement from storage to processor (i.e. networking) to maximize business value. The second trend is the concept of Moore's law hitting a wall and the end of Dennard's scaling law; these factors lead to legacy systems being incapable of handling zettabytes of data at reasonable speeds and energy consumption. Moreover, computing-centric architecture has resulted in 90% of total computing energy spent in data movement across multiple layers of storage-memory architecture. To address energy efficiency and latency of data-centric computing, new architectures are emerging which rely on non-volatile memory and data movement using photonic signal. In this new era, thermal engineers have a key role and need to focus on systematic thermal co-design from nanoscale to petascale. This presentation will detail this changing era of computing architecture and outline opportunities for thermal engineers.


Break in the Exhibits: 10:00 am - 10:30 am

Session 5: Power Semiconductor Packaging and Thermal
Session Chair: David Saums, DS&A LLC
10:30 am - 12:30 pm

Market Drivers for High Temperature Thermal Materials and Systems Requirements
David Saums, DS&A LLC

Improving the Thermal Management of Power GaN Devices
Cyril Buttay, Laboratoire Ampere, CNRS (Chenjiang Yu, Eric Laboure)

Thermal and Packaging Challenges for Advanced Power Semiconductor Modules
Lauren Boteler, Army Research Laboratories, Sensors and Electronic Devices Directorate

High Temperature Operation of SiC Transistors
Cyril Buttay, Laboratoire Ampere, CNRS (Marwan Ali, Oriol Avino, Herve Morel, Bruno Allard)

Lunch: 12:30 pm - 2:00 pm

Session 6: CFD Modeling
Session Chair: Guy Wagner, Electronic Cooling Solutions
2:00 pm - 3:30 pm

A Sparse Grid Collocation based Parametric Exploration Method for Electronics Cooling
Prabhu Sathyamurthy, ESI Group ( Sanjay Mathur)

The Role of Die Attach Adhesive (DAA) Thickness on Thermal and Luminous Performance of LED Package
Linjuan Huang, UC-Irvine

Cartesian Mesh Applied to Thermal Flow Simulations of High Power Air Cooled Industrial LED Lamps
Enrico Brega, Bregaengineering

Break in the Exhibits: 3:30 pm - 4:00 pm

Session 7: Two-Phase Dielectric Liquid Cooling
Session Chair: Guy Wagner, Electronic Cooling Solutions
4:00 pm - 5:30 pm

Deposition of Fluid Contaminants in 2-Phase Immersion Cooling: Mechanism, Effects and Proposed Mitigation Strategies
Phillip Tuma, 3M Company

Green Performance Characterization of Electronics Cooling Design Options: from Air through Card Level Hybrid to Direct Two Phase Touch Cooling
Alexander Yatskov, TF&F Inc. (Lloyd Olson)

Passive 2-Phase Immersion Cooling (P2PIC) of Bitcoin Hardware and Implications for other Computing Applications
Phillip Tuma, 3M Company

Dinner: 5:30 pm - 7:00 pm

Thank you to our 2015 Dinner Sponsors:

Premier Sponsor - Henkel Bergquist

Premier Sponsor - Huawei


Session 8: System Cooling and Acoustics
Session Chair: John Peeples, The Citadel
7:00 pm - 8:30 pm

Heat Pipe Reliability Testing and Life Prediction
George Meyer, Celsia Technologies (Ross Wilcoxon, Rockwell Collins)

Synergy of Energy-efficient and Low-noise Air Cooling
David Nelson, Nelson Acoustics

Improved Server & Router OPEX, Acoustics, and Leakage Power through Advancements in ASIC/CPU Package Design
Marlin Vogel, Juniper Networks (Jesse Galloway)


Thursday, September 24, 2015

Registration: 7:00 am - 4:00 pm
Continental Breakfast: 8:00 am - 9:00 am


9:00 am - 10:00 am: KEYNOTE SPEAKER - Hewlett-Packard
Keynote Chair: Vadim Gektin, Futurewei Technologies

Tahir Cader
Distinguished Technologist
Hewlett-Packard Company

The Evolving Data Center: How Power, Cooling, and Standards are Driving Change

Abstract: Rising power consumption from the device to the rack/row and data center levels continue to stress data center power delivery and cooling systems. Rack power levels in the enterprise space, which have held steady at the 4 - 6 kW/rack level for many years, are readily pushing past 12 kW/rack and more. In the high performance computing (HPC) space, racks of 40+ kW are increasingly common. At the recent International Supercomputing Conference in Frankfurt (Germany), there was at least one 100+ kW rack on display, with a number of additional entities also discussing 100+ kW racks. The majority of data centers in existence today have been designed to accommodate 8 - 10 kW air-cooled racks. When rack power levels exceed these values, the data centers are forced to make changes in order to support these higher power levels, including using aisle containment, in-row coolers, and more floor tiles (or grate tiles). Adjustments to reasonably accommodate air-cooled racks in existing data centers can be made up to approximately 20 kW/rack, after which it becomes very challenging and expensive. In the HPC space, the race to achieve Exascale computing capability is pushing the limits on all fronts, including power and cooling. There seems to be an emerging consensus that in order to achieve 1 ExaFlop in a reasonably-sized data center, within a reasonable 20 MW data center power envelope, rack power levels of 100+ kW will have to be deployed. At these rack power levels, traditional power and cooling delivery systems will be challenged. On the power front high voltage DC delivery is increasingly being used, while on the cooling front, liquid-cooling is almost a given at 100 kW/rack. The data center is being forced to evolve, particularly in the HPC space. Finally, data center standards including ASHRAE 90.1, ASHRAE 90.4 and ATIS 0600031.2014 (telco) will result in data center changes as well. The presentation will address several of the major forces that are causing the data center to evolve.


Break in Foyer: 10:00 am - 10:30 am

Session 9: Data Center Cooling I
Session Chair: Marlin Vogel, Juniper Networks
10:30 am - 12:30 pm

Liquid Cooling Technology Update from The Green Grid Liquid Cooling Working Group
Geoff Lyon, CoolIT Systems

Evaporative Cooling Strategies and Phase Change Material Applications for Leveling Data Center Cooling Loads
Abhishek Guhe, University of Texas at Arlington (Betsegaw Gebrehiwot, Ashwin Siddarth, Jeff Luttrell, Mullaivendhan V., Dereje Agonafer)

Experimental and Numerical Analysis for Dynamic Airflow Provisioning at the Rack
Ashwin Siddarth, University of Texas at Arlington (Marianna Vallejo, Abhishek Guhe, Niravkumar Dodia, Dereje Agonafer)

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense
Alexander Yatskov, TF&F Inc.

Lunch: 12:30 pm - 2:00 pm

Session 10: Data Center Cooling II
Session Chair: Marlin Vogel, Juniper Networks
2:00 pm - 3:30 pm

Impact of Active Tiles on Data Center Flow and Temperature Distributions
Jayati Athavale, Georgia Institute of Technology (Yogendra Joshi, Minami Yoda, Georgia Tech; Wally Phelps, Adaptivcool)

Developing and Validating Thermodynamic Models for Evaporative Cooling in Data Centers
Niravkumar Dodia, University Of Texas at Arlington (Marianna Vallejo, Betsegaw Gebrehiwot, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer)

Critical Non-Thermal Factors for Oil Immersion Cooled Data Center
Jimil Shah, University of Texas at Arlington (Richard Eiland, Syed Haider I. Rizvi, Dereje Agonafer

Break in Foyer: 3:30 pm - 4:00 pm

Session 11: Handheld and Mobile Device Thermal Issues
Session Chair: Bill Maltz, Electronic Cooling Solutions
4:00 pm - 5:30 pm

Spreading Enhancements in the Thermal Design of Forced Convection Tablets
Bharath Nagendran, Electronics Cooling Solutions Inc. (Arun Raghupathy, William Maltz)

Phase-Change-Materials-Based Thermal Management for Handheld Devices
Yuan Zhao, Henkel Electronic Materials, LLC. (Amit Kulkarni, Radesh Jewram, Chris Angus, Sanjay Misra)

Surface Pro 3 Thermal Module Design
Andy Delano, Microsoft
(Taylor Stellman)


Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

2015 Student Competition and Stipends Sponsored by:

Premier Sponsor - Henkel Bergquist

Premier Sponsor - Huawei
Novark Technology
The Microelectronics Foundation

Speaker Dates/Information:

  • Preliminary Abstract Deadline (Title & Topic ONLY, if full abstract not ready): June 19, 2015
  • Complete Abstract Deadline (if full abstract not provided earlier): July 15, 2015
  • Program Completion Deadline: August 14, 2015
  • Speaker Notification: August 20, 2015
  • Early Registration & Hotel Deadlines: September 4, 2015
  • Speaker BIOs Due: September 17
  • Powerpoint/Presentation file for DOWNLOAD due not later than: September 24, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: September 4, 2015)

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 1, 2015. No refunds will be issued after that date.

Early Fee
Through 9/4/2015
Advance/Onsite Fee
After 9/4/2015
IMAPS Member
Chapter Officer
Exhibits Only NO MEALS
Tabletop Exhibit Booth - IMAPS Members
Tabletop Exhibit Booth - Non-Members




Hotel Information -- Hotel Reservation Deadline: September 4, 2015

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA


TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.





  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic