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Advanced Technology Workshop and Tabletop Exhibition on
Think Thin:
IC Packaging for the New Era of Mobile Devices

August 23-24, 2011
The Biltmore Hotel & Suites
2141 Laurelwood Road
Santa Clara, CA 95054

Early Registration & Hotel Deadlines: August 5, 2011

General Chair
Rich Rice
ASE, Inc.
Technical Chair:
Steve Bezuk
Qualcomm, Inc.

Organizing Committee:
Robert Darveaux, Amkor
Calvin Cheung, ASE
Patricia MacLeod, ASE

Workshop Focus:
The market for smart mobile devices is exploding, including smart phones, tablets, and convergence devices, driven by consumers who demand greater functionality and ease of use. As a result, device designs require functional integration of IC’s, especially in the 3rd dimension, hence driving new technology development towards making IC components “thin”. The objective of the “Think Thin” Workshop is to address the numerous aspects of making IC packages “thinner” by providing a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of microelectronics, IC packaging, emerging packaging technology for mobile devices. This event enables discussion and presentations on the latest materials, process, design & emerging applications of “thin” packaging technology.

Registration Fees:
IMAPS Member: $550 | Non-Member: $650 | Speaker/Chair: $350 | Student: $225 | Tabletop Exhibit: $675/775 (Member/Non)

Tuesday, August 23rd

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Hours: 10:10 am - 5:00 pm (during breaks and lunch only)
Sessions, Tabletop Exhibits and Food/Beverage all in the same room.

Workshop Introduction/Keynote: 8:00 am - 8:40 am
Thin Is In
General Chair: Rich Rice, ASE, Inc.

Session 1: Design / Warpage Simulation and Reliability Considerations
8:40 am - 12:00 pm
Session Chair: Robert Darveaux, Amkor Technology, Inc.

Materials Advances Enable Thinner Packages 
YounSang Kim, Kevin Becker, Doug Dixon, Henkel Electronic Materials LLC

Effects of Package Pitch and Thickness Reduction on Board Level Reliability
Ahmer Syed, Ravi Chilukuri, Amkor Technology, Inc.

Thermal Fatigue Analysis of WLCSP and fcCSP Assemblies
Robert Darveaux, Amkor Technology, Inc.

Break: 10:10 am - 11:00 am

Warpage Challenge for Next Generation Thin Package-on-Package (PoP)
Wei Lin, Amkor Technology, Inc.

Thin Substrate Reliability
TBD, Hitachi Chemical

Lunch: 12:00 pm - 1:00 pm

Session 2: Substrate and Material Advancements needed for Thinner Packages
1:00 pm - 4:00 pm
Session Chair: Omar Bchir, Qualcomm, Inc.

NAMICS Materials for Thin & Advanced Packaging Technology
Brian Schmaltz, Yukinari Abe, Namics

Next Generation ABF Materials
Shigeo Nakamura, Ajinomoto

Newly Developed Ultra Low CTE Materials for Thin Core PKG
Takahiro “Ted” Tanabe, Masahisa Ose, Hikari Murai, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi, Hitachi

Break: 2:30 pm - 3:00 pm

Thin and Ultra-Slim Substrates and Packages
Bernd K. Appelt, Bruces Su, Dora Lee, Alex S. F. Huang, ASE Group

Molding Compound and Substrate Core Material for Thin Package
Masashi Nakamura, Toshiharu Takata, Panasonic Electric Works Co., Ltd.

Panel Discussion: 4:00 pm - 5:00 pm
Topic: TBD
Moderator: TBD
Panelists: TBD

Wednesday, August 24th

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Hours: 10:30 am - 3:00 pm (during breaks and lunch only)
Sessions, Tabletop Exhibits and Food/Beverage all in the same room.

Session 3: Near Term PoP Technology Advancements
8:00 am - 10:30 am
Session Chair: Flynn Carson, STATS ChipPAC Inc.

Molded Core Device Embedded Package for PoP Application 
Tetsuya Koyama, Kouichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka, Shinko Electric Industries Co., LTD.

Fine Pitch Copper Pillar Assembly Platform - Enabling Thinner Packages in a Mobile World
Curtis Zwenger, KyungRok Park, MinJae Lee. Amkor Technology, Inc.

Advance Thin PoP Technology
Hamid Eslampour, STATS ChipPAC Inc.

Chip-Last Embedding in Ultra-Thin Substrate for Low Profile Mold-Free PoP and 3D Packaging
Nitesh Kumbhat, Georgia Institute of Technology

Package Development for Bottom PoP with Large/Thin Die
Suresh Jayaraman, Robert Lanzone, J. S. Kim, T. K. Hwang, Amkor Technology, Inc.

Break: 10:30 am - 11:00 am

Session 4: Process and Equipment Advancements needed for Thinner Package Technologies
11:00 am - 3:00 pm
Session Chair: Rozalia Beica, Applied Materials, Inc.

Multi Beam Grooving and Full Cut Laser Dicing of IC Wafers
Jeroen van Borkulo, Rene Hendriks, Henry de Jonge, Advanced Laser Separation International (ALSI) NV

Thinning of WLP for 3D Packaging
Scott Sullivan, DISCO Corp.

Recent Developments in Temporary Bonding for Wafer Thinning and Processing
Eric Pabo, EVG

Lunch: 12:30 pm - 1:30 pm
Session 4 continues after lunch.

Aerosol Jet® 3D Interconnects as an Alternative to Wire Bonding for Complex, High I/O Applications
Urs Berger, Mike Renn, David Ramahi, Optomec, Inc.

Low-Cost Adhesives for Temporary Substrate Support During Thinning and Backside Processing
John Moore, Jared Pettit, Daetec, LLC

Low Loop Wedge Bonding for Thin Packaging Requirements
Lee Levine, Joe Bubel, Hesse & Knipps, Inc.

Session 5: Long Term 3D Technology Advancements / eWLB / Embedded Technologies / TSV
3:00 pm - 5:00 pm
Session Chair: Linda Matthew, TechSearch International

eWLB Technology Enables Thin 3D Packaging
Tom Strothmann, STATS ChipPAC Inc.

Challenges for Thin Wafer Level Packaging
John Hunt, ASE Inc.

Through Silicon Via (TSV) in Mobile Applications
Ron Huemoeller, KiWook Lee, David Hiner, Amkor Technology, Inc.

Ultra-Thin 3D Glass Interposer as a Compelling Alternative to 3D-IC and TSV
Venky Sundaram, Georgia Institute of Technology

Closing Remarks: 5:00 pm
Technical Chair: Steve Bezuk, Qualcomm, Inc.

Register On-line

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Speaker Dates/Information:

  • Abstracts Due: May 6, 2011
  • Speaker Notification Emailed: May 20, 2011
  • Extended Abstract or Presentation Material due: NO Extended Abstracts Required
  • Early Registration Deadline: August 5, 2011
  • Speaker Biography Due: August 17, 2011 (Email to Jackki Morris-Joyner (; put in the body of the email, NO ATTACHMENT
  • Powerpoint/Presentation file for CD-Rom due not later than: August 24, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations:
Reservation must be made directly with the:

The Biltmore Hotel & Suites
2141 Laurelwood Road
Santa Clara, CA 95054

Phone Reservations: (800) 255-9925 and refer to “IMAPS – ATW”.

Rates based on availability – includes complimentary wireless internet
$120 – Standard Garden Room
$149 – Tower Suites


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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