Honeywell

Topical Workshop & Tabletop Exhibition on
WIRE BONDING

October 8, 2018
Pasadena Convention Center
Co-located with IMAPS 2018**
Pasadena, CA - USA

 


General Chair:
Lee Levine
Process Solutions Consulting
Phone: 610-248-2002
levilr@ptd.net

Wire Bonding Workshop Organizing Committee:
Bob Chylak, K&S; William Crockett, Tanaka; Doug Day, Shinkawa; Dodgie Calpito, SPT; Dan Evans, Palomar;
Mark Greenwell, Coorstek; Horst Clauberg, K&S; Ivy Qin, K&S; Leroy Christie, ASM; Amy Low, Heraeus, Mike Mckeown, Hesse Mechatronics;
Josef Sedimair, F&K Delvotec; Uri Zaks, MPP Tools; Wenjuan Qi, Palomar; Bob Whitlock, SPT; Winston Bautista, SPT


 

THANK YOU TO OUR PREMIER SPONSOR:

Premier Sponsor - TopLine

 

Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to the use of Wire Bonding in semiconductor and microelectronic packaging. This year's workshop is Co-located with IMAPS 2018 (51st Symposium on MIcroelectronics) which also features one technical session on wire bonding, several posters and other related talks over the 3 days and 140+ speakers - www.imaps2018.org.

 

 

MONDAY, OCTOBER 8


7:00am-5:30pm

Registration Open

7:00am-8:00am

Breakfast

9:45am-5:45pm

Exhibits Open (when not in session)

TopLine Corporation - Premier Workshop Sponsor
cyberTECHNOLOGIES USA
Hesse Mechatronics, Inc.
Plasmatreat


8:00am-8:15am

Opening Remarks: Workshop Chair –
Lee Levine, Process Solutions Consulting


SESSION 1

MORNING SESSION
Session Chairs: Bob Chylak, Kulicke and Soffa Industries; Leroy Christie, ASM Pacific Technology

 

8:15am-8:45am

Curriculum of Coated Silver Bonding Wire
Sarangapani Murali, Heraeus Materials Singapore Pte Ltd (Tan "Eric" Swee Seng, Wong "Jason" Chin Yeung)

8:45am-9:15am

New Era in Cu & Ag Alloy Wire Bonding Technology
Song "James" Keng Yew, ASM Pacific Technology Pte. Ltd (Raymond Montederamos, Gunasekaran A/L Muthusamy, Zhu Ya Ping)

9:15am-9:45am

Introduction of Copper Alloy Bonding Wire for the High Rel Industry
William Crockett, Tanaka Denshi


9:45am-10:30am

Break in the Exhibit Area


10:30am-11:00am

Method of Measuring Copper Oxide on Cu Wire for Wirebonding
Peter Bratin, ECI Technology (Vinh Nguyen, Eugene Shalyt, Isaac Tsimberg, Michael Pavlov)

11:00am-11:30am

Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated Environments
Oliver Chyan, University of North Texas (M. Asokan, J. Caperton, A. Salunke, University of North Texas, Interfacial Electrochemistry and Materials Research Lab; Fei Xu, Changzhou Ruize Microelectronics Co., Ltd.)

11:30am-12:00pm

Advanced Wedge Bonding Technologies
Wenjuan Qi, Palomar Technologies (Dan Evans, Elizabeth Airriess, Matthew Clements, Raul Rathmann, Joseph Anderson)


12:00pm-1:15pm

Lunch in the Exhibit Area


SESSION 2

AFTERNOON SESSION
Session Chairs: Lee Levine, Process Solutions Consulting; William "Bud" Crockett, Tanaka

 

1:15pm-1:45pm

Wire Bonding Process: Understanding Ultrasonic Welding
Lee Levine, Process Solutions Consulting, Inc

1:45pm-2:15pm

Automated Wire Bond Outlier Detection and Classification
Henri Seppänen, Kulicke & Soffa Industries (Martin Simonsson)

2:15pm-2:45pm

Wire Bonder Productivity and Quality Advances for Ultra High Reliability Markets
Yoshihito Hagiwara, Shinkawa Ltd.


2:45pm-3:15pm

Break in the Exhibit Area


3:15pm-3:45pm

Au Planar Bumps for Flip Chip Bonding
Trent Nash, Palomar Technologies (Dan Evans)

3:45pm-4:15pm

Wire Bonding Advances for Multi-Chip and System in Package Devices
Hui Xu, Kulicke and Soffa Industries, Inc. (Aashish Shah, Basil Milton, Ivy Qin)

4:15pm-4:45pm

In-line Oxide Removal and Surface Cleaning Using Openair Plasma
Khoren Sahagian, Plasmatreat USA


4:45pm-5:45pm

PANEL DISCUSSION:
Copper Wire Bonding Manufacturing and Reliability Issues

MODERATOR: Lee Levine, Process Solutions Consulting

PANELISTS:
Leroy Christie, ASM Pacific Technology
Bob Chylak, Kulicke and Soffa Industries
William "Bud" Crockett, Tanaka
Additional Panelists Soon

 


5:45pm

Closing Remarks


5:30pm-7:30pm

IMAPS 2018 - WELCOME RECEPTION
All Wire Bonding Workshop Attendees Invited!


 

 

 

TopLine

 


Speaker Dates/Information:

  • Abstract Deadline Extended to: APRIL 18, 2018
  • Speaker Email Notification: May 21, 2018
  • Early Registration Deadline: September 12, 2018
  • Hotel Cut-off: September 12, 2018
  • Speaker 2-3 sentence biography due not later than: September 15, 2018
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: October 8, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb/cloud or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) [Keynotes: 40 minutes + 5 minutes for Q/A]


Registration Information: (Early Registration Deadline: September 12, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 1-2 weeks after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 9/12/2018
Advance/Onsite Fee
After 9/12/2018
IMAPS Member
$500
$600
Non-Member
$600
$700
Speaker
$300
$400
Session Chair
$300
$400
Student
$100
$150
Chapter Officer
$300
$400
Tabletop Exhibit (Member Price - includes 1 exhibit personnel)
$650
$750
Tabletop Exhibit (Non-Member Price - includes 1 exhibit personnel)
$750
$850
Premier Event Sponsorship
(includes: 1 attendee registration, 1 tabletop exhibit, print advertisement in final program, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)
$1500
$1500



Hotel Reservations (Hotel Deadline: September 12, 2018)

The Workshop is being held at the Pasadena Convention Center.

Hotel Reservations must be made directly with the host hotels:

Hilton Pasadena
168 South Los Robles Avenue
Pasadena, California, 91101, USA

Westin Pasadena
191 North Los Robles Avenue
Pasadena, California, 91101, USA

The Hilton and Westin Pasadena hotels offer shuttle service to the convention center and around Pasadena within a 2-3 mile radius of the hotel. Both hotels are 20 minutes from the Bob Hope Burbank Airport (BUR) and 45 minutes from Los Angeles International Airport (LAX).

 

 

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

 

 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic