IMAPS - Device Packaging 2010 Exhibit Reservation Form

6th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 9-11, 2010

Exhibition and Technology Showcase
March 9-10, 2010

Professional Development Courses
March 8, 2010

GBC Spring Conference
March 7-8, 2010

In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Phil Garrou
Microelectronic Consultants of NC

Technical Co-Chair: James J.-Q. Lu Rensselaer Polytechnic Institute	Technical Co-Chair: Linda Bal Freescale Semiconductor	Technical Co-Chair: Ted Tessier FlipChip International	Technical Co-Chair: Robert Dean Auburn University	Technical Co-Chair: Frank Wall Philips
Technical Co-Chair: Lee Smith Amkor Technology	Technical Co-Chair: Lou Nicholls Amkor Technology	Technical Co-Chair: Andrew Strandjord Pac Tech USA	Technical Co-Chair: Tracy Hudson US Army	Technical Co-Chair:

Exhibit Registration

Questions about exhibits?
Email Ann Bell at abell@imaps.org

Early Reservation Deadline: February 4, 2010

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