IMAPS - Device Packaging 2006 Registration

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International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Doubletree Hotel
Scottsdale, Arizona USA

Device Packaging General Chairs:
Ted Tessier, STATS ChipPAC, Inc.
Andrew Strandjord, FlipChip International

Conference and Technical Workshops
March 20-23, 2006

Exhibition and Technology Showcase
March 21-22, 2006

Professional Development Courses
March 20, 2006

GBC Spring Conference
March 19-20, 2006

Early-Bird Registration Ends: February 15, 2006
Hotel Cut-off: February 10, 2006

In conjunction with the Global Business Council (GBC) Spring Conference, March 19th & 20th

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IMAPS-International Microelectronics And Packaging Society
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001; Fax: 202-548-6115
E-mail: imaps@imaps.org
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