KESTER

2017 RaMP Workshop and Tabletop Exhibition

April 26-27, 2017
Espace Saint-Martin

PARIS - FRANCE


Organizing Committee:

General Co-Chair
Brigitte Braux
IMAPS France
brigitte.braux-touchat@orange.fr
General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
Technical Co-Chair:
Michel de Langen
Ampleon Netherlands B.V.
Michel.de.Langen@Ampleon.com

Technical Co-Chair:
IMAPS France
COMING SOON

 

Program Committee:

Thomas Bartnitzek - Micro Hybrid (Germany)
Hansu Birol - HB Technology, Brazil
Mumtaz Bora - Peregrine Semi
Matt Brown - INSENTO
Liang Cai - Integra
Hanna Foster - Accel RF (US)
Ivan Ndip - Fraunhauhofer Institute
Martin Goetz - Northrop Grumman
Jacques Tailhades - Airbus Defence and Space
Prof. Ji Wang - Ningbo University (China )
Prof. Honglang Li - Chinese Academy of Sciences (China)
Wei Fan - Momentive
Renzhe Zhao - Huawei



RaMP 2017 Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-France and will be the continuation of a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-France and UK Chapters.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

Current Technology
  • 60 GHz Personal Area Network (PAN)
  • Short Wave IR Packaging
  • Nanopackaging
  • 3D RF/MW
  • New and Disruptive Technology
  • EMI Shielding for RF/MW Packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New Power Amplifier Design Beyond LDMOS
  • Thermal Management
  • New Uncooled IR Sensors
  • Plastic RF/MW Packaging
  • RF MEMS
  • Low loss, wide BW, high power interconnects
  • Military / space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics • Space / Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecomm
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics
  • Medical electronics
  • Wearable electronics

SUBMISSION:
Those wishing to present a paper at the RaMP Workshop must submit a 500 word abstract electronically no later than FEBRUARY 24, 2017, using the on-line submittal form at: www.imaps.org/abstracts.htm.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas. No formal technical paper is required.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. If you are having problems with the on-line submittal form, please email Ken Kuang at kkuang@torreyhillstech.com or call (858)558-6666.

 

Official RF and Microwave Packaging Workshop site: www.france.imapseurope.org/index.php/ramp

 



Registration Information: DETAILS SOON

 

Online Registration SOON


Speaker Dates/Information:

  • Abstracts Deadline Extended: FEBRUARY 24, 2017
  • Speaker Notifications Sent: February 28, 2017
  • Early Registration and Hotel Deadlines: March 2017
  • Speaker BIO & Photo Due: April 10, 2017
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: April 27, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Hotel Reservations: SOON

 

 

 

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems