KESTER

2017 RaMP Workshop and Tabletop Exhibition

April 26-27, 2017
Espace Saint-Martin

PARIS - FRANCE


Organizing Committee:

General Co-Chair
Brigitte Braux
IMAPS France
brigitte.braux-touchat@orange.fr
General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
Technical Co-Chair:
Michel de Langen
Ampleon Netherlands B.V.
Michel.de.Langen@Ampleon.com

Technical Co-Chair:
IMAPS France
COMING SOON

 

Program Committee:

Thomas Bartnitzek - Micro Hybrid (Germany)
Hansu Birol - HB Technology, Brazil
Mumtaz Bora - Peregrine Semi
Matt Brown - INSENTO
Liang Cai - Integra
Hanna Foster - Accel RF (US)
Ivan Ndip - Fraunhauhofer Institute
Martin Goetz - Northrop Grumman
Jacques Tailhades - Airbus Defence and Space
Prof. Ji Wang - Ningbo University (China )
Prof. Honglang Li - Chinese Academy of Sciences (China)
Wei Fan - Momentive
Renzhe Zhao - Huawei



RaMP 2017 Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-France and will be the continuation of a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-France and UK Chapters.

Sessions are being planned in the following areas:

Emerging Technologies

New Design/Materials

New Applications

Current Technology
  • 60 GHz Personal Area Network (PAN)
  • Short Wave IR Packaging
  • Nanopackaging
  • 3D RF/MW
  • New and Disruptive Technology
  • EMI Shielding for RF/MW Packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New Power Amplifier Design Beyond LDMOS
  • Thermal Management
  • New Uncooled IR Sensors
  • Plastic RF/MW Packaging
  • RF MEMS
  • Low loss, wide BW, high power interconnects
  • Military / space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics • Space / Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecomm
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics
  • Medical electronics
  • Wearable electronics

 

 

Official RF and Microwave Packaging Workshop site: www.france.imapseurope.org/index.php/ramp

 



Registration Information:

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. All prices below are subject to change.

How To Register?
Complete the REGISTRATION FORM and send back to Florence Vireton: imaps.france@imapsfrance.org

Type

Early Fee
Through 3 /02/2017

Advance/Onsite Fee
After 3/02/2017

IMAPS Member

550 €

650 €

Non-Member

675 €

775 €

Speaker

400 €

500 €

Chair

400 €

500 €

Student

150 €

150 €

Chapter Officer

400 €

 500 €

Tabletop Exhibit (Member)

500 €

600 €

Tabletop Exhibit (Non-Member)

600 €

700 €

Tabletop information : -1 table, 2 chairs, 1 panel or the company should come with a small banner.

    • Lunch and breaks  for 1 person during the 2 days,
    • No access to conferences,
    • If 2 persons on the table top, the second will pay 150 euros for lunches and breaks during the 2 days,
    • If an exhibitor wish to attend the conference, the fee will be half the price of the auditor rate IMAPS Member or non IMAPS Member.

     

    Download/Submit Registration Form


    Speaker Dates/Information:

    • Abstracts Deadline Extended: FEBRUARY 24, 2017
    • Speaker Notifications Sent: February 28, 2017
    • Early Registration and Hotel Deadlines: March 2017
    • Speaker BIO & Photo Due: April 10, 2017
    • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: April 27, 2017
    • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up)
    • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

     


    Hotel Reservations: SOON

     

     

     

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems