2017 RaMP Workshop and Tabletop Exhibition

April 26-27, 2017
Espace Saint-Martin

199 bis rue Saint-Martin | 75003 PARIS - FRANCE

Organizing Committee:

General Co-Chair
Brigitte Braux
IMAPS France
General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
Technical Co-Chair:
Michel de Langen
Ampleon Netherlands B.V.

Program Committee:

Thomas Bartnitzek - Micro Hybrid (Germany)
Hansu Birol - HB Technology, Brazil
Mumtaz Bora - Peregrine Semi
Matt Brown - INSENTO
Liang Cai - Integra
Hanna Foster - Accel RF (US)
Ivan Ndip - Fraunhauhofer Institute
Martin Goetz - Northrop Grumman
Jacques Tailhades - Airbus Defence and Space
Prof. Ji Wang - Ningbo University (China )
Prof. Honglang Li - Chinese Academy of Sciences (China)
Wei Fan - Momentive
Renzhe Zhao - Huawei

RaMP 2017 Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-France and will be the continuation of a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-France and UK Chapters.



Registration / Welcome coffee


Opening Remarks
Brigitte Braux (IMAPS France), Ken Kuang, Torrey Hills Technologies, LLC


A Numerical Analysis of Packaging Structures and Parameters of Quartz Crystal Resonators 

Prof. Ji Wang ( Ningbo University, China)

SESSION PA-1: RF Packaging Assembly
Chairman: Michel de Langen (Ampleon - The Netherlands)


Die-attach reliability of Gold Tin (AuSn) soldered GaN devices in temperature cycle tests
Roelof van der Berg, Arne Heessels (Ampleon, The Netherlands)


Advanced Hermetic Glass Encapsulation
Beat Scheidegger (Glenca Tec AG, Switzerland)


QFN-based Packaging Concepts for Millimeter Wave Transceivers
Mario Pauli, Thomas Zwick  (Karlsruher Institut für Technologie, KIT, Germany)


Lunch Break

SESSION PA-2: RF Packaging Assembly
Chairman: Jacques Tailhades (Airbus Defence and Space - France)


Wireless communication & Virtual SIM Card
Simon Guo (Ucloudlink, Benelux)


Three-dimensional step covered interconnection method for HySiF (Hybrid system in flexible) 
S.I. Rhee, Yongjin Kim, Jae Hak Lee, Joon Yub Song  (Institute of Machinery ad Materials, USA)


Non-hermetic Package for MetOp-SG V-band Front-Ends 
Thibaut Decoopman, Yann de Thonel d'Orgeix, Robert Farré, Alain Lemasson, Nadine Martin, Jacques Tailhades  (Airbus Defence and Space, France)


Coffee Break

SESSION STD1 : Simulation / Thermal / Design
Chairman: : Ji Wan (Ningbo University - China)


mm-wave Technologies and Components for 5G Applications
Liam Devlin (Plextek RFI, United Kingdom)


A compact high power waveguide amplifier in GaN technology 
Markus Mayer, Guillaume Pees-Martin, Claudio Pires-Carvalho, Francois Parickmiler  (Arelis, France)


New RFID Solutions Providing Additional Functions for Tracing and Tracking of Items
Werner John, Tobias John; Frank Jaeger  (SIL System Integration Laboratory, Germany)


Social Event:
Dinner in "L'Ambassade d'Auvergne" restaurant
22, Rue du Grenier Saint-Lazare, 75003 Paris



Opening Remarks

SESSION STD2: Simulation / Thermal / Design
Chairman: Richard Koba (Materion - USA)


Scalability of beam forming. How to build large antenna
Marcel Wieland (Globalfoundries, Germany ), Andy Heinig (IIS), Matthias Boettger (IZM), Christian Götze (GF), Uwe Maaß(IZM) 


SUPA – Smart Universal Power Antenna
Christian Hedayat, Maik-Julian Bücker  (Fraunhofer ENAS, Germany)


Coffee break

SESSION MTL1: Materials
Chairman: Thomas Bartnitzek (Micro Hybrid - Germany)


Solder-TIMs (Thermal Interface Materials) for Improved Thermal Management in Power Electronics
Graham Wilson,  Karthik Vijay (Indium, United Kingdom)


Conductive Die Attach Solutions for Thinner Wafer and Higher Power Applications
Ruud de Wit, Tony Winster  (Henkel Electronic Materials NV, Belgium)


LTCC-based Modules for Smart ComSat-Applications

Prof. Jens Müller (Ilmenau University of Technology, Germany)


Lunch Break

SESSION MTL2: Materials
Chairman: Ivan Ndip (Fraunhofer Institute - Germany)


Direct Bond Copper for RF Packaging
Richard Koba, Chee Kong Lee, Weichuan Goh , SiYee Chin  (Materion, USA) 


On the Integration of Inductors in High-Density Fan-Out Wafer Level Packages
Christian Tschoban, Matthias Boettger  (Fraunhofer IZM , Germany), Marcel Wieland (Globalfoundries, Germany)


Dielectric Characterisation Techniques of LTCC Materials
Alexander Schulz, S. Spira, M. Hein, J. Müller (Ilmenau University of Technology, Germany)


Graphene in CuMo / CuW heatspreaders
Brian Kennedy (Kennedy Labs , Canada), Ken Kuang, Torrey Hills Technologies, LLC


Closing Remarks Farewell
Brigitte Braux (IMAPS France), Ken Kuang, Torrey Hills Technologies, LLC


Official RF and Microwave Packaging Workshop site:



Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. All prices below are subject to change.

How To Register?
Complete the REGISTRATION FORM and send back to Florence Vireton:
Go on the dedicated website:


Early Fee
Through 3/02/2017

Advance/Onsite Fee
After 3/02/2017

IMAPS Member

550 €

650 €


675 €

775 €


400 €

500 €


400 €

500 €


150 €

150 €

Chapter Officer

400 €

 500 €

Tabletop Exhibit (Member)

500 €

600 €

Tabletop Exhibit (Non-Member)

600 €

700 €


    • Tabletop Includes: 1 table, 2 chairs, 1 panel or the company should come with a small banner.
    • Lunch and breaks  for 1 person during the 2 days,
    • No access to conferences,
    • If 2 persons on the table top, the second will pay 150 euros for lunches and breaks during the 2 days,
    • If an exhibitor wish to attend the conference, the fee will be half the price of the auditor rate IMAPS Member or non IMAPS Member.


    is a key industrial reference for microwave and RF projects. The group offers value added services from the design and manufacturing to the technology transfer of sub-systems dedicated to detection, guidance and communications applications, whether civil or military. Its solutions are developed for defense, security, aeronautics, spatial telecoms and broadcast industries. With the acquisition of Thomson Broadcast, Arelis is one of the world's leading players in digital television and radio transmission. Leader and partner of research and development programs, Arelis strongly contributes to multimode amplifier development, to the components miniaturisation with the integration in inner layers or to the development of SDR platforms. Forward-looking, it heavily invests in research and development for the creation of off-grid energy systems with long-term energy storage capacities. More about Arelis :
    has been distributing equipment for the Front end processes, as well as Assembly, Testing, and Packaging Operations in back end, plus a wide range of consumables and tooling for the whole Semiconductor industry for over 24 year.We are now able to propose dedicated services to manufacture specials machines, like Cryo , RF, DC, manual or semi-automatic probers. Lets us know what is your need and we will take care of your project.
    BT Electronics
    offers a wide range of products and equipment for RF & Microwave applications. So the products proposed are: packages and lids used for the component assembly , as well as preforms, ribbons and soldering balls from all alloys, bonding tools, wires, glues, resins and adhesives, Passive components such as low-pass filters with different types of design. Equipment offered are: test devices and stations, cube or storage cabinet with nitrogen, Gross leak controllers and a whole range of hot plates. Ask us, we will do everything to satisfy you!
    Quik-Pak, a division of Promex Industries
    We are a U.S.-based wafer processing, packaging, and assembly company located in California. In addition to wire bond assembly for digital and MW/RF applications, we assemble flip chips, ball grid arrays, MEMS devices, chip on board, EO components, and medical devices.
    GlencaTec AG
    In 2012 GlencaTec AG spun-off from mb-microtec a well-established company in the development and production of glass micro-components. GlencaTec provides specialized laser micro welding services in a patented room temperature method for advanced hermetic glass encapsulation. Our technology allows to apply the advantages of glass (durable, biocompatible, chemical inert, transparent for optical and RF transmission) for miniaturized long-term packaging of sensitive electronics.
    Schunk Hoffmann Carbon Technology
    is a world leader in the development and production of carbon and graphite materials and components for the automotive and railway industries. Additionally, we provide two graphite-based solutions for the electronics cooling industry. The composite material, Aluminium Graphite (ALG), combines the low coefficient of thermal expansion and density of graphite with the excellent thermal properties of aluminium to create an ideal thermal management material for high-reliability applications. With its ready machinability, we can produce customized ALG parts such as flanges or housings for power amplifiers in various quantities with a range of platings. Our new phase change composite material, Latent Heat Carbon, is a novel approach to latent heat storage units. It is ideally suited to buffering temperature peaks. Its Expand to Shape production process allows for custom designs at an attractive cost that can be tailored to individual customer needs.
    Founded in 1992, JFPMicrotechnic has established itself as a supplier of equipments of microelectronics, optoelectronics, semiconductor production and microtechnology. The company specializes in the design, development and manufacture of hybrids and micromechanical equipment for manual and automated applications in the semiconductor industry as well as components for laboratory applications and serial production, ...Production activities essentially focus on equipment for the gluing and soldering of chips in pick and place operations, as well as the fabrication of test equipment for the characterization of laser diode components with integrated sorting functions and diamond scribers offering a complete package of solutions (scribing, component separation and optical sorting, including visual and/or palletising).
    Torrey Hills
    Torrey Hills Technologies, LLC
    is a leader in developing and delivering quality yet extremely affordable materials, fabricated parts, and equipment for multiple industries. The company's core business includes refractory metal heat sinks (CuW, CuMo, CMC, CPC), fabricated microelectronics packaging components, molybdenum, tungsten and their alloy materials, and furnace equipment for electronics and solar cell industry.
    Materion Advanced Materials Group
    is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic cover/lids for the microelectronics industry.  We offer a comprehensive portfolio of packaging materials in precious or non-precious material and can customize innovative electronic package materials to satisfy your unique needs.  Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.  


    Download/Submit Registration Form

    Speaker Dates/Information:

    • Abstracts Deadline Extended: FEBRUARY 24, 2017
    • Speaker Notifications Sent: February 28, 2017
    • Early Registration and Hotel Deadlines: March 2017
    • Speaker BIO & Photo Due: April 10, 2017
    • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: April 27, 2017
    • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up)
    • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


    Hotel Reservations:

    Tel: +33 (0) 1 39 67 17 73 or Email questions to Florence Vireton:




  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic