Heraeus ELD

2015 RaMP Workshop and Tabletop Exhibition

April 16, 2015
Weetwood Hall Conference Centre, Otley Road
Leeds, LS16 5PS - United Kingdom


SUBMIT ABSTRACT

Abstract Deadline: November 30, 2014

Additional Details at: http://uk.imapseurope.org/index.php/event-calender/details/47-RaMP

Organizing Committee:

General Chair
Matt Brown
IMAPS UK Chapter
matt.brown@imaps.org.uk
General Co-Chair
Suzanne Costello
MCS Ltd
scostello@materials-consult.co.uk
General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
Technical Co-Chair:
Susan Trulli
Raytheon Integrated Defense Systems
Susan_C_Trulli@raytheon.com

Technical Co-Chair:
Michel de Langen
NXP Semiconductors
michel.de.langen@nxp.com

Technical Co-Chair:
Dr Paul Huggett
KTN
paul.huggett@ktn-uk.org

Technical Co-Chair:
Prof Ian Robertson
University of Leeds
i.d.robertson@leeds.ac.uk

Program Committee:

Steve Annas - Triton Microtech
Keith Arber - Selex AS
Hansu Birol - CSEM Brasil
Mumtaz Bora - Peregrine Semi
Sean Cahill - Maxim
Wei Fan - Momentive
Angel Han - Huawei
Guosheng Jiang - China Central South Univ.
Richard Lang
Cai Liang - Integra

Sanjay Nimavet - Rakon
Dave Saums - DS&A
Vern Stygar - AGC
Ramesh Varma - Northrop Grumman
David Virissimo - Ametek

SUBMIT ABSTRACT
HOTEL | REGISTRATION | SPEAKER INFO | ACADEMIC POSTER/COMPETITION


RaMP 2015 Focus:
The objective of the RF and Microwave Technical Conference is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging & related technologies. This Conference will enable discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, the hosted by IMAPS-UK and co-sponsored by IMAPS-US & KTN, is the second in a series of joint Technical Conferences on RF and Microwave packaging between IMAPS-US and IMAPS-UK.

 

Sessions are being planned and abstracts are being requested in the following areas:

Design Modelling & Test

Technologies

Materials

Applications
  • New Power Amplifier Design Beyond LDMOS
  • Characterization Techniques
  • Modelling
  • Test
  • 3D RF/MW
  • RFIC/MMIC packaging
  • RF MEMS
  • Reliability
  • Electromagnetic modelling
  • Package-Circuit Co-simulation
  • Multi-physics modelling
  • 60 GHz Personal Area Network (PAN)
  • IR, Photonics & Terahertz Packaging
  • Nano-packaging
  • 3D RF/MW
  • New and Disruptive Technology
  • EMI Shielding for RF/MW Packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • RF/MW over Optical
  • Thermal Management
  • New Uncooled IR Sensors
  • Plastic RF/MW Packaging
  • RF MEMS
  • Low loss, wide BW, high Power Interconnects
  • Graphene
  • Substrates
  • Ceramics
  • LTCC
  • TIMS
  • Printed Materials
  • Photoimageable
  • Polymers
  • Military / space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Pulsed Power
  • Space / Sat Comms
  • Extreme Environments
  • MEMS/NEMS
  • Biomedical /Biosensing
  • Reliability
  • Automotive
  • High Speed Electronics Medical electronics
  • Wearable electronics
  • Multi-GHz Radar Systems
  • Electronic Warfare (EW)
  • RFID
  • 5G & Telecoms
  • 60 GHz Personal Area Network (PAN)

SUBMISSION:
Those wishing to present a paper at the RaMP 2014 Workshop must submit a 200-300 word abstract electronically no later than NOVEMBER 30, 2014, using the on-line submittal form at: www.imaps.org/abstracts.htm.

All abstracts submitted must represent original, previously unpublished work. Student submissions will only be considered for the “Academic Research Session”. No formal technical paper is required. The chosen abstracts will be reproduced in the event handbook along with a short ‘Author biography’ and photograph. This information must be supplied to IMAPS by 20 February 2015. A copy of the full presentation should be submitted by 16 March 2015 latest, for preparation and inclusion in the event delegate pack. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. All authors and attendees find that this Conference format is a proven forum for informal but highly effective networking between attendees and speakers.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Submit Abstract(s)

Call for Academic Research Posters:
In addition, Posters are sought showcasing related work for a dedicated one-hour "Academic Research Session". Besides providing an A1 Poster Display for static presentation and further discussion, each presenter will also have the chance to make a short, high-impact presentation to attendees (5 minutes), during the one-hour "Academic Research Session". This opportunity is unique to IMAPS-UK events.

Student Paper/Poster Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at/after the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

 

Awards:
Awards will be given in the following categories: Best Paper & Best Academic Research Session Presentation. In both cases, the winners will also receive an invitation to attend the next IMAPS-UK annual conference “MicroTech”, free-of-charge.

 



Registration Information: (Early Registration Deadline: March 2015 - TBD)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 3/2015
Advance/Onsite Fee
After 3/2015
IMAPS Member
TBD
TBD
Non-Member
TBD
TBD
Speaker
TBD
TBD
Chair
TBD
TBD
Student
TBD
TBD
Chapter Officer
TBD
TBD
Tabletop Exhibit (Member)
TBD
TBD
Tabletop Exhibit (Non-Member)
TBD
TBD
Premier Sponsorship (Includes Tabletop)
$1200
$1200
Event Sponsorship (Tabletop not included)
$500
$500

On-line Registration - SOON


Speaker Dates/Information:

  • Abstracts Deadline: November 30, 2014
  • Speaker Notifications Sent: December 15, 2014
  • Early Registration and Hotel Deadlines: March 2015
  • Speaker BIO & Photo Due: February 20, 2015
  • Powerpoint/Presentation file due not later than: March 16, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Hotel Reservations: (Hotel Deadline: March 2015)
Reservation must be made directly with the:

HOTEL TBD
Leeds UK

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Honeywell
  • Indium
  • Isola Group
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Natel
  • Palomar
  • Petroferm
  • Prince & Izant
  • Quik-Pak
  • Specialty Coating Systems