RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Tuesday, September 22

Golf Tournament sponsored by the IMAPS San Diego Chapter - Including lunch
7:30 am – 12:30 pm
www.imaps.org/rf/golf2009.htm

Registration: 1:00 pm – 8:00 pm

Opening Remarks/Welcome: 2:00 pm – 2:15 pm

Session 1: Novel MMW Packaging & Materials Characterization
Chair: Sean Cahill, BridgeWave Communications
2:15 pm – 5:15 pm

Quilt Packaging of RF Systems with Ultrawide Bandwidths
Patrick Fay, David Kopp, Cai Liang, Jason Kulick, Mohammad Khan, Gary H. Bernstein, University of Notre Dame

Characterization of Barium Strontium Titanate at G-Band
Nurul Osman, Charles Free, University of Surrey

Flip Chip for Millimeter Wave Applications
James Bardeen, Mike Pettus, VubIQ Inc.

Break : 3:45 pm – 4:15 pm

A Novel Packaging Technology for Millimeter Wave Subsystems and Components
Dana E. Wheeler, John McNicol, HXI LLC

A Low Power CMOS 60GHz Transceiver with LTCC On-Package Patch Antenna
Maryam Tabesh, Cristian Marcu, Jungdong Park, Lingkai Kong, Debopriyo Chowdhury, Chintan Thakkar, Antti Lamminen, Jussi Säily, Kari Kautio, Elad Alon, Ali Niknejad, UC Berkeley & Technical Research Centre of Finland (VTT)

Wednesday, September 23

Registration: 7:00 am – 4:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am How to Start a Microelectronics and Packaging Business in Canada Chantal Ramsay, Canadian Consulate LA & Dr. Jayna Sheats, CTO, Terepac Corporation Speaker Bio: Ms. Ramsay is the Consul (Economic Affairs - Ontario) at the Ontario International Marketing Centre (OIMC) in the Canadian Consulate General in Los Angeles. The International Marketing Centre’s territory includes California, Arizona, New Mexico, Nevada and Hawaii. The role of the OIMC is to work with Ontario based companies wishing to do business in the territory, to attract investment from US and multinational companies into Ontario and to raise awareness of the Province in the region. Prior to this posting, Ms Ramsay was a Senior Manager with the Investment Branch of the Ministry of Economic Development and Trade of Ontario in Toronto, Ontario. Ms Ramsay is a graduate of the Laurentian University, Sudbury, Ontario - Honours Bachelor of Science in Language with a minor in Economics. She speaks Spanish, French and Italian.

Session 2: Advanced RF & Microwave Packaging Materials
Chair: Ken Kuang, Torrey Hills Technologies, LLC
8:45 am – 11:45 am

Advanced Getter Materials for GaAs, RF/MW, MEMs and Other Microelectronic Packages
Richard Kullberg, Bradley L. Phillip, Vacuum Energy Inc.; Timothy J. Shepodd, Sandia National Laboratories

Characterization of DuPont 9K7 LTCC Material System for RF/Microwave Packaging Applications
Deepukumar Nair, K. E. Souders, K. M. Nair, M. F. McCombs, J. M. Parisi, Brad Thrasher, DuPont

Modifiable Silicones for Harsh Environments
Michelle Velderrain, Nusil Technology LLC

Break : 10:15 am – 10:45 am

Development of Low Cost Heat Spreaders
Irwin Kim, ISQTECH

Materials Declaration for Semiconductor Packages
Mumtaz Yusuf Bora, Peregrine Semiconductors

Lunch: 11:45 am – 12:45 pm

Session 3: Advanced Thermal Management Materials
Chair: Bill Ishii, Torrey Hills Technologies, LLC
1:00 pm – 4:30 pm

Advanced Materials Solutions for Thermal Management Design: Metallized Pyrolytic Graphite Structures
Robert Moskaitis, Richard J. Lemak, MINTEQ International Inc./PYROGENICS Group; David Pickrell, OMEGAPIEZO

Advanced TPG Material for the Thermal Management of Electronics
Xiang "Shawn" Liu, Momentive Performance Materials

New Aluminum-Silicon Carbide Composites for Air Cavity Package Applications
Dan White, Thermal Transfer Composites LLC; Craig Rotay, ST Microelectronics,

Break: 2:30 pm – 3:00 pm

Transient Liquid Phase Sintering Adhesives for Radar T/R Module Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Performance and Cost Benefits of Si-Al Substrates in the Manufacture of RF and Microwave III-V Semiconductor Devices
Andrew J. W. Ogilvy, Sandvik Osprey Ltd.; Stuart Weinshanker, Advanced Packaging Associates, Inc.

Development of Super Copper Tungsten
Ken Kuang, Torrey Hills Technologies, LLC; Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd.; Junkun Ma, Southeastern Louisiana University

Thursday, September 24

Registration: 7:00 am – 4:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am RF & Microwave Packaging Development in China Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd. Speaker Bio: Mr. Danny Zhu is co-founder of Jiangsu Sci. & Tech Co Ltd and has been its General Manager since January 2008. Before that, Danny was sales engineer for Brush Wellman (China) and engineering manager for a major electronics component manufacturing company. Danny has a BS Degree in Materials Sci & Engineer from China University of Electronics.

Session 4: Novel RF & Microwave Packaging Manufacturing Process
Chair: Franklin Kim, Kyocera America, Inc.
8:45 am – 12:15 pm

Bridging the Manufacturing Gap between Macro and Micro to Build Packaging for Miniature RF Devices with Complex Geometries and Multiple Materials
Arthur L. Chait, EoPlex Technologies, Inc.

Near Hermetic Wafer Level Packaging using LCP Adhesive Layer
Brandon Pillans, Raytheon

Wide Band Gap RF/Microwave Power Transistors Require Package Updates
Mike Mallinger, Mar Caballero, Microsemi Corp RFIS

Break: 10:15 am – 10:45 am

Z-Axis Interconnection for Organic Laminate Electronic Packages
Voya R. Markovich, Frank Egitto, Subahu Desai, Endicott Interconnect Technologies, Inc.

Low Cost Test Technique for RF Interconnects in MCM Substrate
Sukeshwar Kannan, Bruce Kim, University of Alabama

Packaging Technology Development for Silicon on Sapphire based Commercial RF IC Products
John Yang, Peregrine Semiconductor

Session 5: Design / Simulation for Ceramic Based RF & Microwave Packaging
Chair: Susan Trulli, Raytheon RD Components
1:20 pm – 3:50 pm

Fundamentals of Highly Integrated Co-Fired Packaging
Dan Harris, Lockheed Martin

Numerical Study of the Performance of a Super CuW / BeO Package
Junkun Ma, Xialu Wei, Southeastern Louisiana University

Design of Transmit/Receive Modules
Rick Sturdivant, Microwave Packaging Technology, Inc.

Extraction of Dielectric Constant and Loss Tangent of Microwave Substrates using Full Sheet Resonance Method
A. Ege Engin, San Diego State University

Microwave Filters for RF/Microwave Circuits
Edward Liang, MCV Technologies, Inc.

 

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