KESTER

2016 RaMP Workshop and Tabletop Exhibition

April 5-6, 2016
DoubleTree San Diego - Hotel Circle
1515 Hotel Circle South
San Diego, California 92108


Organizing Committee:

General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
General Co-Chair
Susan Trulli
Raytheon Integrated Defense Systems
Susan_C_Trulli@raytheon.com
General Co-Chair
Matt Brown
IMAPS UK Chapter
matt.brown@imaps.org.uk
General Co-Chair
Brigitte Braux
IMAPS-Europe President
brigitte.braux@airbus.com
Technical Co-Chair:
Michel de Langen
Ampleon Netherlands B.V.
Michel.de.Langen@Ampleon.com

Technical Co-Chair:
Sean Cahill
BridgeWave Communications, Inc.
Sean.Cahill@maximintegrated.com

Technical Co-Chair:
Dr Paul Huggett
BP KTN
paul.huggett@espktn.org

 

Program Committee:

Hansu Birol - HB Technology, Brazil
Chris Blatt – Pacific Rim Scientific
Mumtaz Bora – Peregrine Semi
Liang Cai – Integra
Suzanne Costello - Materials Consultancy Services
Martin Goetz – Northrop Grumman
Ramesh Varma – Northrop Grumman
Bill Ishii – Torrey Hills Technologies, LLC
Carl Edwards – Adv. Materials Innovations
James Haley – Ormet
Wally Johnson – IMAPS San Diego
Casey Krawiec – Quik-Pak
Iris Labadie – Kyocera
Richard Lang – Diamond Microwave
Andy Longford – IMAPS UK
Ray Petit - Pacific Rim Scientific
Vern Stygar – AGC

David Virissimo - Ametek
James Wang – WinTech Media
Renzhe Zhao – Huawei
Chris Hunt – IMAPS UK
Sanjay Nimavet – IMAPS UK
Keith Arber – IMAPS UK
Wei Fan – Momentive
Hannah Going – Accel RF

EXHIBITS

Thank you to our Premier Sponsor:

Corporate Sponsor - NGK NTK


RaMP 2016 Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is now being co-sponsored by IMAPS-UK as a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-UK.

Tuesday, April 5, 2016

8:00am - 6:00pm: Registration

7:30am - 8:30am: Continental Breakfast

10:30am - 6:30pm: Tabletop Exhibition (during breaks / when program not in session)

8:30am - 8:45am: Opening Remarks
General Chair: Ken Kuang, Torrey Hills Technologies, LLC


8:45am - 9:30am: KEYNOTE PRESENTATION:

Keynote - Mukkavilli

The Vision of 5G

ABSTRACT: 5G is the next generation mobile wireless technology which is being standardized in 3GPP with target completion of Phase 1 specification in 2018 and commercialization in 2020. 5G will support diverse use cases across enhanced mobile broadband, Internet of Things, and high-reliability services utilizing a broad range of spectrum bands, including sub-6GHz and above 6GHz including mmWave bands such as 28GHz. To accomplish these, Qualcomm Technologies is developing a high performance and energy efficient unified 5G air interface design leveraging the latest advancements in silicon and RF technologies. 5G air interface design will incorporate advanced physical and MAC layer techniques to effectively support 5G use cases leveraging a broad range of spectrum bands and types. 5G network design will deliver a scalable and flexible framework for efficiently supporting next generation services and devices. In this presentation, we will provide an overview of the 5G unified design to support the diverse requirements of emerging mobile/wireless services across a range of devices.

Dr. Kiran Mukkavilli, Qualcomm
Dr. K. Kiran Mukkavilli is a Principal Engineer/Manager in Qualcomm Research. He joined Qualcomm in 2003, holds 40 U.S.patents, and has been involved in system design, implementation and commercialization of a variety of projects at Qualcomm. He was one of the principal architects of MediaFLO, a mobile broadcast solution from Qualcomm, and was heavily involved in the product development, standardization and commercialization efforts. He was also the systems design lead responsible for commercialization of the UMTS modem in Qualcomm Snapdragon 800/801 products. In his current role, Dr. Mukkavilli is actively involved in the 5G systems research and standardization activity in several industry forums and is the systems lead for 5G prototype development. Dr. Mukkavilli received his Ph.D. in electrical engineering from Rice University in 2003 and also holds M.S. from Rice University and Bachelor of Technology from Indian Institute of Technology, Madras.

 

Session 1: SIMULATION / THERMAL / DESIGN
Session Chair: Michel de Langen, Ampleon Netherlands B.V.
9:30am - 12:30pm

Thermal Analysis of 100V GaN RF Transistors for CW High Power ISM Applications
Gabriele Formicone, Integra Technologies, Inc.

Modeling and Simulation of Via Conductor Losses in Co-fired Ceramic Substrates Used In Transmit/Receive Radar Modules
Rick Sturdivant, MPT, Inc. (Edwin K. P. Chong, Colorado State University)

10:30am - 11:00am: Networking Break in Exhibits

Simulation Assisted Thermal Management System Design to Remove Critical Heat from High Power Electronics
Wei Fan, Momentive Performance Materials Inc. (Eelco Galestien, Creighton Tomek, Manjunath S)

Design of C-Band Interdigital Filter on Film Substrate
Min Tan, East China Research Institute of Microelectronics (Yang Xuan, Yong Ma, Li Li, Yonghe Zhuang)

The Novel Compact C-band Hairpin Bandpass Film Filter
Yang Xuan, East China Research Institute of Microelectronics (Min Tan, Yong Ma, Li Li, Yonghe Zhuang)

12:30pm - 2:00pm: Lunch & Networking in Exhibits


Session 2: RF PACKAGING ASSEMBLY
Session Chair: Susan Trulli, Raytheon Integrated Defense Systems
2:00pm - 5:00pm

Approaches for RF Performance Optimization in Wafer Scale 3D Packaging
Sue Trulli, Raytheon - Details Soon

NSOP Reduction of QFN RF-IC Packages
Mumtaz Bora, Peregrine Semiconductor

Assembly Technology Studies in RF & Optoelectronic Packages
Daniel Evans, Palomar Technologies

3:30pm - 4:00pm: Networking Break in Exhibits

Challenges in Packaging and Assembly Advanced Power Amplifiers
Cai Liang, Integra Technologies inc. (Jeff Burger)

Innovation and R&D Management Push Huawei from USD 5,680 Startup to 60 Billion USD Annual Sales in 2015
Lihua Zhang, Beijing Successes Consulting Company

5:00pm - 6:00pm: Exhibit Hall Reception


Wednesday, April 6, 2016

8:00am - 6:00pm: Registration

7:30am - 8:30am: Continental Breakfast

10:30am - 4:00pm: Tabletop Exhibition (during breaks / when program not in session)

8:30am - 8:45am: Opening Remarks
General Chair: Ken Kuang, Torrey Hills Technologies, LLC


8:45am - 9:30am: KEYNOTE PRESENTATION:

Keynote - Busnaina

High-rate Nano and Microscale Printing of Electronics and Sensors

ABSTRACT: The NSF Center for High-rate Nanomanufacturing (CHN) has developed a new fully automated system that uses directed assembly based printing at the nanoscale to make products that fully take advantage of the superior properties of nanomaterials. The Nanoscale Offset Printing System (NanoOPS) can print metals, insulators and semiconductors (including wide-bandgap such as III-V and II-VI), organic and inorganic materials into nanoscale structures and circuits (down to 20 nanometers). The fully automated robotic cluster tool system prints at the nanoscale to make products that take full advantage of the superior properties of nanomaterials. The NanoOPS has been used to print utilizing the following nanomaterials: nanoparticles, nanotubes, nanowires, 2D materials and polymers. The center has many applications where the technology has been demonstrated. The Center has shown a new way to print interconnects on any substrate as well as transistors and invertors using carbon nanotubes and 2D materials. The Center has also printed transistors and invertors using carbon nanotubes and 2D materials such as MoS2. The center has developed many sensors, among them a biosensor chip (0.02 mm) capable of detecting multiple biomarkers simultaneously. In addition, the center made a printed Band-Aid sensor that could read glucose, urea and lactate levels using sweat. An inexpensive micro chemical sensor with a low detection limit that’s less than 1 mm in size has also been developed. The Center also made many functional materials applications using nanoparticles and other nanomaterials to enhance plasmonic effects or reduce reflection on a variety of surfaces.

Ahmed A. Busnaina, Ph.D. is the William Lincoln Smith Chair Professor, Distinguished University Professor and founding Director of National Science Foundation’s Nanoscale Science and Engineering Center for High-rate Nanomanufacturing and the NSF Center for Nano and Micro-contamination Control at Northeastern University, Boston, MA. Prof. Busnaina is internationally recognized for his work on nano and micro scale defects mitigation and removal in micro and nanofabrication. He specializes in directed assembly of nanoelements and in the nanomanufacturing of micro and nanoscale devices. His research support exceeds $50 million. He authored more than 600 papers in journals, proceedings and conferences in addition to 25 filed and awarded patents. He is an associate editor of the Journal of Nanoparticle Research. He also serves on many advisory boards including Samsung Electronics, International Technology Roadmap for Semiconductors, Journal of Particulate Science and Technology, Journal of Environmental Sciences, Journal of Advanced Applications in Contamination Control. He is a fellow of the American Society of Mechanical Engineers, and the Adhesion Society, a Fulbright Senior Scholar and listed in Who's Who in the World.

Session 3: MATERIALS FOR RF & MW PACKAGING
Session Chair: Wei Fan, Momentive Performance Materials Inc.
9:30am - 5:00pm

3D Graphene for Next Generation Thermal Management of GaN MMICs
Ramesh Varma, Northrop Grumman Mission Systems (Wes Nusbaum, Martin Goetz, Wei Fan)

Investigation of High-reliable Low-loss HTCC System Applied in Millimeter Wave Circuit Technology
Xueman Pang, NEDI Technology Co., Ltd (Yongbin Li, Qingshui Xia, lIfeng Tang, Ziliang Wang)

10:30am - 11:00pm: Networking Break in Exhibits

Development of Low Temperature Sintered Nano Silver Paste with Resin Reinforcing Technology
Kenneth Araujo, NAMICS Technologies, Inc.

A Novel Thermal Management Approach for Packaging of High Power GaN Devices
Marco Amiotti, Spectra-Mat Inc. (Kevin Loutfy, Nano Materials International Corporation; Greg Rudd, Spectra-Mat Inc.)

Common Refractory Metals Used for Passive Cooling in a Variety of Semiconductor Thermal Transfer Applications
Kevin Cotner, Santier

12:30pm - 2:00pm: RaMP Workshop Closing Remarks & Lunch in Exhibits

 

2:00pm - 6:00pm:
JOINT WORKSHOP AFTERNOON
IMAPS Workshop on RF/Microwave Packaging (RaMP) & the CPI Workshop will come together for a joint session, panel discussion, and networking! This is a great opportunity to both topical/industry segments to network and discuss common challenges, solutions and technologies.

2:00pm - 2:15pm : Opening of Joint Session: Objectives of joint session, and Introduction of Keynote speaker
RaMP General Chair: Ken Kuang, Torrey Hills Technologies, LLC
CPI Workshop General Chair: Urmi Ray, Qualcomm

2:15pm - 3:15pm: KEYNOTE PRESENTATION:

Keynote - Karim

System-in-Package (SiP) Solution for RF and Digital System Integration and Miniaturization

ABSTRACT: The demand for product miniaturization is driving the need for highly integrated systems in today’s mobile wireless, IoT/Wearable, Solid State Drive (SSD), automotive and other applications. RF and digital system miniaturization is a complex set of design challenges including high performance, small footprint, reduced process geometries and increased test and reliability, all requiring new and innovative techniques in System-in-Package (SiP) solutions. SiP lets system designers to mix and match technologies, such as RF/Microwave in silicon and Gallium Arsenide forms, digital, mix-mode, power, MEMS, sensors, antenna, crystals, conformal/compartmental shielding and other passives components in the same package. SiP comes in different package platform from 2.5D/3D package, WLFOUT, stacked die, Package on Package, Package in Package, leadframe package, BGA & LGA packages, including embedded active and passive components in a substrate.

Nozad Karim presently is the Vice President of SiP & System Integration at Amkor Technology. He has over 30 years of experience working with semiconductor packaging, System in Package, circuit and system designs for digital, analog, and RF/Microwave applications. Prior to Amkor, he served in engineering and management roles with Motorola Communication, Texas Instruments, & Compaq/HP.

 

3:15pm - 4:00pm: Networking Break in RaMP Exhibits

4:00pm - 6:00pm: PANEL SESSION:

Industry Expert Panel Session on:
Challenges of RF integration into Fan-Out Wafer Level Packaging
and Embedded Die in Substrate

Details of the panel discussion will be available soon. The panelists will spend a few minutes speaking to the audience to lay the framework for this topic, before interactive Q/A with the audience!

MODERATOR: Urmi Ray, Qualcomm

PANELISTS:
Tanja Braun, Fraunhofer IZM
Franklin Kim, Kyocera America

Mark Nakamoto, Qualcomm
Ray Petit, Pacific Rim Engineering
Rich Rice, ASE
Rick Sigliano, Kyocera
Susan Trulli, Raytheon Integrated Defense Systems
Jan Vardaman, TechSearch International

7:00pm - 9:00pm: Group Networking/Social Event: REGISTER ONLINE

San Diego Bay Cruise Social
Sponsored by:
Torrey Hills Technologies - Materion Ceramics - EMD Materials

April 6, 2016 | 7pm-9pm
(Bus pickup from hotel at 6:30pm)

$15 per person

Enjoy an evening social cruising the San Diego Bay on the private catamaran Aolani! Light hors d’ouevres will be provided, along with a cash bar, after the catamaran departs the Sheraton Harbor Island Hotel and Marina. This private charter will cruise the bay for two hours before returning. Transportation to/from the Doubletree San Diego Hotel Circle (RaMP and CPI workshop location) will be provided. Register early – the vessel has limited capacity of 48 cruisers!

 



Registration Information: (Early Registration Deadline: March 11, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 3/11/2016
Advance/Onsite Fee
After 3/11/2016
IMAPS Member
$550
$650
Non-Member
$675
$775
Speaker
$400
$500
Chair
$400
$500
Student
$150
$150
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$500
$600
Tabletop Exhibit (Non-Member)
$600
$700
Premier Sponsorship
Includes Tabletop & 1 conference badge & advertisements
$1500
$1500
Event Flyer Sponsorship
Your company flyer distributed via registration to all attendees. You provide the flyer to IMAPS
$250
$250



Speaker Dates/Information:

  • Abstracts Deadline Extended: February 19, 2016
  • Speaker Notifications Sent: February 29, 2016
  • Early Registration and Hotel Deadlines: March 11, 2016
  • Speaker BIO & Photo Due: April 1, 2016
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: April 6, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Hotel Reservations: (Hotel Deadline: March 11, 2016)
Reservation must be made directly with the:

DoubleTree San Diego - Hotel Circle
1515 Hotel Circle South
San Diego, California 92108
Phone: 800-486-5315

 

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems