Advanced Technology Workshop on
RF and Microwave Packaging
September 22-24, 2009
The Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108-2810
IMAPS SoCal Golf Tournament the morning of September 22, 2009
Abstract Deadline Extended To: July 17, 2009
Organizing Committee: |
General Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com |
General Co-Chair
Susan Trulli
Raytheon RD Components
susan_c_trulli@raytheon.com |
Technical Co-Chair:
Franklin Kim
Kyocera America, Inc.
franklin.kim@kyocera.com |
Technical Co-Chair:
Sean Cahill
BridgeWave
SeanC@Bridgewave.com |
Advisory Committee: |
Steve Adamson, Asymtek, Inc.
Ron Barnett, National Instruments
Carl Edwards, Space Micro, Inc.
Aicha Elshabini, University of Idaho
Bill Ishii, Torrey Hills Technologies, LLC
Wally Johnson , Coorstek, Inc.
Iris Labadie, Kyocera America, Inc. |
Charles Lin, Bridge Semiconductor, Taiwan
Walt Napoleon, KL Marketing
David Shields, Component Surfaces, Inc.
Ziliang Wang, Nanjing Electronics Device Institute
Mumtaz Bora
Kai Cheng, Nanjing Guosheng Electronics
Mark Eblen, Kyocera America
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Guosheng Jiang, China Central South Univ.
Lee Levine, IMAPS VP of Technology
Mark Tomei, Kyocera America, Inc.
David Virissimo, SPM
Danny Zhu, Jiangsu Dingqi Sci. & Tech. Co. Ltd
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RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Abstracts are being requested in the following areas:
| Emerging Technologies |
New Design/Materials |
New Applications |
- 60 GHz Personal Area Network (PAN)
- Short wave IR packaging
- Nanopackaging
- 3D RF/MW
- New and disruptive technology
- EMI shielding for RF/MW packaging
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- New power amplifier design beyond LDMOS
- Thermal management
- New IR sensors without cooling
- Plastic RF/MW packaging
- Lead free
- RF MEMS
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- Military / Space
- Optoelectronics (night vision, thermal weapon sight, etc.)
- High Power Electronics
- Space/Extreme Environments
- MEMS/NEMS
- Biomedical
- Telecommunications
- Reliability
- MMIC
- Automotive
- SIP
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Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.
Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later July 17, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.
Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 21, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.
Submit Abstract(s)
Student Competition sponsored by The Microelectronics Foundation:
| The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award. |
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Speaker Dates/Information:
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Abstracts Due: July 17, 2009
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Extended Abstract or Presentation Material due: August 21, 2009
- Early Registration and Hotel Deadlines: August 2009
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Powerpoint/Presentation file for CD-Rom due not later than: September 24, 2009
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
Hotel Reservations: (Hotel Deadline: August 2009)
Reservation must be made directly with the:
Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108
Phone: 800-882-0858.
www.cp-sandiego.com
Please reference International Microelectronics And Packaging Society when making reservations by phone.
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