Heraeus ELD

2014 RaMP Workshop and Tabletop Exhibition

April 8-9, 2014
Crowne Plaza San Diego
San Diego, CA

Early Registration & Hotel Deadlines: March 14, 2014

Organizing Committee:

General Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
General Co-Chair
Susan Trulli
Raytheon RF Components
susan_c_trulli@raytheon.com
General Co-Chair
Matt Brown
IMAPS UK Chapter
matt.brown@imaps.org.uk
Technical Co-Chair:
Sean Cahill
Maxim
cahsea@gmail.com

Technical Co-Chair:
Michel de Langen
NXP Semiconductors
michel.de.langen@nxp.com

Technical Co-Chair:
Dr Paul Huggett
ESP-KTN
paul.huggett@espktn.org

Program Committee:

Steve Annas - Triton Microtech
Hansu Birol - CSEM Brasil
Mumtaz Bora - Peregrine Semi
Suzanne Costello - MCS ltd.
Martin Goetz - Northrop Grumman
Angel Han - Huawei
Bill Ishii - Torrey Hills Tech
Guosheng Jiang - China Central South Univ. Casey Krawiec - Quik-Pak

Voya Markovich
Vern Stygar - AGC
David Virissimo - Ametek
Renzhe Zhao - Huawei

2014 Exhibitors



Thank you to our Premier Sponsors:

Palomar Technologies - Premier Sponsor
Quik-Pak - Premier Sponsor

RaMP 2014 Focus:
The objective of the RaMP 2014 Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. RaMP enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-organized by IMAPS-UK and will be the first in a series of joint RaMP workshops between IMAPS and IMAPS-UK.

SOLD OUT 2014 Tabletop Exhibit -- Limited to 15 tabletops

 

Tuesday, April 8 , 2014

Registration: 7:00 am - 7:00 pm

Continental Breakfast: 7:00 am - 7:45 am

Tabletop Exhibition: 3:00 pm - 7:00 pm
Refreshment Breaks & Reception will be held in the Exhibit Area

OPENING REMARKS: 8:00 am - 8:15 am
RaMP 2014 Workshop General Chair
Ken Kuang, Torrey Hills Technologies, LLC

KEYNOTE SPEAKER: 8:15 am - 9:00 am
3D Research for Electronics Packaging
Dr. Robert Kay, Additive Manufacturing Research Group (AMRG), Loughborough University

Dr. Robert Kay obtained an honours degree in Electrical & Electronic Engineering and a Ph.D in Microsystems Engineering from Heriot-Watt University, Edinburgh, UK. Robert is now a Senior Lecturer in Additive Manufacturing within the Wolfson School of Mechanical and Manufacturing engineering at Loughborough University. His research interests primarily focuses around using additive manufacturing processes for integrating microsystems technology into a wide range of applications for creating smarter more functional devices.

During the course of Robert's Doctorate studies he developed a novel microfabrication manufacturing process for the production of precision electroformed stencils used mainly for the deposition of interconnects for electronic packaging. He successfully commercialised this research by founding MicroStencil Limited in 2003. Through his supervision of the Company he scaled the product up for commercial production, build a diverse customer base and established a manufacturing partnership license agreement in Asia.

Session 1: Advanced RF Packaging
Session Chairs: Michel de Langen, NXP; Martin Goetz, Northrop Grumman
9:00 am - 12:30 pm

9:00 am - 9:30 am
Qualification of RF Package for Automotive Application
Mumtaz Bora, Peregrine Semiconductor

9:30 am - 10:00 am
Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina
Rick Sturdivant, RLS Design, Inc.

10:00 am - 10:30 am
Challenges and Opportunities for Ceramic Packaging
Ken Kuang, Torrey Hills Technologies, LLC

Coffee Break in Foyer: 10:30 am - 11:00 am

11:00 am - 11:30 am
High Performance Hydrogen Getter for Hermetic Packaging of Electronic Devices
Alessandro Morbiato, SAES Group (E. Rizzi, L.Mauri, A.Hayden, H.Florence)

11:30 am - 12:00 pm
A Wide Bandgap Discrete Package for High Performance, High Temperature Applications
Brandon Passmore, Arkansas Power Electronics International (B. McPherson, Z. Cole, P. Killeen, D. Martin, T. McNutt)

12:00 pm - 12:30 pm
Aluminum Nitride Energy Harvesters for High Temperature Wireless Sensor Systems
Yun-Ju Lai, University of California, Berkeley (Albert P. Pisano)

Lunch Break: 12:30 pm - 1:30 pm

Session 2: RF Packaging Assembly
Session Chairs: Paul Huggett, ESP-KTN; Renzhe Zhao, Huawei
1:30 pm - 5:30 pm

1:30 pm - 2:00 pm
Optimizing Solder Bonding for High Power Applications
Ramesh Varma, Northrop Grumman Corporation (Thomas Knight, Martin Goetz, William Winkel)

2:00 pm - 2:30 pm
Failure Analysis of SnPb Solder Joints on Cu-Fe-P Lead Frame of Power MOSFET
Lihua Cao, Institute of Metal Research, Chinese Academy of Sciences (Zhiquan Liu, Chinese Academy of Sciences; Yongliang Zhang, Cui Zhang, Renzhe Zhao, Huawei Technologies)

2:30 pm - 3:00 pm
Automated Eutectic Attachment Technology Studies in RF & Microwave Packages
Daniel Evans, Palomar Technologies, Inc. (Zeger Bok)

Coffee Break in Exhibits: 3:00 pm - 4:00 pm

4:00 pm - 4:30 pm
Surface Preparation for Wire Bonding
David Jackson, CleanLogix LLC

4:30 pm - 5:00 pm
Assembly of a Integrated High-Power Amplifier
Michel de Langen, NXP Semiconductors

5:00 pm - 5:30 pm
The Influence of the Coating Layer of the Soldered Device to the Reliability of Their Interconnection with Ni Coated Cu Wires
Ying Zhong, Harbin Institute of Technology (Chunqing Wang, J.F.J. Caers, Xiujuan Zhao)

Reception in Exhibits: 5:30 pm - 7:00 pm

 

Wednesday, April 9, 2014

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 7:45 am

Tabletop Exhibition: 10:00 am - 2:00 pm
Lunch & Refreshment Break will be held in the Exhibit Area

OPENING REMARKS: 8:00 am - 8:15 am
RaMP 2014 Workshop General Co-Chair
Susan Trulli, Raytheon RF Components

KEYNOTE SPEAKER: 8:15 am - 9:00 am
Architecture Trends in Mobile Industry and Impact on Packaging and Integration
Urmi Ray, Qualcomm Inc.

Urmi Ray is a Principal Engineer in the Qualcomm Advanced Technologies and Integration group. She has been the technology lead in several forward looking programs in 3D and 2.5D, with particular focus on low cost packaging for mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in NJ working on advanced materials and reliability for a diverse set of product portfolios, including consumer products to high reliability telecommunications projects. She is currently active in the 3D technology area. She has a PhD from Columbia University (New York City).

Session 3: Modeling and Simulation
Session Chairs: Sean Cahill, Maxim; Casey Kraweic, Quik-Pak
9:00 am - 11:30 am

9:00 am - 9:30 am
Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging
Rick Sturdivant, RLS Design, Inc.

9:30 am - 10:00 am
Passive Macromodeling Methodology for TSV and Bondwire Interconnects
Eva Kozachenko, San Diego State University (Arif Engin)

Coffee Break in Exhibits: 10:00 am - 10:30 am

10:30 am - 11:00 am
Package and Board Effects in RF Multi-Function Assemblies
Tony Donisi, ANSYS, Inc.

11:00 am - 11:30 am
Advance Glass Packaging for High Frequency Devices and Remote Sensing for Life Science
Vern Stygar, AGC

Lunch Break in Exhibits: 11:30 am - 2:00 pm

Session 4: Thermal Management for RF Packaging
Session Chairs: Iris Labadie, Kyocera America; Cai Liang, Integra
2:00 pm - 5:00 pm

2:00 pm - 2:30 pm
The Effect of Plating, Surface Finish, and Bond Line Thickness on AuSn Solder Joints
Greg Rudd, Spectra-Mat, Inc (John Paff, Rob Brox)

2:30 pm - 3:00 pm
How Can Millions of Aligned Graphene Layers Cool High Power RF and Microwave Electronic
Wei Fan, Momentive Performance Materials Inc. (Xiang Liu, Aaron Rape)

Coffee Break in Foyer: 3:00 pm - 3:30 pm

3:30 pm - 4:00 pm
New Thermal Management of GaN RF PA's: A Progress Report
Thomas Obeloer, Element Six Technologies (Felix Ejeckam, Daniel Francis, Firooz Fiali, Frank Lowe, Daniel Twitchen, Bruce Bolliger)

4:00 pm - 4:30 pm
Development of Seven Layer Cu/Mo/Cu Thermal Management Material
Guosheng, Jiang Central South University

4:30 pm - 5:00 pm
Development and Application of Copper-Graphite Composite Thermal Control Cores for High-Reliability RF System PCBs
David Saums, DS&A LLC (Rob Hays, MMCC LLC)

Closing Remarks: 5:00 pm
Workshop General Chairs

Evening Dinner & Award Ceremony on Board Midway Aircraft Carrier Museum,
Chair: Ken Kuang

On-Line Registration



Registration Information: (Early Registration Deadline: March 14, 2014)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 3/14/2014
Advance/Onsite Fee
After 3/14/2014
IMAPS Member
$550
$650
Non-Member
$675
$775
Speaker
$400
$500
Chair
$400
$500
Student
$150
$150
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$675
$775
Tabletop Exhibit (Non-Member)
$775
$875
Premier Sponsorship (Includes Tabletop)
$1200
$1200
Event Sponsorship (Tabletop not included)
$500
$500



Speaker Dates/Information:

  • Abstracts Deadline Extended to: February 14, 2014
  • Speaker Notifications Sent: February 21, 2014
  • Early Registration and Hotel Deadlines: March 14, 2014
  • Speaker BIOs Due: March 21, 2014
  • Powerpoint/Presentation file for CD-Rom due not later than: April 9, 2014
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up emailed to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations: (Hotel Deadline: March 14, 2014)
Reservation must be made directly with the:

Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Honeywell
  • Indium
  • Isola Group
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Natel
  • Palomar
  • Petroferm
  • Prince & Izant
  • Quik-Pak
  • Specialty Coating Systems