2016 RaMP Workshop and Tabletop Exhibition

April 5-6, 2016
DoubleTree San Diego - Hotel Circle
1515 Hotel Circle South
San Diego, California 92108


Abstract Deadline Extended: February 12, 2016

Organizing Committee:

General Co-Chair
Ken Kuang
Torrey Hills Technologies, LLC
General Co-Chair
Susan Trulli
Raytheon Integrated Defense Systems
General Co-Chair
Matt Brown
IMAPS UK Chapter
General Co-Chair
Brigitte Braux
IMAPS-Europe President
Technical Co-Chair:
Michel de Langen
Ampleon Netherlands B.V.

Technical Co-Chair:
Sean Cahill
BridgeWave Communications, Inc.

Technical Co-Chair:
Dr Paul Huggett


Program Committee:

Hansu Birol - HB Technology, Brazil
Chris Blatt – Pacific Rim Scientific
Mumtaz Bora – Peregrine Semi
Liang Cai – Integra
Suzanne Costello - Materials Consultancy Services
Martin Goetz – Northrop Grumman
Ramesh Varma – Northrop Grumman
Bill Ishii – Torrey Hills Technologies, LLC
Carl Edwards – Adv. Materials Innovations
James Haley – Ormet
Wally Johnson – IMAPS San Diego
Casey Krawiec – Quik-Pak
Iris Labadie – Kyocera
Richard Lang – Diamond Microwave
Andy Longford – IMAPS UK
Ray Petit - Pacific Rim Scientific
Vern Stygar – AGC

David Virissimo - Ametek
James Wang – WinTech Media
Renzhe Zhao – Huawei
Chris Hunt – IMAPS UK
Sanjay Nimavet – IMAPS UK
Keith Arber – IMAPS UK
Wei Fan – Momentive
Hannah Going – Accel RF


RaMP 2016 Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-UK and will be the first in a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-UK.

The workshop will feature a joint technical plenary session on April 6 from 3:00-5:00pm with the participants of the IMAPS Chip-Package Interactions with
Fanout Wafer Level Packaging and Embedded Die in Substrate Workshop
. This joint session will bring together all of the participants from each workshop for:

  • Keynote Presentation by Nozad Karim, Amkor Technology
  • Industry expert Panel Session “Challenges of RF integration into Fan-Out Wafer Level Packaging and Embedded die in Substrate
  • Networking Reception with both workshops



Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

Current Technology
  • 60 GHz Personal Area Network (PAN)
  • Short Wave IR Packaging
  • Nanopackaging
  • 3D RF/MW
  • New and Disruptive Technology
  • EMI Shielding for RF/MW Packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New Power Amplifier Design Beyond LDMOS
  • Thermal Management
  • New Uncooled IR Sensors
  • Plastic RF/MW Packaging
  • Low loss, wide BW, high power interconnects
  • Military / space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics • Space / Extreme Environments
  • Biomedical
  • Telecomm
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics
  • Medical electronics
  • Wearable electronics

Those wishing to present a paper at the RaMP Workshop must submit a 300-500 word abstract electronically no later than FEBRUARY 12, 2016, using the on-line submittal form at:

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas. No formal technical paper is required.

Please contact Brian Schieman by email at if you have questions.

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. If you are having problems with the on-line submittal form, please email Ken Kuang at or call (858)558-6666.

Submit Abstract(s)

Student Paper/Poster Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at/after the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation


Registration Information: (Early Registration Deadline: March 2, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.


On-line Registration - OPEN SOON

Speaker Dates/Information:

  • Abstracts Deadline Extended: February 12, 2016
  • Speaker Notifications Sent: February 24, 2016
  • Early Registration and Hotel Deadlines: March 2, 2016
  • Speaker BIO & Photo Due: April 1, 2016
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: April 6, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Hotel Reservations: (Hotel Deadline: March 2, 2016)
Reservation must be made directly with the:

DoubleTree San Diego - Hotel Circle
1515 Hotel Circle South
San Diego, California 92108
Phone: 800-486-5315

Single/Double: $153+tax


Please reference IMAPS when making reservations by phone.


  • Amkor
  • ASE
  • Canon
  • Fastech Synergy Philippines
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems