IMAPS to Present Technical Session at SEMICON West 2007

Steve Adamson of Asymtek and IMAPS President-Elect has been asked to Chair an IMAPS Technical Session at SEMICON West.  The IMAPS Session will take place on July 18, 2007, from 3:00 – 5:00 in the afternoon and will feature the cutting edge technology that IMAPS delivers worldwide.  The IMAPS Session will take place in the Mosconi Center – West Hall.

Visit the SEMICON West website for more details on this IMAPS Session.

“Semi and IMAPS are exploring ways in which the two organizations can work cooperatively. We have started this process by putting together a group of five well regarded experts in the field of microelectronics and electronic packaging for this special session at Semicon West in San Francisco. The abstracts we’ve received indicate that the IMAPS session at SEMICON West will be of the highest caliber”, Adamson said.

The following speakers have already committed papers to the IMAPS session:

An Alternative Printing Solution to Sphere Placement for Second Level Interconnect Assembly
Rita Mohanty, Speedline

Novel Method of BGA Coplanarity Reduction at the Ball Attach Process
Rick Lathrop, Heraeus;

Lithography-Grade Controlled Expansion Substrates for Wafer Level Packaging
Greg Rudd, SpectraMat

IC packaging technologies - What's New?  What's Next?
Joe Fjelstad, Siliconpipe

Title -- TBD
Michael Todd, Henkel.

This session at Semicon West will reflect the quality of papers that will be presented at the 40th IMAPS International Symposium on Microelectronics in San Jose, from November 11th – 15th. 

Please show your support for this select group of speakers and IMAPS by attending this special session at Semicon West.

SEMICON West 2007
Moscone Center - San Francisco, CA
July 16-20, 2007
IMAPS Session - July 18, 2007, 3:00–5:30 pm