IMAPS to Present TechXPOT at SEMICON West 2011

The IMAPS TechXPOT will take place on Wednesday, July 13, 2011, at the TechXPOT South Stage from 2:00–4:30pm and will feature the cutting edge technology that IMAPS delivers worldwide.  The IMAPS Session will take place in the Mosconi Center.

Next Generation Materials and Processing for High Performance Packaging

1 - "Thick Film, Fodel/APECS & LTCC Substrates Meeting the Ever Increasing Performance Demands for Microelectronics Substrates"
Steve Annas, Business Development Manager
Anaren Ceramics, Inc.

2 – “Direct Print technologies for back-end packaging and multi-chip modules”
Joe Robinson, Executive VP, Sales and Service
nScrypt, Inc.

3 – "Manufacturing needs for High Performance Packaging"
Voya Markovich, Senior VP and Chief Technology Officer
Endicott Interconnect Technologies, Inc.

4 - Advances in Ceramic Packaging Materials
Susheel Dharia, New Product Development Manager
Kyocera America, Inc.

IMAPS is also organized co-sponsored workshop with SEMI during SEMICON West on:

Advanced Interconnect and Substrate Technologies
Wednesday, July 13, 2011
Moscone Center, San Francisco, CA

Wire Bonding
Thursday, July 14, 2011
Moscone Center, San Francisco, CA

Visit SEMICON West 2011 website for details on the full SEMI Conference