KESTER

Inaugural Conference and Exhibition on
SYSTEM IN PACKAGE (SiP) TECHNOLOGY
Program | Registration | Exhibition | Sponsorship

Doubletree Sonoma Wine Country
Sonoma, California - USA
June 27-29, 2017

wine


Registration Will Open Soon


General Chair:
Nozad Karim
VP, Amkor Technology

Technical Chair:
David Lu
Sr. Dir, Huawei Technology

SiP Executive Team:
Rozalia Beica
Dir, Dow Chemical

Jan Vardaman
CEO, TechSearch

Simon McElrey
CEO, Semblant

Urmi Ray
Principal Engineer, Qualcomm

Dr. Dongkai Shangguan
CMO, Stats ChipPac

SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology in the relaxing Sonoma wine country of California, away from big city distractions.

Featuring three full days of technical sessions, panel discussions, exhibitors and local activities, SiP 2017 will pro-vide dynamic learning and technology updates for SiP related trends and new engineering innovations from the industry’s world SiP leaders.

Speaking and presenting opportunities are by invitation from the technical committee.


SiP

Technical Program Preview:

June 27, 2017 June 28, 2017 June 29, 2017
SiP market overview, SiP in cellphone teardown of latest cellphones, SiP innovation challenges in mobile applications, active and passive components trends, MEMS & sensors technology trends, SiP package level conformal and compartmental shielding methods, human factor impacts on SiP, and SiP opportunity in China. RF frontend SiP, connectivity SiP (WiFi, BT, GPS, ..), medical & wearable SiP, power module, analog SiP, MEMS, sensors & automotive SiP, SiP miniaturization techniques. Embedded active and passives technology, Integrated Passive Devices (IPD), thin substrate technology, Fan-out solution OSAT and foundry perspectives, water proved Products/ NanoCoating technology, assembly process improvement EMS perspective, enhanced new materials for SiP design & EDA tools, EMI shielding equipment.



 

Sponsorship and Exhibition Opportunities: DETAILS SOON

Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at bschieman@imaps.org to secure your organization’s sponsorship for SiP 2017 before they are filled.

A tabletop exhibition will be held in conjunction with the technical program on June 27th and 28th.

 

 

REGISTER ONLINE - AVAILABLE SOON

 


Speaker Dates/Information:

  • Program Notification: December 2016
  • Early Registration Deadline: May 2017
  • Speaker 2-3 sentence biography due not later than: June 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: June 28, 2017
  • Powerpoint/Presentation file used during session:
    • Speaker's responsibility to bring to session on USB
    • Recommended to have back-up on personal laptop/usb/cloud or email to bschieman@imaps.org prior to event
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 


Registration Information: (Early Registration Deadline: May 2017) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 8/31/16
Advance/Onsite Fee
After 8/31/16
IMAPS Member
Soon
Soon
Non-Member
Soon
Soon
Speaker
Soon
Soon
Session Chair
Soon
Soon
Student
Soon
Soon
Chapter Officer
Soon
Soon
Tabletop Exhibit
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
Soon
Soon
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)
Soon
Soon



Hotel Information: (Hotel Deadline: May 2017) - REGISTER ONLINE

Details Soon

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems