KESTER

Inaugural Conference and Exhibition on
SYSTEM IN PACKAGE (SiP) TECHNOLOGY
Program | Registration | Exhibition | Sponsorship
| "Sip at SiP" (Private Wine Tour/Tasting)

Doubletree Sonoma Wine Country
Sonoma, California - USA
June 27-29, 2017

wine

Early Registration Deadline: May 31, 2017


Thank you to our Premier Sponsors:
Premier Sponsor - Amkor Technology

Premier Sponsor - Samtec

Premier Tech Sponsor - NGK NTK

 

General Chair:
Nozad Karim
VP, Amkor Technology

Technical Chair:
David Lu
Sr. Dir, Huawei Technology

SiP Executive Team:
Rozalia Beica
Dir, Dow Chemical

Jan Vardaman
CEO, TechSearch

Simon McElrey
CEO, Semblant

Urmi Ray
Senior Director, STATS ChipPAC

Dr. Dongkai Shangguan
VP, Flextronics

Farhang Yazdani
President & CEO, BroadPak Corporation

SiP 2017

REGISTER | TECHNICAL PROGRAM

SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology in the relaxing Sonoma wine country of California, away from big city distractions.

Featuring three days of technical sessions, panel discussions, exhibitors and local activities, SiP 2017 will provide dynamic learning and technology updates for SiP related trends and new engineering innovations from the industry’s world SiP leaders.

 


Thank you to our Corporate Sponsors:
Corporate Sponsor - DOW
Corporate Sponsor - PacTech
Corporate Sponsor - NAMICS
Corporate Sponsor - AFT

EMD Performance Materials

1 sponsorshop still available
Thank you to the Official Media Sponsor:
Media Sponsor: Chip Scale Review
Additional Media Sponsor:
3D Incites - Media Sponsor


SiP

TECHNICAL PROGRAM:



 

TUESDAY, JUNE 27


7:00am - 5:00pm

Registration Open

9:00am - 6:00pm

EXHIBITS OPEN (when not in session)

A tabletop exhibition will be held in conjunction with the technical program on June 27th and 28th. Space is limited to 20 TABLETOPS, so reserve your tabletop soon!

The following companies are already signed up to exhibit:

5N Plus Inc.
Ajinomoto Fine-Techno Co., Inc.
AkroMetrix, LLC
Amkor Technology
AT&S Americas, LLC
Cadence Design Systems, Inc.
DOW Electronic Materials
Dynatex International
EMD Performance Materials
Heraeus Precious Metals NAC
Indium Corporation
Kyocera International, Inc.
NAMICS Corporation
NGK / NTK
PacTech
Samtec, Inc.
Shenmao America, Inc.
YXLON Feinfocus




7:00am - 8:00am

Breakfast


8:00am - 8:45am

OPENING KEYNOTE PRESENTATION:
PAST, PRESENT AND FUTURE OF SiP

General Chair: Nozad Karim, Amkor Technology

Abstract & BIO Soon


SESSION 1

MARKET & TECHNOLOGY TRENDS
Session Chairs: Rozalia Beica, Dow; Farhang Yazdani, BroadPak Corporation

8:45am - 9:15am

SiP Drivers and Market Trends
Jan Vardaman, TechSearch International

9:15am - 9:45am

SiP Innovation Challenge in Mobile
David Lu, Huawei


9:45am - 10:30am

Coffee Break in the Exhibits


10:30am - 11:00am

Active & Passive Components Integration Trends
Jean-Christophe Eloy, System Plus Consulting/Yole

11:00am - 11:30am

Advanced SiP Technology
Yang Zhang, Qualcomm

11:30am – 12:00pm

Management of Vertically Integrated Multi-Die, Multi-Substrate Heterogeneous Packages
Kevin Rinebold, Mentor Graphics Corporation


12:00pm-2:00pm

Lunch Break & Exhibits


2:00pm - 2:45pm

KEYNOTE PRESENTATION:
THE EVOLUTION OF ELECTRONIC MATERIALS AND THE INFORMATION AGE


Abstract: Computing has significantly evolved over the years; it has driven the semiconductor industry to develop advanced technologies that can address the increasing needs and complexities across generations of electronics, leading to today’s information age products. The introduction of smartphone, mobility and connectivity have extended the application space and has raised the importance of innovation across the supply chain, from design to manufacturing across front and back end processes. While advancing the technology node continues, increasing demands for more functionalities, while continuing to reduce cost and form factor, will require further innovation in materials, processes and integration technologies.

James T. Fahey, Ph.D., Business President, Electronic Materials, The Dow Chemical Company
Jim Fahey was named Business President for Dow Electronic Materials in February, 2015.  In his previous role he was Global Business Director for Semiconductor Technologies, a division of Dow Electronic Materials and Global General Manager for Growth Technologies.  Prior to this, Fahey was the Business Unit Director of Microelectronic Technologies, and a vice president of Rohm and Haas Company.Dr. Fahey began his professional career in 1991 in the semiconductor industry as an Engineer at IBM Corporation, where he developed lithographic materials in the organization's Microelectronics Division in Fishkill, NY. Dr. Fahey received a B.S. in Organic Chemistry in 1986 from St. Francis Xavier University in Antigonish, Nova Scotia, Canada. He earned a M.S. in Polymer Chemistry from Cornell University in 1989 and a Ph.D. in Chemistry from Cornell University in 1991.




2:45pm - 3:15pm

EMS SiP Packaging Technology and Service
Dongkai Shangguan, Flextronics USA

3:15pm - 3:45pm

Google SiP Applications in Wearable Electronics
TBD, Google


3:45pm-4:30pm

Coffee Break in the Exhibits


4:30pm - 6:00pm

 

STARTUP COMPANIES' COMPETITION
Session Chairs: Rozalia Beica, Dow; Farhang Yazdani, BroadPak Corporation

An entrepreneurship competition focused on IoT, mobile applications and System-in-Package will be included on June 27th. Several innovators and start-up companies will have the opportunity to present and compete in front of a jury comprised of venture capitalists, angel investors and industry leaders. The start-up competition will provide a great opportunity to learn about industry challenges and new emerging technologies and business ideas to address them. The teams competing will be provided access to an international network of investors and industry leaders.

Start-ups:

Start-up Name

Topic Title

Speaker Name

Speaker Title

Location

REX Computing

The REX Computing Neo Processor

Thomas Sohmers

CEO

Saratoga, CA

MEMSWork

High Dynamic Range, Low Noise MEMS Microphone

Kris Vossough

CTO

Palo Alto, CA

3diS

Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects”

Ayad Ghannam

Founder, CEO

France

Atlazo

Karim Arabi

CEO

San Diego, CA

TransSiP

3D SiP Implementation of a Novel Low-Power DC-DC Converter

Desmond Wong

Co-founder, CEO

Irvine, CA

Insight SiP

Michel Beghin

CEO

France

Jury Panel:

Organization Name

Participant Name

Title

Location

Amkor

Nozad Karim

VP

US, AZ

Yole Developpement

Jean-Christophe Eloy

CEO

France

Dow Electronic Materials

Richard Hemond

CMO

US, MA

Intel Capital, Google advisor

Sanjit Singh Dang

US, CA

Lux Capital

Shahin Farshchi

Partner

US, CA

Silicon Catalyst

Rich Goldman

Partner

US, CA

Fulton Capital Advisors

Richard Wollack

Principal

US, CA

 

Additional Details Soon | Event sponsorship opportunities are available.


 



 

WEDNESDAY, JUNE 28


7:00am - 3:30pm

Registration Open

10:00am - 3:00pm

EXHIBITS OPEN (when not in session)

A tabletop exhibition will be held in conjunction with the technical program on June 27th and 28th. Space is limited to 20 TABLETOPS, so reserve your tabletop soon!

The following companies are already signed up to exhibit:

5N Plus Inc.
Ajinomoto Fine-Techno Co., Inc.
AkroMetrix, LLC
Amkor Technology
AT&S Americas, LLC
Cadence Design Systems, Inc.
DOW Electronic Materials
Dynatex International
EMD Performance Materials
Heraeus Precious Metals NAC
Indium Corporation
Kyocera International, Inc.
NAMICS Corporation
NGK / NTK
PacTech
Samtec, Inc.
Shenmao America, Inc.
YXLON Feinfocus



7:00am - 8:00am

Breakfast


8:00am - 8:45am

KEYNOTE PRESENTATION:
"ALL IN ONE PACKAGE” - THE PACKAGING SOLUTION OF THE FUTURE?


Abstract: What are the needs for packages in the future? How do they develop further? What is the ideal electronic package for the applications of the future? In order give an answer to these questions, we will have to start with basic considerations and establishing a holistic view. We have to focus on the functions and start to reassemble them in a new way in order to generate electronic modules and systems with at a minimum consumption of space and energy that are working at high speed. Components, substrates, PCBs and packaging technologies are able to contribute and improve the overall performance. When we are able to combine them so that they are able to work together in an ideal way we will be able to achieve the most effective and efficient electronic package – the “All in one Package”. Therefore, however, we have to dissolve existing borders of the electronic value chain and reassemble them in a new way. This keynote will give an overview on solutions that are available today and it will give an outlook on what we can expect in the up-coming years.

Dr. Hannes Voraberger, Director R&D, AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Dr. Voraberger
assumed his current position in 2010, as head of AT&S corporate research and development department. Previously Dr. Voraberger was responsible for AT&S corporate intellectual property and research and development funding. He also established the R&D center in AT&S Shanghai (China) and was project leader for AT&S research and development in AT&S Leoben (Austria). He began his professional career in 1999 at JOANNEUM RESEARCH in Graz (Austria) focusing on the development of chemical sensors. Dr. Voraberger studied industrial chemistry at Graz University of Technology, awarded multiple patents and has published several papers.


SESSION 2

SiP & SYSTEM INTEGRATION
Session Chairs: David Lu, Huawei; Dongkai Shangguan, Flextronics

8:45am -
9:15am

RF-SiP Front End SiP
Jack Ajoian, Broadcomm


9:15am -
9:45am

Ultra Low Power SoC for IoT Applications
Karim Arabi, Atlazo, Inc.

9:45am - 10:15am

mmWave 5G SiP
Javi DeLaCruz, Invensas Corporation


10:15am - 10:45am

Coffee Break in the Exhibits


10:45am - 11:15am

Testing Solutions of  SiP Packaging
John Bongaarts, National Instruments

11:15am - 11:45am

Display & Display Driver SiP
Stefan Peana, Dell

11:45am – 12:15pm

TBD


12:15pm-2:00pm

Lunch Break & Exhibits


2:00pm - 2:30pm

Fan-out SiP Solution
Steffen Kroehnert, Nanium S.A.

2:30pm - 3:00pm

Interconnect Scheme for SiP Devices using Micro-Coaxial Cables
Caprice Gray, C. S. Draper Laboratory

3:00pm - 3:30pm

Power Module Packaging Technology – Trends, Technology, and Industry Landscape
Steven Kummerl, Texas Instruments


Sip at SiP

Sip at SiP
Private IMAPS Experience at the Benziger Family Winery

Wednesday, June 28th
4:15pm-10:00pm

Join conference colleagues for a special evening experience at the Benziger Family Winery in Sonoma. 
Guests will enjoy a private tour, wine tasting, and dinner at one of the most popular wine estates in California’s famous wine region. 

The Experience
Upon arrival in provided transportation from the conference hotel, Sip at SiP guests will transfer to a Benziger tram for a special behind-the-scenes look of the 80 acre biodynamic estate.  Get an up-close view of the fermentation facility, crush pad, and explore the barrel caves while learning about Benziger’s unique farming practices and winemaking history.  The tram tour will conclude at the tasting room for a sampling of their unique portfolio of wines, followed by an intimate three-course family-style dinner in the estate’s Wine Cave.  Transportation will be provided back to the hotel upon the conclusion of dinner.    

Logistics

Date:    Wednesday, June 28th
Approximate departure time: 4:15pm, following the end Wednesday’s technical program
Tram Tour:  5:00pm-6:00pm
Wine Tasting:  6:00pm-7:00pm
Dinner in the Wine Cave: 7:00pm-9:00pm
Approximate return time: 10:00pm 


Tickets
$95 per person
Each ticket reserves transportation, an hour-long tram tour, a wine tasting with hors d’oeuvres, and a seated family-style dinner for one person.  Tickets are limited and must be purchased separately from the conference registration fee.  To register, first select your conference registration type, then select the Sip at SiP ticket on the Sessions page before checking out online.  If you wish to add a ticket after you have registered for the conference, please contact IMAPS HQ at 919-293-5000. 

 

 

 


 

THURSDAY, JUNE 29


7:00am - 2:00pm

Registration Open


7:00am - 8:00am

Breakfast


SESSION 3

SiP TECHNOLOGY
Session Chairs: Jan Vardaman, TechSearch International; Urmi Ray, STATS ChipPAC

8:00am – 8:30am

Integrated Passive Devices (IPD)
Vinayak Pandey, STATSChipPAC

8:30am - 9:00am

Enabling Faster Design and Performance Decisions for Advanced Package Architectures in SIP
Narayanan TV, Zuken

9:00am - 9:30am

SiP Metrology: What's Special?
Patrick Desjardins, KLA-Tencor Taiwan

9:30am – 10:00am

Interconnect Material in SiP Packaging
Ning-Cheng Lee, Indium USA


10:00am - 10:30am

Coffee Break


10:30am - 11:00am

Waterproof Products/ NanoCoating Technology
Simon McElrea, Semblant

11:00am - 11:30am

EMI Shielding
Jason Cheung, Henkel USA

11:30am – 12:00pm

Advanced Packaging Materials for SiP
Brian Schmaltz, NAMICS


12:00pm-1:00pm

Lunch Break



PANEL SESSION:
FUTURE SIP PLATFORMS: CHALLENGES AND SOLUTIONS

1:00pm-2:30pm

This panel discussion focuses on the challenges in the future SiP platforms with discussions about the requirements for design, inspection, test, and assembly.  Experienced participants from the infrastructure required to provide the next generation SiP will join the lively discussion organized by Moderators Jan Vardaman and Urmi Ray. 

PANELISTS:

Patrick Desjardins, KLA-Tencor/ICOS
Technical Director

Derek Floyd, Advantest America, Inc.
Director Business Development

David A. Jandzinski, QORVO
Mgr Advanced Packaging

Gerard John, Amkor Technology

John Park, Cadence
Product Management Director IC Packaging & Cross-Platform Solutions



2:30pm

Closing Remarks


 



 

Sponsorship and Exhibition Opportunities: DETAILS Below - Limited Availability

Corporate Event Sponsorship
(includes: 1 tabletop exhibit, 1 conference registration, 1 exhibit pass (w/ lunches), quarter-page print advertisement in final program, logo on event webpages, emails & in print program)
$2000
$2000
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 2 attendee registration, 2 exhibit passes (w/ lunches), full-page print advertisement in advance & final programs, flyer/giveaway distributed to all attendees, logo on event webpages, emails, on print program covers, and in printed programs)
$3500
$3500

Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at bschieman@imaps.org to secure your organization’s sponsorship for SiP 2017 before they are filled.

 

 

 

 

 

 


 

 

REGISTER ONLINE

 


Speaker Dates/Information:

  • Program Notification: February 2017
  • Early Registration & Hotel Deadlines: May 31, 2017
  • Speaker 2-3 sentence biography due not later than: June 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: June 28, 2017
  • Powerpoint/Presentation file used during session:
    • Speaker's responsibility to bring to session on USB
    • Recommended to have back-up on personal laptop/usb/cloud or email to bschieman@imaps.org prior to event
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 


Registration Information: (Early Registration Deadline: May 31, 2017) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 5/31/17
Advance/Onsite Fee
Through 5/31/17
IMAPS Member
$850
$950
Non-Member
$950
$1050
Speaker
$550
$650
Session Chair
$550
$650
Student
$300
$400
Tabletop Exhibit - IMAPS Member
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
$850
$950
Tabletop Exhibit - NonMember
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
$950
$1050
Corporate Event Sponsorship
(includes: 1 tabletop exhibit, 1 conference registration, 1 exhibit pass (w/ lunches), quarter-page print advertisement in final program, logo on event webpages, emails & in print program)
$2000
$2000
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 2 attendee registration, 2 exhibit passes (w/ lunches), full-page print advertisement in advance & final programs, flyer/giveaway distributed to all attendees, logo on event webpages, emails, on print program covers, and in printed programs)
$3500
$3500



Hotel Information: (Hotel Deadline: May 31, 2017)

Housing accommodations must be made directly to:

DoubleTree by Hilton Sonoma Wine Country
1 DoubleTree Drive
Rohnert Park, CA 94928

IMAPS Discounted Single/Double Room Rate: $170/night + taxes/fees

ONLINE RESERVATIONS: http://group.doubletree.com/imapsadvancedtechnology

Phone Reservations: +1-707-584-5466
Mention IMAPS or IMAPS System in Package when booking by phone

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert! All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS. The only way to book a room in the official IMAPS Housing Block using the reservations information above.

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems