The Southern California Chapters of IMAPS (Angel, Orange & San Diego)
invite you to attend the SoCal’15 Technical Symposium & Tabletop Exhibition
SoCal’15 is: ADVANCED PACKAGING
May 12, 2015 | 8:00am-5:30pm
Kulicke & Soffa Industries, Inc.
1821 E. Dyer Road #200 Santa Ana CA 92705
General
Chair: Phil Zulueta Consultant & Chairman Emeritus, SAE G-19 Committee |
Maurice Lowery Northrop Grumman |
Committee: Exhibitor Chairs: David Virissimo, Ametek & /Bill Ishii, Torrey Hills Tech. Exhibitor Co-Chairs: Sharon Fletcher, Teledyne Micro. & /Vincent Malave Technical Chairs: Bill Gaines, Northrop Grumman & Ken Rotunno, Northrop Grumman Facilities/Arrangements Chairs: Salim Akbany, Northrop Grumman & Sheila Frese, Kulicke & Soffa |
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Thank you to our Premier Sponsor:
and Thank you to our 2015 Conference HOST:
- 18 Technical Presentations from invited speakers!
- SOLD OUT Tabletop Exhibits w/ 18 Key Companies!
- Networking, Meals, Raffles and more in the Exhibit Area!
- Attendance is FREE
- Lunch included!
TECHNICAL PROGRAM:
This year’s program features 18 speakers addressing the latest in ADVANCED PACKAGING:
| Tuesday, May 12 - Morning Sessions | |||
Start Time |
Session 1: Increasing Process Capability, Reliability, and Performance I |
Session 2: Progress in Packaging |
Session 3: Thermal Materials & Design |
| 9:00am | Cooling Performance of Bio-Mimic Perspiration by Hydrogel Shuang Cui, UC San Diego |
Advances in Optical Metrology for Fan-Out Wafer-Level Packaging Jeff Donnelly, Zeta Instruments |
CCGA Solder Column - Reliable Solution for Absorbing Large CTE Mismatch Martin Hart, Topline |
| 9:30am | Universal Solders for Direct Bonding and Packaging of Opto-Electronic Devices Chin-Hung Liu, UC San Diego |
NiPdAu Plating Qualification of QFN RF-IC Packages Mumtaz Bora, Peregrine Semiconductor |
Selecting the Ideal Thermal Material for Your Application Jim Barrett, Ion Beam Milling, Inc. |
Morning Break – Coffee in the exhibit area |
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| 10:30am | Low Temperature Sintering of Nano Solder for High Temperature Packaging Applications Ying Zhong, UC San Diego |
Some Progress in Power Electronic Packaging for EV/HEV Applications Yunqi Zheng, Consultant |
Innovative Silicone Film Adhesives Michelle Velderrain, NuSil Technology |
| 11:00am | Glass Enabled Systems Integration Jeb Flemming, 3D Glass Solutions |
Microelectronics and Packaging for UAV Payloads Iris Labadie, Kyocera America, Inc |
Open time to attend 1st talk, or visit exhibitors! |
Lunch Break & Networking |
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Tuesday, May 12 Afternoon Sessions
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Start Time |
Session 1: Increasing Process Capability, Reliability, and Performance II |
Session 2: New Process Insights |
Session 3: Counterfit Preclusion |
| 1:30pm | High Reliability Die Attach Solutions for Automotive Applications Andrew Laib, Mina Chow-Taing, Henkel Electronic Materials, LLC |
Critical Barriers Associated with Copper Wire Bud Crockett, Tanaka |
Proven Steps for Buyers to Mitigate the Risk of Counterfeit Electronic Parts Phillip Zulueta, SAE International |
| 2:00pm | Thick Film Systems for Challenging Applications Michail Moroz, TT Electronics |
Diffusion Controlled Intermetalic Growth in Cu-Al Wire Bonds Panthea Sepehrband, anta Clara University |
AS6081 Distributor Perspective; How it is Utilized to Protect Against Counterfeits Robb Hammond, AERI |
Afternoon Break – Coffee in the exhibit area |
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| 3:00pm | The Emergence of Local Reflow into High Volume Manufacturing Thomas Strothmann, Kulicke & Soffa Industries, Inc. |
Equipment, Consumable, and Process Development for Advanced Interconnect Tao Xu, Kulicke & Soffa Industries, Inc. |
Open time to attend other talks, or visit exhibitors! |
EXHIBITORS & SPONSORS:
Tabletop exhibition featuring key advanced packaging vendors supporting Military, Space, Aero, Mobile, Medical, and other industries. There will be a maximum of 18 tabletops at this conference as we are now SOLD OUT.
Tuesday, May 12, 2015 - 9:00 AM - 5:30 PM (Subject to Change)
Lunch, Breaks and networking will be held in the Exhibit HallExhibiting Companies & Exhibit Floorplan:
Registrant Organization Name Booth Teledyne Microelectronic Technologies, Inc. Indium Corporation Advanced Packaging Associates, Inc. Geib Refining Corporation Interconnect Systems Inc. (ISI) SST International Micro Printing Systems Kyocera America, Inc. SANTIER Thermal Management Solutions Tanaka Kikinzoku International Ormet Circuits, Inc. NuSil Technology, Inc. NTK Technical Ceramics Thermacore, Inc. Top Line (PREMIER SPONSOR) ADJ Technology Corporation Coining, Inc., an Ametek Company Sales & Service, Inc. Promex/Quik-Pak Kulicke & Soffa Industries, Inc.
(CONFERENCE HOST)
On/Before 4/15/15 |
After 4/15/15 |
|
| Tabletop Exhibit (without electric) (includes: 1 six-foot table and chairs, NO ELECTRIC) |
$300 - SOLD OUT |
$350 - SOLD OUT |
| Tabletop Exhibit (WITH ELECTRIC) (includes: 1 six-foot table and chairs, ELECTRIC outlet access) |
$350 - SOLD OUT |
$400 - SOLD OUT |
Each Exhibiting Company will receive with their booth rental:
- one (1) six-foot table, 2 chairs
- exhibitors can register Full Conference registrations at no cost
- recommended: two (2) Booth Personnel
- one (1) List of Attendees (sent following the conference)
- ADDITIONAL FEES: Electricity, additional furniture needs, etc are all separate and need to be discussed directly with our activities or exhibits chairs
Sponsors will receive a tabletop exhibit (includes: 1 six-foot table and chairs, ELECTRIC outlet access) and additional sponsor benefits include: web/email advertisement, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages.
Questions? Contact David Virissimo at david.virissimo@ametek.com
- Abstract Deadline Extended to: March 27, 2015
- Speaker Email Notification: April 1, 2015
- Early Registration Deadline: April 15, 2015
- Speaker 2-3 sentence biography due not later than: May 1, 2015
- Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or via cloud access. If possible, email to bschieman@imaps.org prior to event.
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
Registration Information: (Early Registration Deadline: April 15, 2015)
Type |
Early Fee Through 4/15/15 |
Advance/Onsite Fee After 4/15/15 |
| Attendees (Speakers, Members, NonMembers, Students) | Complimentary |
|
| Tabletop Exhibit (without electric) (includes: 1 six-foot table and chairs, NO ELECTRIC) |
$300 |
$350 |
| Tabletop Exhibit (WITH ELECTRIC) (includes: 1 six-foot table and chairs, ELECTRIC outlet access) |
$350 |
$400 |
| Premier Event Sponsorship (includes: 1 six-foot table and chairs, ELECTRIC outlet access, Web/email advertisement, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages) |
$750 |
$750 |
| Lunch Sponsorship (Sponsorship of the afternoon lunch for all attendees. Does NOT include tabletop space) |
$500 |
$500 |
