Session 1: Packaging Reliability
Chair: Donny Chen, nScrypt, Inc.
1:00 pm - 2:40 pm

Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds
Richard Share, Share Consulting LLC

How Clean is That Surface? How Do You Know?
Robert K. Lowry, Electronic Materials Characterization

Session 2: Thermal Management Solutions
Chair: Jeff Jennings, Harris Corporation
1:00 pm - 2:40 pm

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, Paul W. Barnes, SST International

Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Brian A. English, EngeniusMicro LLC

Reliability Investigation of Various Au-In TLP Bonds
Brian Grummel, University of Central Florida
* Student Paper

Session 3: High Density (3D) Packaging
Chair: Donny Chen, nScrypt, Inc.
3:00 pm - 4:40 pm

Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders 
Terence Collier, Bal Benavidez, Indira Gubeljic, CV Inc.

Advanced Wedge Bonding Capabilities Enable New Package Developments in RF, Microwave, Optoelectronic and Military Devices
Lee Levine, Joseph S. Bubel, Hesse & Knipps, Inc.

Fine Pitch Die-Level Testing Can Accelerate Development of Multi-Die Packaging Technologies Using Die Bonding Equipment 
David Herndon, Suzanne Dunphy, Harris Corporation

Session 4: Advanced Materials & Packaging
Chair: Jeff Jennings, Harris Corporation
3:00 pm - 4:40 pm

NAMICS Materials for Thin & Advanced Packaging Technology 
Ken Araujo, Brian Schmaltz, Abe Yukinari, NAMICS Technologies, Inc.

Monolithic 3D Printed Electronics - The Next Generation Packaging Technology
C. Mike Newton, Dr. Kenneth Church, 3D Monolithix Corp.

Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications
Ali Karbasi, W. Kinzy Jones, Florida International University
* Student Paper

Dinner Buffet Open (hot hors d'oeuvres): 5:00 pm - 8:30pm

Keynote Presentation: 5:30 pm - 5:55 pm

Industry and Market Trends in the Electronic Interconnect Supply Chain: Findings from IPC Market Research This presentation looks at sales, market, production and business trends in the industries that make up the electronic interconnect supply chain - from electronic-grade solder, chemicals and laminate to printed circuit boards (PCBs), electronics manufacturing services (EMS), PCB assembly equipment and electronics OEMs. Analysis is based on original current market research conducted by IPC, the global trade association for these industries, combined with analysis of economic trends and forecasts. Both global and regional trends are covered, with an emphasis on North America. Speaker: Sharon Starr, Director of Market Research - IPC, Association Connecting Electronics Industries Sharon Starr is Director of Market Research at IPC, where she directs all IPC market research studies and statistical programs. She is responsible for expanding and globalizing many of these programs since she joined IPC in 2003. She also spearheaded the cooperative data sharing initiatives of the World Electronic Circuits Council (WECC) organizations and chairs the WECC Statistics and Market Committee. She develops IPC's Executive Market & Technology Conferences and facilitates IPC's long-range planning process. Sharon is a regular featured speaker at industry events, including IPC's annual Executive Summit and other IPC conferences. Previously, she worked at Underwriters Laboratories (UL) for 15 years in various management positions in marketing, strategic planning and business development. While at UL, she was a recipient of a General Manager's award for new product development and won several national communication awards for UL's annual report. Sharon earned her MBA from Northwestern University's Kellogg Graduate School of Management in 2000 with concentrations in economics, marketing and strategy. Her B.A. is from the University of Wisconsin, Madison.

IMAPS Florida Chapter President's Closing Remarks: 5:55 pm - 6:00 pm