KemLab

International Conference and Exhibition on
Thermal & Power Solutions
Submit Abstracts | Register Online | Exhibits | Exhibiting Companies

April 28-30, 2020
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE, Albuquerque, NM 87109 USA

General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)

 

NEW THIS YEAR - A TECHNOLOGY CROSS-OVER EXTRAVAGANZA!
CICMT, High Temperature, Thermal & Power Packaging come together for a great opportunity for you...
One location | One registration | Three times the conte
nt, networking, and learning!


ABSTRACTS BEING ACCEPTED UNTIL: DECEMBER 6, 2019

Notice of Acceptance: January 6, 2020

SUBMIT ABSTRACTS



NEW THIS YEAR - A TECHNOLOGY CROSS-OVER EXTRAVAGANZA! CICMT, High Temperature, and Thermal & Power Packaging come together for a great opportunity for you...One location | One registration | Three times the content, networking, and learning! The Thermal event has also been upgraded from a Workshop to a full Conference to alow for more attendees, exhibitors, speakers and networking!

Previously, this event has been organized annually by IMAPS (since 1992 in Workshop format) to specifically address current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The Workshop emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers: Understanding thermal challenges and business / economic drivers that influence change in electronic systems design and manufacturing – and how these impact thermal design requirements. Developing market trends, market segmentation, cost drivers and reliability factors are examples of topics that set the framework for where and what types of new technical solutions are viable.
  • Multi-Die Packaging: Advanced packaging technologies, such as System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die, etc. provide significant opportunities for miniaturization and performance enhancements. These technologies also can introduce significant thermal and interconnect challenges that must be balanced against those benefits.
  • Mobile and Handheld Devices and the Internet-of-Things (IoT): Wearables, mobile and medical devices, small displays, tablets and notebooks are increasingly critical for our interconnected world. These devices often introduce unique component- and system-level thermal management challenges that require novel design approaches and materials.
  • Wireless and Telecom Infrastructure: High performance telecom hardware have challenging component and system level requirements that require technical advances to meet the evolving needs for routers, networked systems, base stations, etc.
  • Power Semiconductor Thermal Components, Systems, and Solutions: Developments in IGBT thermal management and packaging strongly influence advances in electronic and electrical drive systems. These advances are increasingly important in the Electric Vehicle/Hybrid Electric Vehicle and renewable energy markets.
  • Mil/Aerospace: Emerging military and aerospace systems, including avionics, RF, and microwave components and modules for phased array radar, countermeasures, and other systems, require advanced thermal management as well as high-temperature materials and packaging.
  • System-Level Cooling: The thermal design of complex systems, such as high-performance computing systems, relies on extensive component- and system-level thermal management analysis to address the broad spectrum of issues that entail a comprehensive system design.
  • Data Center Cooling: Data center cooling includes a variety of design optimization activities including cooling provisioning, airflow control, temperature distribution and migration paths that range from forced air convection to system liquid cooling.
  • Liquid cooling, Phase-change, and Refrigeration: Advanced cooling methods that use liquid, latent heat and/or active cooling provide opportunities for enhanced performance and design flexibility. Effective designs must balance these advantages against factors including life-cycle cost, reliability and serviceability impact.
  • Thermal Interface Materials (TIMs) and Testing: Advanced thermal interface materials that may include organic, metallic, graphitic materials in bulk form as well as nanoscale are enabling significant advances in the thermal management of high-performance processors, memory, telecom, IGBT, RF, and microwave components and systems. Effective testing and reliability methods and standards are critical in determining the suitability of a TIM for a given application.
  • CTE-Matching and High Thermal Conductivity Materials: Metallic, ceramic and composite materials have been engineered to exhibit excellent thermal conductivity with controlled coefficient of thermal expansion (CTE) properties to allow for better matching with GaN, SiC, silicon or ceramic materials to reduce thermal stresses in component packaging.

PREPARATION OF ABSTRACT:
Please send your 500+ word abstract electronically ON/BEFORE DECEMBER 6, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written manuscripts are NOT REQUIRED; however, authors can submit papers that can be considered and peer reviewed by the IMAPS and/or ACerS Journals. All work will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org.

 

Submit Abstract


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation



Registration Information: (Early Registration Deadline: April 2020) | REGISTER ONLINE SOON

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an one (1) DOWNLOAD of the proceedings papers. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/2020
Advance/Onsite Fee
After 4/2020
IMAPS Member
$700
$800
Non-Member
$800
$900
Speaker
$500
$600
Chair
$500
$600
Student
$150
$200
Chapter Officer
$500
$600
Tabletop Exhibit (Member) - includes 2 exhibit personnel badges with meals
$750
$850
Tabletop Exhibit (Non-Member) - includes 2 exhibit personnel badges with meals
$850
$950
Premier Sponsorship (Includes Tabletop) - includes 1 tabletop, 2 session badges, 4 exhibit personnel badges with meals, and advertisements
$3500
$3500
Corporate Sponsorship (Includes Tabletop) - includes 1 tabletop, 1 session badge, and 2 exhibit personnel badges with meals
$2000
$2000

REGISTER ONLINE


Speaker Dates/Information:

  • Abstract Deadline: DECEMBER 6, 2019
  • Speaker notification now: JANUARY 6, 2020
  • Early Registration/Hotel reservation cut-off: April 8, 2020
  • Speaker BIO Due: April 20, 2020
  • Presentation Slides Must Be Ready BEFORE: April 28, 2020
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event). The slide presentations that are used on the session laptops will be converted to secure PDFs and made available to conference paid attendees via download. Speakers needing to remove slides or update slides should do so before April 30 and email bschieman@imaps.org the new file)

 


Hotel Information -- Hotel Deadline: April 8, 2020
You must book your hotel directly with the host hotel:

Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE, Albuquerque, NM 87109 USA

Single/Double room: $129/night + taxes/fees

Click here to book online!

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

 

 

 

 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic