Advanced Technology Workshop and Tabletop Exhibition on
Thermal Management

The Cabaña Hotel & Resort (A Crowne Plaza Resort)
Palo Alto, California - USA
October 13 - 16, 2008

Advance Program

Early Registration Deadline: October 3, 2008
Hotel Deadline: September 15, 2008

General Chair Dave Saums DS&A LLC dsaums@dsa-thermal.com Tel: 978-499-4990

Program Chair Vadim Gektin Sun Microsystems, Inc. vadim.gektin@sun.com Tel: 408-276-6580

Program Committee:
David Copeland, Sun Microsystems Inc.
Vadim Gektin, Sun Microsystems, Inc.
William Maltz, Electronic Cooling Solutions
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Jun Shen, Redback Networks, Inc. (An Ericsson Company)
Guy R. Wagner, Storage Genetics, Inc.

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Registration Information | Register On-Line
Download Program PDF | Speaker Information | Hotel Reservations

Tabletop Exhibition Information | Exhibiting Companies
Reserve Tabletop(s) (Sold Out)

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Monday, October 13

Registration: 5:00 pm - 6:30 pm

Opening Reception: 5:30 pm - 6:30 pm

Tuesday, October 14

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: Noon – 5:00 pm

Opening Remarks: 8:30 am – 8:40 am

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:40 am – 12:00 pm

Mobile PCI Express Graphics Module (MXM) 3.0 specification:  Thermo-Mechanical Interchangeability
Joe Walters, Mohammed Tantoush, nVidia

Data Center Cooling: Comparison of Thermal Resistance and Pump Power for Circulating Air, Water, and Freon (Phase Change) Coolants
Ronald C. Crane, Clustered Systems Co.

Thermal Management in the Renewable Energy Market
Kevin Closson, Nerac

Break: 10:10 am – 10:30 am

An Overview of the Water Cooling System for the IBM Power 575 Supercomputer
Michael J. Ellsworth, Jr., International Business Machines Corporation

Preliminary Specification for a Closed Loop Liquid Cooling System Product Reliability Test Plan
Margaret B. Stern, David Copeland, Marlin Vogel, John Dunn, Don Kearns, Steve Lindquist, Sun Microsystems

Thermoelectric Power Harvesting from Small Engines
John Langley, Bor Yann Liaw, Ambient Micro; William Maltz, Electronic Cooling Solutions, Inc.; Guy Wagner, Storage Genetics, Inc.

Lunch: 12:00 pm – 1:30 pm

Session 2:  Thermal Interface Materials
Chair: Guy Wagner, Storage Genetics, Inc.
1:30 pm – 5:00 pm

Thermal Interface Material Market Outlook
Melanie Wuthenow, Prismark

Thermally Conductive Adhesives for Electronics Applications
John Timmerman, The Bergquist Company

Application and Performance Characteristics of Soft Metal Thermal Interface Materials for IGBT Applications
Dave Saums, DS&A LLC; Bob Jarrett, Jordan Ross, Indium Corporation; Alan Fairbairn, Indium Corporation UK; Wolfgang Bloching, GPS Technologies GmbH

Break: 3:00 pm – 3:30 pm

Equipment and Methodology for Consistent High Quality Stencil Printing of Phase Change Thermal Interface Material
Andrew D. Delano, Richard Xu, Honeywell

Stress Minimization during Deflection of Thermally Conductive Gap Pads
Karen Bruzda, Laird Technologies

Materials and Substrates for LED Thermal Management
Justin Kolbe, Sanjay Misra, The Bergquist Company

Dinner: 5:00 pm – 6:30 pm

Session 3: Equipment and Test
Chair: Jun Shen, Redback Networks, Inc. (An Ericsson Company)
6:30 pm – 8:00 pm

Thermal Test Chip - Definition, Design and Applications
Bernie Siegal, Thermal Engineering Associates, Inc.

Thermo-Mechanical Design Challenges in Validation Platforms
Rahima K. Mohammed, Ashok Kabadi, Intel Corporation

Thermal Management System with Passive Cooling Modules
Michael Spokoiny, Vladimir Zrodnikov, Xinliang Qiu, James M. Kerner, United States Technology Consortium

Wednesday, October 15

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: 10:00 am – 3:00 pm

Session 4: Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
8:30 am – 12:00 pm

Thermal Interface Materials Characterization and Development by Computer Modeling and in Package Testing
David A. Zoba, LORD Corporation

Thermal Characterization of a Half mPCI Express Card and Associated Devices
Raj Bahadur, Carlton Hanna, Upendra Sheth, Intel Corporation

Why Mathematical Modeling is a Necessity to Manage the Cooling/Energy Efficiency in Today’s Mission Critical Facilities
Sherman Ikemoto, Akhil Docca, Future Facilities Inc.

Break: 10:00 am – 10:30 am

Student Competition Winner

Transient Multiscale Thermal Modeling of Electronic Enclosures* Qihong Nie, Yogendra Joshi, Georgia Institute of Technology

Student Competition Winner

Experimental and Numerical Study of Thermal Interface Material Performance* Parisa Pour Shahid Saeed Abadi, Chuangang Lin, D.D.L. Chung, University at Buffalo, State University of New York

Enabling Dynamic Voltage & Frequency Scaling In Next-GenerationMicroprocessors: Thermal & Reliability Considerations
Sai Ankireddi, David Copeland, Sun Microsystems Inc.

Lunch: 12:00 pm – 1:30 pm

Session 5: Thermal Analysis II
Chair: George A. Meyer IV, Celsia Technologies
1:30 pm – 5:00 pm

Student Competition Winner

Development of Boundary Condition Independent Reduced Order Models using POD* Arun P. Raghupathy, Attila Aranyosi, William Maltz, Electronic Cooling Solutions Inc.; Karman Ghia, Urmila Ghia, University of Cincinnati

Solving Transient Non-Linear Heat Transfer Problems using a Spreadsheet
Guy R. Wagner, Storage Genetics, Inc.

Unraveling the Mystery of Equivalent Thermal Conductivities for Heat Pipe and Vapor Chambers
George A. Meyer IV, Sobo Sun, Celsia Technologies

Break: 3:00 pm – 3:30 pm

Student Competition Winner

Heat Sink Effect of a Gold Wire Bond Next to Hot Spots on a Microchip* Michael McCracken, Michael Mayer, John Persic, University of Waterloo - Microjoining Laboratory

Student Competition Winner

Bias-Dependent MOS Transistors Thermal Resistance and Non-uniform Self-heating Temperature* Xi Wang, James Chritofferson, Ali Shakouri, University of California Santa Cruz

Competitive Advantage through Strategic System Thermal Design
Denise Pliskin, Speck Design

Dinner: 5:00 pm – 6:30 pm

Session 6: System Cooling
Chair: William Maltz, Electronic Cooling Solutions
6:30 pm – 8:00 pm

Sub-Ambient Cooling System Overview
Gerald Wyatt, Dick Weber, Raytheon

Student Competition Winner

Chimney Effect on Natural Convection Cooling of Electronic Components* Bjorn Vermeersch, G. De Mey, M. Wojcik, J. Pilarski, M. Lasota, J. Banaszczyk, A. Napieralski, M. De Paepe, University of Ghent

Advances in Telecommunications Thermal Management Solutions
Rick Schmidt, Dantherm Air Handling, Inc.

Thursday, October 16

Registration: 7:30 am – 4:50 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 7: High Conductivity Materials
Chair: Dave Saums, DS&A LLC
8:30 am – 12:00 pm

Natural Graphite Reinforced Al and Cu Alloys with Thermal Conductivity 2 x Cu and Thermal Expansion Matched to Advanced Semiconductors
James A. Cornie, Rob Hay, Steve Cornie, Shiyu Zhang, Metal Matrix Composite, LLC and WmK LLC

The use of Diamond Composite Baseplates for Thermal Management of Power Electronic Modules
Svetlana Levchuk, G. Mitic, M. Poebl, Siemens AG

High Performance Pyrolytic Graphite Heat Spreaders – Near Isotropic Structures with Metallization
Richard J. Lemak, R. J. Moskaitis, MINTEQ International, Inc.; D. Pickrell, D. Kupp, A. M. Yocum, Omega Piezo Technologies, Inc.

Break: 10:00 am – 10:30 am

Diamond Materials for Thermal Applications
Thomas Obeloer, David Rowcliffe, Harris International

Thermal Reliability of Advanced Metal Diamond Composites
Ravi Bollina, Janet Linke, Tobias Mrotzek, Sven Knippscheer, Plansee SE

Advances in Material Design and Processing for Thermal Management Solutions
Birol Sonuparlak, Rogers Corporation

Lunch: 12:00 pm – 1:30 pm

Session 8: Liquid Cooling
Chair: John Peeples, The Citadel
1:30 pm – 4:50 pm

Vaporizable Dielectric Fluid Cooling for IGBT and Power Semiconductor Applications
Dave Saums, DS&A LLC; David Levett, Infineon Technologies; Jeremy Howes, Parker Hannifin; Joe Marsala, Thermal Form & Function Inc.

Automatic Purging of Non-Condensable Gases from 2-Phase Immersion Cooling Systems
Phillip E. Tuma, 3M Company

Immersion Cooling of Power Electronics in Segregated Hydrofluoroether Liquids
Cindy Barnes, Phillip E. Tuma, 3M Company

Break: 3:00 pm – 3:20 pm

Student Competition Winner

Flow Study in Magnetic Micro-Channel Heat Pipe* B. J. Wang, C. R. Chen, J. R. Tsai, W. F. Lee, C. H. Chen, C. Y. Chen, NSPO/NYUST/NKIT/NCTU

Passive Phase Change Tower Heat Sink & Pumped Coolant Technologies for Next Generation CPU Module Thermal Designs
Marlin Vogel, David Copeland, Andrew Masto, Sun Microsystems Inc.; Sukhvinder Kang, Brad Whitney, Aavid Thermalloy; Warren Gawve, Delphi; Matt Connors, Thermacore; Joe Marsala, Thermal Form and Function

Student Competition Winner

Model for Energy Transport in Nanofluids* Vijaya Kumar Kollipar, Emmanuel C. Nsofor, Southern Illinois University

Closing Remarks: 4:50 pm

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Registration Information:(Early Registration Deadline: October 3, 2008)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

Type	Early Fee Through 10/3/08	Advance/Onsite Fee After 10/3/08
IMAPS Member	$650	$750
Non-Member	$750	$850
Speaker	$350	$450
Chair	$350	$450
Student	$200	$300
Chapter Officer	$350	$450
Exhibits Only	$25	$25

Register On-line

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Speaker Dates/Information:

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Hotel Information -- Cut off: Monday Sept. 15, 2008

The Cabana Hotel Palo Alto – A Crowne Plaza Resort
4290 El Camino Real
Palo Alto, CA 94306

Rate: Single/Double $190

Phone Reservations: (800) 593-5447, mention International Microelectronics and Packaging Society

Online Reservations – www.cppaloalto.crowneplaza.com Group Code – IMA