Topical Workshop and Tabletop Exhibit on
Thermal Management
Submit Abstracts | Register Online | Exhibits | Exhibiting Companies

Toll House
Los Gatos, California - USA
November 6-8, 2018

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee:

Bill Maltz, President, Electronic Cooling Solutions, Inc.
Kamal Mostafavi, CoolIT Systems
Nader Nikfar, Principal Thermal Engineer, Qualcomm, Inc.
John Peeples, Professor and Chair, Electrical and Computer Engineering, The Citadel
Emil Rahim, Senior Thermal Engineer, Google Inc.
Tejas Shah, Senior Thermal Engineer, nVidia Corporation
Guy Wagner, Director, Electronic Cooling Solutions, Inc.
Ross Wilcoxon, Principal Mechanical Engineer, Advanced Technology Center, Rockwell Collins, Inc.

Early Registration & Hotel Deadline: October 1, 2018


Registration Information | Register Online | Speaker Info | Hotel
Tabletop Exhibit Information | Sponsorship Details | 2018 Exhibitors

See details below. Open to undergraduate and graduate students, globally.



Since 1992, this Workshop has been organized annually by IMAPS to specifically address current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The Workshop emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.

Speakers are expected to attend the entire Workshop to encourage greater interaction between registered attendees. Every year, authors and attendees find this IMAPS Workshop format to be an effective forum for networking between all participants. The reduced registration fee for speakers makes active participation in the program even more beneficial. Activities beyond the technical program, including meals, breaks, and exhibit hours, are focused on maximizing networking effectiveness. Attendees typically view individual discussions during this event to be a critical aspect of attendance and participation – to a much greater extent than in a typical technical conference.


  • Market Drivers: Understanding thermal challenges and business / economic drivers that influence change in electronic systems design and manufacturing – and how these impact thermal design requirements. Developing market trends, market segmentation, cost drivers and reliability factors are examples of topics that set the framework for where and what types of new technical solutions are viable.
  • Multi-Die Packaging: Advanced packaging technologies, such as System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die, etc. provide significant opportunities for miniaturization and performance enhancements. These technologies also can introduce significant thermal and interconnect challenges that must be balanced against those benefits.
  • Mobile and Handheld Devices and the Internet-of-Things (IoT): Wearables, mobile and medical devices, small displays, tablets and notebooks are increasingly critical for our interconnected world. These devices often introduce unique component- and system-level thermal management challenges that require novel design approaches and materials.
  • Wireless and Telecom Infrastructure: High performance telecom hardware have challenging component and system level requirements that require technical advances to meet the evolving needs for routers, networked systems, base stations, etc.
  • Power Semiconductor Thermal Components, Systems, and Solutions: Developments in IGBT thermal management and packaging strongly influence advances in electronic and electrical drive systems. These advances are increasingly important in the Electric Vehicle/Hybrid Electric Vehicle and renewable energy markets.
  • Mil/Aerospace: Emerging military and aerospace systems, including avionics, RF, and microwave components and modules for phased array radar, countermeasures, and other systems, require advanced thermal management as well as high-temperature materials and packaging.
  • System-Level Cooling: The thermal design of complex systems, such as high-performance computing systems, relies on extensive component- and system-level thermal management analysis to address the broad spectrum of issues that entail a comprehensive system design.
  • Data Center Cooling: Data center cooling includes a variety of design optimization activities including cooling provisioning, airflow control, temperature distribution and migration paths that range from forced air convection to system liquid cooling.
  • Liquid cooling, Phase-change, and Refrigeration: Advanced cooling methods that use liquid, latent heat and/or active cooling provide opportunities for enhanced performance and design flexibility. Effective designs must balance these advantages against factors including life-cycle cost, reliability and serviceability impact.
  • Thermal Interface Materials (TIMs) and Testing: Advanced thermal interface materials that may include organic, metallic, graphitic materials in bulk form as well as nanoscale are enabling significant advances in the thermal management of high-performance processors, memory, telecom, IGBT, RF, and microwave components and systems. Effective testing and reliability methods and standards are critical in determining the suitability of a TIM for a given application.
  • CTE-Matching and High Thermal Conductivity Materials: Metallic, ceramic and composite materials have been engineered to exhibit excellent thermal conductivity with controlled coefficient of thermal expansion (CTE) properties to allow for better matching with GaN, SiC, silicon or ceramic materials to reduce thermal stresses in component packaging.

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation IMMEDIATELY. No formal technical paper is required.
Abstracts must be submitted on-line at

A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be emailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than NOVEMBER 8, 2018, and will be included on the post-conference DOWNLOAD.

Questions:  Brian Schieman with questions You may also contact the workshop chairs.


Submit Abstract | Register On-Line

Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Authors must be currently enrolled in either an undergraduate or graduate program. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. Only those abstract marked as being submitted as student abstracts will be considered for this competition. The organizing committee will evaluate student abstracts submitted and award between $500 and $1000 stipend per award. The winning authors must attend the event and present the winning topics in order to receive the stipend award.

The Microelectronics Foundation

Speaker Dates/Information:

  • Abstract Deadline Extended To: SEPTEMBER 7, 2018
  • Speaker Notification: September 15, 2018
  • Early Registration & Hotel Deadlines: October 1, 2018
  • Powerpoint/Presentation file for DOWNLOAD due not later than: November 8, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: October 1, 2018) | Register Online

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before October 1, 2017. No refunds will be issued after that date.

Early Fee
Through 10/1/2018
Advance/Onsite Fee
After 10/1/2018
IMAPS Member
Chapter Officer
Exhibits Guest Pass - NO MEALS & NO SESSIONS
Tabletop Exhibit Booth - IMAPS Members
Tabletop Exhibit Booth - Non-Members

Register Online



Exhibit Information: Register Online (select tabletop or sponsor)

Limited to 11 Tabletops this year - NOW SOLD OUT

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems. This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. A tabletop exhibition has been a part of this workshop since 2008. The intimate Toll House Hotel venue will accommodate a maximum of 11 tabletops who get great exposure with all the event attendees over the course of two full days. The tabletop space will SELL OUT AGAIN EARLY!

Exhibits Open When Session "off" / During Breaks
Be sure to visit the companies in the foyer during your time at Thermal 2018!

A.L.M.T. Corp.
Celsia Inc.
Dynatron Corporation
Future Facilities
Henkel Electronics Materials
Long Win Science & Technology Corp.
T-Global Technology
W.L. Gore

Tuesday, November 6:
10:00am-5:00pm (when not in session)

Wednesday, November 7:
10:00am-4:00pm (when not in session)

Full exhibit hours/details once the program is published

Installation Hours:
Tuesday, November 6 - Morning/Before 10am


Register Online (select tabletop or sponsor)


Hotel Information -- Hotel Reservation Deadline: OCTOBER 1, 2018

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $259/night + taxes/fees

On-Line Reservations

Phone Reservations - Contact hotel directly: 800-238-6111 (Mention IMAPS or Thermal Workshop)

TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.




  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems