Micross

Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Register On-Line | Exhibiting Companies

Toll House
Los Gatos, California - USA
November 7-9, 2017

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
atwprogramchair@gmail.com
Tel: 408-330-5352

Program Committee:

Niru Kumari, Senior Research Engineer, HP Labs, HP Enterprise
Bill Maltz, President, Electronic Cooling Solutions, Inc.
Nader Nikfar, Principal Thermal Engineer, Qualcomm, Inc.
John Peeples, Professor and Chair, Electrical and Computer Engineering, The Citadel
Emil Rahim, Senior Thermal Engineer, Google Inc.
Tejas Shah, Senior Thermal Engineer, nVidia Corporation
Guy Wagner, Director, Electronic Cooling Solutions, Inc.
Ross Wilcoxon, Principal Mechanical Engineer, Advanced Technology Center, Rockwell Collins, Inc.

Early Registration Deadline: October 15, 2017
Hotel Deadline: October 6, 2017


Register On-Line
Registration Details | Speaker Info | Hotel
Sponsorship Details | 2017 Exhibitors


Thank you to our Corporate Sponsor:

Corporate Sponsor - Ansys


The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge. Beginning in 1992, this Workshop is one of the most successful of the IMAPS ATWs that are held each year on a variety of technical topics.

 


  TUESDAY, NOVEMBER 7

7:00am-
8:00pm
Registration Open

8:00am-
8:45am
Continental Breakfast

10:00am-
5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2017!

EXHIBITOR HOURS:
Tuesday, November 7:
10:00am-5:00pm (when not in session)

Wednesday, November 8:
10:00am-4:00pm (when not in session)

ANSYS – CORPORATE SPONSOR
Alpha Novatech
Celsia, Inc.
Dexerials Corp.
Electronic Cooling Solutions, Inc.
FRT of America, LLC
Long Win Science & Technology Corp.
MMR Technologies, Inc.
Momentive Performance Materials
Thermal Engineering Associates, Inc.

Installation Hours:
Tuesday, November 7 - Morning/Before 10am


8:45am-
9:00am
Welcome & Opening Remarks:
Dave Saums, DS&A LLC (General Chair) &
Vadim Gektin, Futurewei Technologies (Program Chair)

9:00am-
10:00am

KEYNOTE PRESENTATION:
Memory-Driven Computing

The computer industry is in the midst of a fundamental shift brought on by the coming end of Moore's Law scaling and the emergence of big data. As the amount and type of data increases due to the proliferation of cyber-physical systems, IoT and automation, the traditional levers used to increase performance in order to keep up with the data deluge are becoming less and less impactful. As such, new architectures are beginning to emerge that are designed to accommodate big data applications by placing data, rather than compute, at the center of the architecture. This talk will introduce one such architecture, called Memory-Driven Computing (MDC). Key elements of the architecture including the fabric, photonic interconnect and persistent memory will be highlighted as will their often unique implications on thermal management. A prototype of the MDC architecture, called the Machine, will be showcased with a discussion of the results achieved to date and implications for future systems and applications.

Cullen E. Bash, Hewlett Packard Enterprise, HP Labs
Senior Director


10:00am-
10:30am

Coffee Break in the Exhibit Area

Sponsored by:
Corporate Sponsor - Ansys


SESSION 1

THERMAL and THERMO-MECHANICAL MODELING
Session Chair: Dave Saums, DS&A LLC

10:30am-
11:00am
Performance Prediction of Fans Placed in Series
Guy Wagner, Electronic Cooling Solutions Inc.
11:00am-
11:30am
VTC1.5 Thermal Vacuum Facility Sun Simulator Design
Enrico Brega, BLV Licht GmbH - USHIO Group
11:30am-
12:00pm
FEA Modeling of Accumulated Creep Strain for Short Leaded MOSFET Solder Joints
Stephan Fatschel, MKS Instruments, Inc
12:00pm-12:30pm Thermal Reliability Across Chip, Package, Board, and System Scales
David Geb, ANSYS

12:30pm-
2:00pm

Lunch

Sponsored by:
Corporate Sponsor - Ansys


SESSION 2

TESTING and HARSH ENVIRONMENT
Session Chair: Ross Wilcoxon, Rockwell Collins, Inc.

2:00pm-
2:30pm
Innovative Packaging with Phase Change Materials in Aircraft Instrumentation
Sebastien Quenard, CEA Liten (Olivier Verseux, Airbus Operation SAS; Helga Szambolics, Ulrich Soupremanien, Lina Laifa, CEA Liten)
2:30pm-
3:00pm
Considerations for Developing A Standard for Measuring Theta jc in High and Low Resistance Packages
Jesse Galloway, Amkor Technology (Eduardo de los Heros)
3:00pm-
3:30pm
Long Term Heat Pipe Reliability Assessment Study Progress Report
Ross Wilcoxon, Rockwell Collins

3:30pm-
4:00pm

Coffee Break in the Exhibit Area

Sponsored by:
Corporate Sponsor - Ansys


SESSION 3

LIQUID COOLING and REFRIGERATION
Session Chair: John Peeples, The Citadel

4:00pm-
4:30pm
3D Chip Stack Cooling of High Power Electronics
Sumeer Khanna, Calce, University of Maryland (Patrick McCluskey, Avram Bar-Cohen, Bao Yang, Michael Ohadi)
4:30pm-
5:00pm
Challenges in the Cryogenic Cooling of the 3.3 Giga Pixel detector array of the Large Synoptic Survey Telescope for deployment in Chile in 2020
William Little, MMR Technologies, Inc.
5:00pm-
5:30pm
Two-Phase Flow of R245fa in a Microgap with Integrated Staggered Cylindrical Pin Fins
Pouya Asrar, Georgia Institute of Technology (Yogendra Joshi)

5:30pm-
7:00pm

Dinner

Sponsored by:
Corporate Sponsor - Ansys


SESSION 4

THERMAL MATERIALS
Session Chair: Emil Rahim, Google Inc.

7:00pm-
7:30pm
Compressible Graphite - A New Class of Thermal Interface Materials for High Heat Flux Applications
Ryan Wayne, NeoGraf Solutions, LLC (Prashanth Subramanian, Marty Smalc, Rick Beyerle, Julian Norley)
7:30pm-
8:00pm
Novel Solutions for High Power and High Temperature Die Attach Applications
Maciej Patelka, NAMICS Technologies
8:00pm-
8:30pm
Thermal Management Solutions
Jeb Flemming, 3D Glass Solutions

 

 

 

 


WEDNESDAY, NOVEMBER 8


7:00am-
8:00pm
Registration Open

8:00am-
9:00am
Continental Breakfast

10:00am-
5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2017!

EXHIBITOR HOURS:
Tuesday, November 7:
10:00am-5:00pm (when not in session)

Wednesday, November 8:
10:00am-4:00pm (when not in session)

ANSYS – CORPORATE SPONSOR
Alpha Novatech
Celsia, Inc.
Dexerials Corp.
Electronic Cooling Solutions, Inc.
FRT of America, LLC
Long Win Science & Technology Corp.
MMR Technologies, Inc.
Momentive Performance Materials
Thermal Engineering Associates, Inc.

 

Exhibitor Dismantle Hours:
Wednesday, November 8 - 4:00 pm - 7:00 pm (after exhibits end)


 

9:00am-
10:00am

KEYNOTE PRESENTATION:
Towards Energy Sustainability in Data Centers: Some Thoughts on Energy, Entropy, and Water

The evolving notion that we are in the midst of a "Fourth Industrial Revolution" was described by Klaus Schwab, Founder and Executive Director of the World Economic Forum, in the following way: "The possibilities of billions of people connected by mobile devices, with unprecedented processing power, storage capacity, and access to knowledge, are unlimited. And these possibilities will be multiplied by emerging technology breakthroughs in fields such as artificial intelligence, robotics, the Internet of Things, autonomous vehicles, 3-D printing, nanotechnology, biotechnology, materials science, energy storage, and quantum computing." The fabric that connects billions of people (through mobile and wearable devices), things (Internet of Things) and services (Internet of Services) is composed of (1) the digital engines or factories that store and process data (Data Centers, the “cloud”) and (2) the wired and wireless network that transmits that data (the Internet). It is easy to overlook the silent third partner in this alliance of technologies which is (3) the energy infrastructure required to power both the digital engines and the network. In this talk I will discuss the thermodynamics of data centers starting with the environmentally horrifying observation that almost all of the electrical power consumed by the "electronic engines" or servers in data centers is dissipated as heat. In efforts to save energy in the cooling of data centers, the hyperscale industry has adopted the use of outside air for cooling, coupled with evaporative air conditioning using water. In this context, swapping the consumption of one resource (electrical power required for mechanical cooling) with another (water for evaporative cooling) leads to confusion because they cannot necessarily be compared using energy units or metrics. Without offering solutions, in this talk I will focus on possible ways to think about the issue using well known but non-traditional approaches that involve second law and sustainable engineering thinking.

Dr. Alfonso Ortega, University of Santa Clara
Dean of the School of Engineering


10:00am-

10:30am

Coffee Break in the Exhibit Area


SESSION 5

HEAT PIPES and THERMOSYPHONS
Session Chair: Bill Maltz, Electronic Cooling Solutions, Inc.

10:30am-
11:00am
Two-phase Flow Regimes and Heat Transfer in a Manifolded-microgap
David Deisenroth, University of Maryland (Avram Bar-Cohen, Michael Ohadi)
11:00am-
11:30am
State of the Art in Oscillating Heat Pipes in Practical Application and in Theoretical Modeling
Joe Boswell, ThermAvant Technologies (Bruce Drolen)
11:30am-
12:00pm
Thermosyphon Applications for Power Semiconductors
David Saums, DS&A LLC
12:00pm-
12:30pm
A Combined Thermal-LIF and PIV Approach for Getting to the Root of the Problem: How Much Vapor does an Immersed High Heat Flux Chip Generate?
Matt Spot Harrison, Oregon State University (Joshua Gess, Ana Moita)

12:30pm-
2:00pm

Lunch


SESSION 6

PACKAGE- and BOARD-LEVEL THERMAL DESIGN
Session Chair: Tejas Shah, nVidia Corporation

2:00pm-
2:30pm
First-principles 3D Thermal Simulation of Microscale Devices
Bjorn Vermeersch CEA-Grenoble (Natalio Mingo, CEA-Grenoble; Erik Bury, Geoffrey Pourtois, Herman Oprins, IMEC; Ahmed Nejim, Silvaco)
2:30pm-
3:00pm
A Thermal Management System for High Heat Flux ASIC’s with High Bandwidth Memory (HBM)
Baris Dogruoz, Cisco (Vic Chia, Onder Cap, Don Nguyen, Pierre Chor-Fung Chia)
3:00pm-
3:30pm
Detailed PCB Thermal Modeling with Thermal Territories
Paul Blais, Mentor Graphics (John Wilson)

3:30pm-
4:00pm

Coffee Break in the Exhibit Area


SESSION 7

SYSTEM-LEVEL THERMAL DESIGN
Session Chair: Niru Kumari, HP Enterprise

4:00pm-
4:30pm
Cylindrical Geometry Energy Storage Cooling
Guy Wagner, Electronic Cooling Solutions Inc.
4:30pm-
5:00pm
Analytical Thermal Analysis of Bare Die and Lidded Die Cooling
Xiaopeng Huang, Futurewei Technologies (Vadim Gektin, Jaana Behm)
5:00pm-
5:30pm
Sustainability Lessons from the World’s Most Energy Efficient Data Center
Steven Hammond, National Renewable Energy Laboratory (Kevin Regimbal, David Sickinger)
5:30pm-
6:00pm
Passive Two-Phase Immersion Cooling Extended Run Test Vehicle Results and Observations
Nicholas Klitzke, Mayo Clinic (Stephen Polzer, Nathan Harff, Wendy Wilkins, Barry Gilbert, Clifton Haider)
 

 

 

 

 


THURSDAY, NOVEMBER 9


7:00am-
12:00pm
Registration Open

8:00am-
9:00am
Continental Breakfast

9:00am-
10:00am

KEYNOTE PRESENTATION:
TITLE TBD

Abstract Soon

Andy Delano, Microsoft
Title Soon


10:00am-
10:30am

Coffee Break

 

SESSION 8

MOBILE DEVICES THERMAL MANAGEMENT
Session Chair: Nader Nikfar, Qualcomm, Inc.

10:30am-
11:00am
Thermal Design of Consumer Electronics and a Reduced Order Modeling Approach
Zhihua Li, Amazon Lab126 (Shankar Ganapathysubramanian, Vikram Manthri)
11:00am-
11:30am
Novel Electromagnetic Interference and Thermal Solution for Smartphones using Composite Material
Hiroyuki Ryoson, Dexerials (Yusuke Kubo, Bolotov Sergey)
11:30am-
12:00pm
Thermal Design Challenges of the Microsoft Surface Studio Computer
Bo Dan, Microsoft (Andy Delano, Guy Wagner)

12:00pm CLOSING REMARKS

 

Supporting Sponsor:
Supporting Sponsor - EMD Performance Materials

 

 

Register On-Line


Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Authors must be currently enrolled in either an undergraduate or graduate program. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. Only those abstract marked as being submitted as student abstracts will be considered for this competition. The organizing committee will evaluate student abstracts submitted and award between $600 and $1000 stipend per award. The winning authors must attend the event and present the winning topics in order to receive the stipend award.

The Microelectronics Foundation

Speaker Dates/Information:

  • Abstract Deadline Extended to: AUGUST 23, 2017
  • Speaker Notification: October 4, 2017
  • Hotel Deadline: October 6, 2017
  • Early Registration Deadline: October 15, 2017
  • Speaker BIOs Due: November 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: November 9, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: October 15, 2017) | Register Online

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before October 1, 2017. No refunds will be issued after that date.

Type
Early Fee
Through 10/15/2017
Advance/Onsite Fee
After 10/15/2017
IMAPS Member
$750
$850
Non-Member
$875
$975
Speaker
$525
$625
Chair
$525
$625
Chapter Officer
$525
$625
Student
$300
$400
Exhibits Guest Pass - NO MEALS & NO SESSIONS
Complimentary
Complimentary
Tabletop Exhibit Booth - IMAPS Members
$750
$850
Tabletop Exhibit Booth - Non-Members
$875
$975
PREMIER Sponsor
$6500
$6500
CORPORATE Sponsor
$4500
$4500

Register Online

 

 


Hotel Information -- Hotel Reservation Deadline: OCTOBER 6, 2017

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $235/night + taxes/fees

Hotel Reservations

Phone Reservations - Contact hotel directly: 800-238-6111 (Mention IMAPS or Thermal Workshop)

TAXI or Uber from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.

 


 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems