Heraeus ELD

Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Submit Abstract | Register On-Line | Exhibits | Program (available September 25)

Toll House
Los Gatos, California - USA
October 28-30, 2014

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee:
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATTD
George A. Meyer IV, Celsia Technologies
Nader Nikfar, Qualcomm
Bill Maltz, Electronic Cooling Solutions
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.

Early Registration & Hotel Deadlines: October 6, 2014

Submit Abstract
Registration | Technical Program
| Speaker Info | Hotel
Tabletop Exhibit Information | 2014 Exhibitors | 2013 Exhibitors

Thank you to our 2014 Premier Sponsor:

Premier Sponsor - Bergquist Company


Thank you to our 2014 Corporate Sponsor:

Premier Sponsor - Huawei


Contact bschieman@imaps.org or Register Online soon

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop and Tabletop Exhibition on Thermal Management has been held since 1992, and is considered to be one of the most successful of the IMAPS ATWs that are held each year. Information will be available on transportation methods by train and/or bus from area airports.

Speakers are expected to attend the entire Workshop to maximize opportunities for interaction with registered attendees. Every year, authors and attendees find this IMAPS Workshop format to be a proven forum for highly effective networking between attendees and speakers. Speakers pay a reduced registration fee, making participation even more beneficial.

2014 KEYNOTE SPEAKERS - Qualcomm & Intel

Riko Radojcic
Senior Director of Technology
Qualcomm Technologies

Managing Thermal & Mechanical Interactions with 2.5D and 3D IC’s

Abstract: Current 2.5D and 3D chip integration technologies, targeting high performance and high density die-to-die interconnect, are reviewed. State of the Art is summarized, and the principal value propositions opportunities , and technology tradeoffs are highlighted. Principal implementation challenges are outlined, with focus on managing the thermal and mechanical interactions. It is concluded that whereas the thermal and mechanical challenges are not unique and specific to 2.5D and/or 3D stacks, use of these integration technologies does exacerbate the interactions. Possible methodologies for addressing and managing the thermal and mechanical challenges are outlined and discussed.

Biography: Riko Radojcic is a Senior Director of Technology at Qualcomm Technologies, and a leader of the 2.5D and 3D Technology Integration team. He has led a number of Design-for-Technology initiatives at Qualcomm; including Design-for-3D, Design-for-Multiphysics, Design-for-Manufacturability & Variability, etc.. Radojcic has more than thirty years of experience in the semiconductor industry, specializing in process-design integration. Before joining Qualcomm, he was a consultant to semiconductor and EDA companies providing engineering and business development services. He was a director of business development and marketing for DFM Solutions at PDF Solutions, and a Business Manager and an Architect with Tality and Cadence, specializing in design technology integration and process characterization and modeling. Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.

Radojcic has authored and co-authored a number of books and papers, since he received his BSc and PhD degrees from University of Salford, UK.

Ashish Gupta
Intel Corporation

Thermal and Mechanical Considerations and Challenges for Mobile and Handheld Products - System to Silicon

Abstract: Consumers are drawn towards mobile devices (tablets, phablets, and phones) which provide thinner form factors, richer and bigger displays and better multimedia capabilities. The functionality crammed into mobile devices will only continue to grow as consumers turn to their mobile devices to do more of their complex and rich functionality tasks. Thermal management and control of these passively cooled devices is of prime importance given the chassis design constraints and thermodynamic space limitations. At the same time, end users expect high levels of performance from their hand-held and mobile devices, and the trend from one generation to the next is increased performance while reducing thermodynamic space (thinner devices). The intersection of these two design philosophies meets at the end-user expectations: is the user willing to trade ergonomics (hotter devices) for increased performance, or is the end user willing to sacrifice performance for better ergonomics & battery life? These questions bring unique challenges for the thermo-mechanical community. This talk discusses most of these major challenges for current and next-generation mobile devices from an industry perspective and also various approaches that need to be taken to balance performance with ergonomics in a quantifiable manner.




  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telcom, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • Stacked-Die and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Cooling provisioning, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Mil/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics:  Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than September 15, 2014. No formal technical paper is required.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

A post-conference CD containing the full presentation material as supplied by authors will be mailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than October 30, 2014, and will be included on the post-conference CD.

Questions:  Brian Schieman with questions bschieman@imaps.org or 412-368-1621. You may also contact the workshop chairs.


Submit Abstract | Register On-Line

Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Authors must be currently enrolled in either an undergraduate or graduate program. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. Only those abstract marked as being submitted as student abstracts will be considered for this competition. The organizing committee will evaluate student abstracts submitted and award between $600 and $1000 stipend per award. The winning authors must attend the event and present the winning topics in order to receive the stipend award.

The Microelectronics Foundation

Speaker Dates/Information:

  • Abstracts Deadline Extended to: September 15, 2014
  • Early Registration & Hotel Deadlines: October 6, 2014
  • Powerpoint/Presentation file for CD-Rom due not later than: October 30, 2014
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: October 6, 2014) | Register Online

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one CD/Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 24, 2014. No refunds will be issued after that date.

Early Fee
Through 10/6/2014
Advance/Onsite Fee
IMAPS Member
Chapter Officer
Exhibits Only NO MEALS
Tabletop Exhibit Booth - IMAPS Members
Tabletop Exhibit Booth - Non-Members

Register Online



Hotel Information -- Hotel Reservation Deadline: October 6, 2014

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $169 + tax per night

Phone Reservations - Contact hotel directly: 800-238-6111

On-Line Reservations

TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.


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  • Honeywell
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