Advanced
Technology Workshop on
Thermal Management
Dinah's Garden Hotel
Palo Alto, California - USA
November 7-9, 2011
General
Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
|
Program
Chair
Vadim Gektin
Futurewei Technologies
atw11.programchair@gmail.com
|
Program Committee:
David Copeland, Oracle
Andrew Delano, Honeywell Electronic Materials
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATD
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.
Purchase Workshop CD-Rom
Tabletop Exhibit Information | 2011 Exhibitors
Co-located with ATW on System Level Packaging (Nov 10-11)
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems.
Monday, November 7, 2011
Registration: 1:00 pm - 8:30 pm
Opening Remarks: 1:55 pm - 2:00 pm
Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
2:00 pm - 3:30 pm
Thermal Packaging - The Inward Migration
Avram Bar-Cohen, DARPA-MTO
Market Needs for Thermal Materials Developments for Semiconductor Packaging
David L. Saums, DS&A LLC
Unique Engineering Concept to Extend Future of Active Cooling
Roger Dickinson, Bergquist Company
Break: 3:30 pm - 4:00 pm
Session 2: Thermal and Packaging Materials I
Chair: Guy R. Wagner, Electronic Cooling Solutions
4:00 pm - 5:30 pm
Nanoscale Polymer Coatings for Enhanced Bonding and Thermal Conductance in Carbon Nanotube Array Interfaces
Baratunde A. Cola, John H. Taphouse, Thomas L. Bougher, Georgia Institute of Technology
The Art of TIM Thermal Measurements
Bernie Siegal, Thermal Engineering Assocites, Inc.
Direct Aluminum Soldering Paste
William Avery, Superior Flux and Mfg. Co.
Dinner: 5:30 pm - 7:00 pm
Session 3: Thermal and Packaging Materials II
Chair: Guy R. Wagner, Electronic Cooling Solutions
7:00 pm - 8:30 pm
Applications of Thermal Interface Materials in Test of IC Packages
Jaime A. Sanchez, Intel Corporation
Liquid Adhesive Selection and Performance in Electronics Applications
John Timmerman, Sanjay Misra, Bergquist Company
Indium Heat-Spring® and Its Use In RF Flangeless Packages
Ben Samples, Dick Frey, Microsemi; Seth Homer, Indium Corporation
Tuesday, November 8, 2011
Registration: 8:00 am - 9:00 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibit Opens: During Breaks & Lunch
Session 4: Thermal and Packaging Materials III
Chair: Andrew Delano, Honeywell Electronic Materials
9:00 am - 10:30 am
Thermal Pyrolytic Graphite Composite with Coefficient of Thermal Expansion Machining for Advanced Thermal Management
Wei Fan, Xiang Liu, John Mariner, Momentive Performance Materials
Advances in High Performance Pyrolytic Graphite Heat Spreaders
Robert J. Moskaitis, Richard J. Lemak, MINTEQ International; Yoshi Nogami, THERMOGRAPHITICS Inc.
Copper MetGraf™ Composite Cores for PCB Thermal Control
Robert A. Hay, M. Ryals, K. Fennessy, Metal Matrix Cast Composites, LLC
Break: 10:30 am - 11:00 am
Session 5: Thermal Analysis and Modeling I
Chair: David Copeland, Oracle
11:00 am - 12:30 pm
Effect of Packaging Miniaturization on Heat Sinking COTS Processors
Brian Smith, Peter Kwok, Draper Laboratory
High-Speed Thermoreflectance Imaging for Thermoelectric Device and Semiconductor Material Characterisation
Bjorn Vermeersch, Je-Hyeong Bahk, James Christofferson, Ali Shakouri, University of California, Santa Cruz
Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)
Session 6: Thermal Analysis and Modeling II
Chair: David Copeland, Oracle
2:00 pm - 3:30 pm
Driving Down Data Center Power Consumption Through Thermal Management Optimization
Timothy A. Shedd, Jacqueline Rehagen, University of Wisconsin-Madison
Calibration and Temperature Sensitivity in Thermoreflectance and Infrared Imaging
Kazuaki Yazawa, Dustin Kending, MicrosanJ LLC; Ali Shakouri, UC Santa Cruz
Characterization of Thermo-Electric Coolers and Applications to Test of IC Packages
Jaime A. Sanchez, Intel Corporation
Break: 3:30 pm - 4:00 pm
Session 7: Thermal Analysis and Modeling III
Chair: Tannaz Harirchian, Intel ATD
4:00 pm - 5:30 pm
Identifying Thermal Bottlenecks and Shortcut Opportunities in Electronics Cooling Applications
Travis Mikjaniec, Robin Bornoff, Mentor Graphics Corporation
Elevator Shaft Vapor Intrusion Modeling using Computational Fluid Dynamics
Charles R Ortloff, CFD Consultants International; Guy R Wagner, Electronic Cooling Solutions, Inc.
Dinner: 5:30 pm – 7:00 pm
Session 8: System Cooling I
Chair: Marlin Vogel, Juniper Networks
7:00 pm - 9:00 pm
Moisture Control for Electronic Packaging
Kenneth Credle, Sam Incorvia, Multisorb Technologies
Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Brian A. English, Michael R. Whitley, Michael S. Kranz, EngeniusMicro LLC; Tracy Hudson, U.S. Army RDECOM AMRDEC
An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes with Rectangular Shape Evaporators
Z. R. Lin, Z. Y. Lee and L. W. Zhang, Novark Technology Inc.; S. F. Wang, China Southern University of Technology
Wednesday, November 9, 2011
Registration: 8:00 am - 5:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibit Opens: During Breaks & Lunch
Session 9: System Cooling II
Chair: Marlin Vogel, Juniper Networks
9:00 am - 10:30 am
Development of a Piezo-Actuator Cooling Technology with Applications to Low Power Electronics
Parisa Foroughi, Ioan Sauciuc, Ketan R. Shah, Intel Corporation; Hiroaki Wada, Gaku Kamitani, Murata Manufacturing Co., Ltd.
Improving Cooling System Acoustics, Power and Reliability Using Synjets for Fan Augmentation
Raghav Mahalingam, Nuventix
Modeling of Fan Failures in Networking Enclosures
Susheela Narasimhan, Cisco Systems Inc.; Gokul Shankaran, Ansys Inc.
Break: 10:30 am - 11:00 am
Session 10: Data Center Cooling
Chair: George A. Meyer IV, Celsia Technologies
11:00 am - 12:30 pm
Passive 2-Phase Immersion of Datacom Equipment - A Comparison to Water Cooling
Phillip Tuma, 3M Company
Economizer Based Server Liquid Cooling to Enable Significant Data Center Energy Savings
Madhusudan Iyengar, Timothy Chainer, Michael Gaynes, Pritish R Parida, Mark Schultz, Milnes P. David, David Graybill, Vinod Kamath, Bejoy J. Kochuparambil, IBM Corporation
Thermodynamic Performance of Containerized Eco-POD Data Centers
Niru Kumari, Wade Vinson, Tahir Cader, Amip Shah, Cullen Bash, Matt Slaby, Zhikui Wang, Carlos Felix, Abdiel Aviles, Miguel Figueroa, Hewlett-Packard Company
Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)
Session 11: Liquid, Phase-Change, and Refrigeration Cooling I
Chair: John Peeples, The Citadel
2:00 pm - 3:30 pm
A Study of Thermal Transport of Nanofluids and Their Suitability for Electronics Cooling
Dong Liu, Leyuan Yu, University of Houston
Server Power Reduction Through On-Chip Liquid Cooling
Geoff Lyon, Coolit Systems
Thermal and Hydraulic Performance of Metal Oxide - Based Nanofluids in Heat Exchangers
Sanjida Tamanna, Ehsan Yakhshi-Tafti, Howard Pearlman, Advanced Cooling Technologies
Break: 3:30 pm - 4:00 pm
Session 12: Liquid, Phase-Change, and Refrigeration Cooling II
Chair: John Peeples, The Citadel
4:00 pm - 5:00 pm
Highly Efficient Electronics Thermal Management Using Two-Phase Impinging Jets
Timothy A. Shedd, University of Wisconsin-Madison
Collider Jets Cooling Method of Microprossesors
Mikhail Spokoyny, A.J. Drexel University; Vladimir Trofimov, Odessa National Polytechnic University - Ukraine
An Open Power and Cooling Architecture
Phil Hughes, Clustered Systems Company, Inc.
Closing Remarks: 5:00 pm
