Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management
Submit Abstracts | Register On-Line | Exhibits | Exhibiting Companies

Toll House
Los Gatos, California - USA
September 22-24, 2015

General Chair
Dave Saums
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
Tel: 408-330-5352

Program Committee (TBD):
Vadim Gektin, Futurewei Technologies
Tannaz Harirchian, Intel ATTD
George A. Meyer IV, Celsia Technologies
Nader Nikfar, Qualcomm
Bill Maltz, Electronic Cooling Solutions
Kamal Mostafavi, CoolIt Systems Calgary
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.

Abstract Deadline Extended To: July 15, 2015
Early Registration & Hotel Deadline: August 21, 2015


Registration | Speaker Info | Hotel
Tabletop Exhibit Information | 2015 Exhibitors | 2014 Exhibitors

Thank you to our 2015 Premier Sponsor:

Premier Sponsor - Bergquist Company


Thank you to our 2015 Corporate Sponsor:

Premier Sponsor - Huawei

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

Beginning in 1992, this Workshop is one of the most successful of the IMAPS ATWs that are held each year on a variety of technical topics. Speakers are expected to attend the entire Workshop to maximize opportunities for interaction with registered attendees. Presenters and attendees have found this IMAPS format to be a proven forum for highly effective networking between attendees and speakers. Speakers pay a reduced registration fee, making participation even more beneficial. There are a limited number of technical exhibits and these spaces are committed early as there is a maximum area capacity.


  • This is a workshop and no manuscript is required. Presentations are typically PowerPoint only.
  • Greatest emphasis is placed in review on what is innovative, different, and highly practical.
  • The intention of this Workshop is that attendees are able to return with credible, practical concepts and new product and materials information; understanding of developing market needs; and new advances in testing, modeling, manufacturing, and process development.
  • A student abstract competition with sponsored stipends will again be held, for the twelfth year, open globally to undergraduate and graduate students in science and engineering programs.
  • Workshop location is easily reached by taxi from San Jose (SJC) Airport, Northern California.

For 2015, we are asking that potential speakers submit an early statement by July 15, outlining the intention to submit an abstract and the intended topic. This must be accompanied by a submitter’s name and contact information, so that we may be sure to follow up to ensure that no one who wishes to be considered is inadvertently excluded without abstract review.


  • Market Drivers:  Thermal challenges and business and economic drivers which influence change in electronic systems design and manufacturing. Developing market trends, market segmentation, cost drivers, and reliability factors are examples of topics that are included in this session. Such market and business data sets the framework for new technical solutions.
  • Consumer Electronics:  Component- and system-level thermal management solutions for handheld devices, wearables and displays.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, telecommunications, IGBT, RF, and microwave components and systems. Standards for testing and reliability. Organic, metallic, metal, graphitic, and other forms of TIMs are included, as well as developments with nanomaterials.
  • CTE-Matching and High Thermal Conductivity Materials:  Metallic, ceramic, and other composite materials with excellent thermal conductivity and coefficient of thermal expansion targeted to that of GaN, SiC, silicon, or ceramic materials. 
  • Stacked-Die and Device Packaging:  Chip-level packaging, including System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die and related thermal and interconnect challenges.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Performance, flexibility, reliability, and serviceability improvements.
  • System and Data Center Cooling:  Component and system-level thermal management, airflow, temperature distribution, and migration paths to system liquid cooling.
  • Power Semiconductor Thermal Components, Systems, and Solutions:  Discrete and multichip IGBT packaging.
  • Military/Aerospace:  Thermal management solutions for emerging and future military and aerospace components and platforms.
  • Telecommunications Systems:  Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Automotive: Thermal management of drive train, under-hood and in-cabin systems

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 15, 2015. No formal technical paper is required.

Abstracts must be submitted on-line at

A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be emailed approximately 15 business days after the event to all attendees.  Presentation material must be submitted onsite no later than SEPTEMBER 24, 2015, and will be included on the post-conference DOWNLOAD.

Questions:  Brian Schieman with questions You may also contact the workshop chairs.


Submit Abstract | Register On-Line

Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Authors must be currently enrolled in either an undergraduate or graduate program. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. Only those abstract marked as being submitted as student abstracts will be considered for this competition. The organizing committee will evaluate student abstracts submitted and award between $600 and $1000 stipend per award. The winning authors must attend the event and present the winning topics in order to receive the stipend award.

The Microelectronics Foundation

Speaker Dates/Information:

  • Preliminary Abstract Deadline (Title & Topic ONLY, if full abstract not ready): June 19, 2015
  • Complete Abstract Deadline (if full abstract not provided earlier): July 15, 2015
  • Program Completion Deadline: August 1, 2015
  • Speaker Notification: August 1, 2015
  • Early Registration & Hotel Deadlines: August 21, 2015
  • Powerpoint/Presentation file for DOWNLOAD due not later than: September 24, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: August 21, 2015) | Register Online

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 1, 2015. No refunds will be issued after that date.

Early Fee
Through 8/21/2015
Advance/Onsite Fee
After 8/21/2015
IMAPS Member
Chapter Officer
Exhibits Only NO MEALS
Tabletop Exhibit Booth - IMAPS Members
Tabletop Exhibit Booth - Non-Members

Register Online



Hotel Information -- Hotel Reservation Deadline: August 21, 2015

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

Single/Double: $189/night + taxes/fees

On-Line Reservations

Phone Reservations - Contact hotel directly: 800-238-6111 (Mention IMAPS or Thermal Workshop)

TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.





  • Amkor
  • Canon
  • Corning
  • Fastech Synergy Philippines
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems