Advanced
Technology Workshop and Tabletop Exhibition on
Thermal Management
The Cabaña Hotel & Resort (A Crowne Plaza Resort)
Palo Alto, California - USA
October 13 - 16, 2008
Advance Program
Early Registration Deadline: October 3, 2008
Hotel Deadline: September 15, 2008
General
Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
|
Program
Chair
Vadim Gektin
Sun Microsystems, Inc.
vadim.gektin@sun.com
Tel: 408-276-6580
|
Program Committee:
David Copeland, Sun Microsystems Inc.
Vadim Gektin, Sun Microsystems, Inc.
William Maltz, Electronic Cooling Solutions
George A. Meyer IV, Celsia Technologies
John Peeples, The Citadel
Dave Saums, DS&A LLC
Jun Shen, Redback Networks, Inc. (An Ericsson Company)
Guy R. Wagner, Storage Genetics, Inc.
Registration Information | Register On-Line
Download Program PDF | Speaker Information | Hotel Reservations
Tabletop Exhibition Information | Exhibiting Companies
Reserve Tabletop(s) (Sold Out)
Monday, October 13
Registration: 5:00 pm - 6:30 pm
Opening Reception: 5:30 pm - 6:30 pm
Tuesday, October 14
Registration: 7:30 am - 8:00 pm
Continental Breakfast: 7:30 am - 8:30 am
Exhibit Opens: Noon – 5:00 pm
Opening Remarks: 8:30 am – 8:40 am
Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:40 am – 12:00 pm
Mobile PCI Express Graphics Module (MXM) 3.0 specification: Thermo-Mechanical Interchangeability
Joe Walters, Mohammed Tantoush, nVidia
Data Center Cooling: Comparison of Thermal Resistance and Pump Power for Circulating Air, Water, and Freon (Phase Change) Coolants
Ronald C. Crane, Clustered Systems Co.
Thermal Management in the Renewable Energy Market
Kevin Closson, Nerac
Break: 10:10 am – 10:30 am
An Overview of the Water Cooling System for the IBM Power 575 Supercomputer
Michael J. Ellsworth, Jr., International Business Machines Corporation
Preliminary Specification for a Closed Loop Liquid Cooling System Product Reliability Test Plan
Margaret B. Stern, David Copeland, Marlin Vogel, John Dunn, Don Kearns, Steve Lindquist, Sun Microsystems
Thermoelectric Power Harvesting from Small Engines
John Langley, Bor Yann Liaw, Ambient Micro; William Maltz, Electronic Cooling Solutions, Inc.; Guy Wagner, Storage Genetics, Inc.
Lunch: 12:00 pm – 1:30 pm
Session 2: Thermal Interface Materials
Chair: Guy Wagner, Storage Genetics, Inc.
1:30 pm – 5:00 pm
Thermal Interface Material Market Outlook
Melanie Wuthenow, Prismark
Thermally Conductive Adhesives for Electronics Applications
John Timmerman, The Bergquist Company
Application and Performance Characteristics of Soft Metal Thermal Interface Materials for IGBT Applications
Dave Saums, DS&A LLC; Bob Jarrett, Jordan Ross, Indium Corporation; Alan Fairbairn, Indium Corporation UK; Wolfgang Bloching, GPS Technologies GmbH
Break: 3:00 pm – 3:30 pm
Equipment and Methodology for Consistent High Quality Stencil Printing of Phase Change Thermal Interface Material
Andrew D. Delano, Richard Xu, Honeywell
Stress Minimization during Deflection of Thermally Conductive Gap Pads
Karen Bruzda, Laird Technologies
Materials and Substrates for LED Thermal Management
Justin Kolbe, Sanjay Misra, The Bergquist Company
Dinner: 5:00 pm – 6:30 pm
Session 3: Equipment and Test
Chair: Jun Shen, Redback Networks, Inc. (An Ericsson Company)
6:30 pm – 8:00 pm
Thermal Test Chip - Definition, Design and Applications
Bernie Siegal, Thermal Engineering Associates, Inc.
Thermo-Mechanical Design Challenges in Validation Platforms
Rahima K. Mohammed, Ashok Kabadi, Intel Corporation
Thermal Management System with Passive Cooling Modules
Michael Spokoiny, Vladimir Zrodnikov, Xinliang Qiu, James M. Kerner, United States Technology Consortium
Wednesday, October 15
Registration: 7:30 am - 8:00 pm
Continental Breakfast: 7:30 am - 8:30 am
Exhibit Opens: 10:00 am – 3:00 pm
Session 4: Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
8:30 am – 12:00 pm
Thermal Interface Materials Characterization and Development by Computer Modeling and in Package Testing
David A. Zoba, LORD Corporation
Thermal Characterization of a Half mPCI Express Card and Associated Devices
Raj Bahadur, Carlton Hanna, Upendra Sheth, Intel Corporation
Why Mathematical Modeling is a Necessity to Manage the Cooling/Energy Efficiency in Today’s Mission Critical Facilities
Sherman Ikemoto, Akhil Docca, Future Facilities Inc.
Break: 10:00 am – 10:30 am
Enabling Dynamic Voltage & Frequency Scaling In Next-GenerationMicroprocessors: Thermal & Reliability Considerations
Sai Ankireddi, David Copeland, Sun Microsystems Inc.
Lunch: 12:00 pm – 1:30 pm
Session 5: Thermal Analysis II
Chair: George A. Meyer IV, Celsia Technologies
1:30 pm – 5:00 pm
Solving Transient Non-Linear Heat Transfer Problems using a Spreadsheet
Guy R. Wagner, Storage Genetics, Inc.
Unraveling the Mystery of Equivalent Thermal Conductivities for Heat Pipe and Vapor Chambers
George A. Meyer IV, Sobo Sun, Celsia Technologies
Break: 3:00 pm – 3:30 pm
Competitive Advantage through Strategic System Thermal Design
Denise Pliskin, Speck Design
Dinner: 5:00 pm – 6:30 pm
Session 6: System Cooling
Chair: William Maltz, Electronic Cooling Solutions
6:30 pm – 8:00 pm
Sub-Ambient Cooling System Overview
Gerald Wyatt, Dick Weber, Raytheon
Advances in Telecommunications Thermal Management Solutions
Rick Schmidt, Dantherm Air Handling, Inc.
Thursday, October 16
Registration: 7:30 am – 4:50 pm
Continental Breakfast: 7:30 am - 8:30 am
Session 7: High Conductivity Materials
Chair: Dave Saums, DS&A LLC
8:30 am – 12:00 pm
Natural Graphite Reinforced Al and Cu Alloys with Thermal Conductivity 2 x Cu and Thermal Expansion Matched to Advanced Semiconductors
James A. Cornie, Rob Hay, Steve Cornie, Shiyu Zhang, Metal Matrix Composite, LLC and WmK LLC
The use of Diamond Composite Baseplates for Thermal Management of Power Electronic Modules
Svetlana Levchuk, G. Mitic, M. Poebl, Siemens AG
High Performance Pyrolytic Graphite Heat Spreaders – Near Isotropic Structures with Metallization
Richard J. Lemak, R. J. Moskaitis, MINTEQ International, Inc.; D. Pickrell, D. Kupp, A. M. Yocum, Omega Piezo Technologies, Inc.
Break: 10:00 am – 10:30 am
Diamond Materials for Thermal Applications
Thomas Obeloer, David Rowcliffe, Harris International
Thermal Reliability of Advanced Metal Diamond Composites
Ravi Bollina, Janet Linke, Tobias Mrotzek, Sven Knippscheer, Plansee SE
Advances in Material Design and Processing for Thermal Management Solutions
Birol Sonuparlak, Rogers Corporation
Lunch: 12:00 pm – 1:30 pm
Session 8: Liquid Cooling
Chair: John Peeples, The Citadel
1:30 pm – 4:50 pm
Vaporizable Dielectric Fluid Cooling for IGBT and Power Semiconductor Applications
Dave Saums, DS&A LLC; David Levett, Infineon Technologies; Jeremy Howes, Parker Hannifin; Joe Marsala, Thermal Form & Function Inc.
Automatic Purging of Non-Condensable Gases from 2-Phase Immersion Cooling Systems
Phillip E. Tuma, 3M Company
Immersion Cooling of Power Electronics in Segregated Hydrofluoroether Liquids
Cindy Barnes, Phillip E. Tuma, 3M Company
Break: 3:00 pm – 3:20 pm
Passive Phase Change Tower Heat Sink & Pumped Coolant Technologies for Next Generation CPU Module Thermal Designs
Marlin Vogel, David Copeland, Andrew Masto, Sun Microsystems Inc.; Sukhvinder Kang, Brad Whitney, Aavid Thermalloy; Warren Gawve, Delphi; Matt Connors, Thermacore; Joe Marsala, Thermal Form and Function
Closing Remarks: 4:50 pm
Registration Information:(Early Registration Deadline: October 3, 2008)
Member, Non-member, Speaker/Chair, Student and Chapter Officer registration
fees include: access to all technical
sessions, meals, receptions, refreshment
breaks,
an Abstract
Book and one
(1) CD-Rom of the presentations.
Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.
Type |
Early Fee
Through 10/3/08 |
Advance/Onsite Fee
After 10/3/08 |
| IMAPS Member |
$650 |
$750 |
| Non-Member |
$750 |
$850 |
| Speaker |
$350 |
$450 |
| Chair |
$350 |
$450 |
| Student |
$200 |
$300 |
| Chapter Officer |
$350 |
$450 |
| Exhibits Only |
$25 |
$25 |
Register On-line
Speaker Dates/Information:
-
Abstract due: August 22, 2008
- Speaker Notification/Confirmation emailed: August 29, 2008
-
Extended Abstract or Presentation Material due: September 12, 2008
-
Powerpoint/Presentation file for CD-Rom due not later than: October 16, 2008
-
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
Hotel Information -- Cut off: Monday Sept. 15, 2008
The Cabana Hotel Palo Alto – A Crowne Plaza Resort
4290 El Camino Real
Palo Alto, CA 94306
Rate: Single/Double $190
Phone Reservations: (800) 593-5447, mention International Microelectronics and Packaging Society
Online Reservations – www.cppaloalto.crowneplaza.com Group Code – IMA