KESTER

Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management

Toll House
Los Gatos, California - USA
October 25-27, 2016

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
atwprogramchair@gmail.com
Tel: 408-330-5352

Program Committee:
Vadim Gektin, Futurewei Technologies
George A. Meyer IV, Celsia Technologies
Nader Nikfar, Qualcomm
Bill Maltz, Electronic Cooling Solutions
Kamal Mostafavi, CoolIt Systems Calgary
John Peeples, The Citadel
Dave Saums, DS&A LLC
Marlin Vogel, Juniper Networks
Guy R. Wagner, Electronic Cooling Solutions
Ross Wilcoxon, Rockwell Collins, Inc.


Speaker Info | 2016 Exhibitors


Thank you to our Premier Sponsor:

Premier Sponsor - Henkel Bergquist

 

Thank you to our Corporate Sponsor:

Premier Sponsor - Huawei


The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge. Beginning in 1992, this Workshop is one of the most successful of the IMAPS ATWs that are held each year on a variety of technical topics.

 


  TUESDAY, OCTOBER 25

7:00am-8:00pm Registration Open

8:00am-8:45am Continental Breakfast

10:00am-5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2016!

EXHIBITOR HOURS:
Tuesday, October 25: 10:00am-5:00pm (when not in session)
Wednesday, October 26: 10:00am-5:00pm (when not in session)

Henkel Corporation – PREMIER SPONSOR
Huawei Technologies – CORPORATE SPONSOR
Innovative Research, LLC – SUPPORTING SPONSOR

AkroMetrix, LLC
Celsia Technologies
DS&A, LLC
Dexerials America Corporation
Ebullient, Inc.
Electronic Cooling Solutions, Inc.
Long Win Science and Technology Corporation
Suzhou Tianmai Thermal Technology Co.,Ltd.
Thermal Engineering Associates, Inc.

 

Installation Hours:
Tuesday, October 25 - Morning/Before

Break Dismantle Hours:
Wednesday, October 26 - 4:00 pm - 7:00 pm (after exhibits end)


8:45am-9:00am Welcome & Opening Remarks:
Dave Saums, DS&A LLC (General Chair) & Vadim Gektin, Futurewei Technologies (Program Chair)

9:00am-10:00am

KEYNOTE PRESENTATION - Enterprise Server Liquid Cooling:
Liquid Cooling Today’s High Performance Computers

Liquid cooling IT equipment, namely, but not limited to high performance computers, is nowadays done very differently than how it has historically been done. Liquids other than water are being used as coolants. Servers are being completely immersed in dielectric liquid filled racks. Two-phase dielectric liquid cooling continues to be explored and is moving closer and closer to adoption. Even tried and true water cooling is being implemented very differently than it was in the past; it is not “your father’s water cooling.” You’ll also find liquid (water) cooling is not being done for the same reasons as it was done previously.

This presentation will overview liquid cooling technologies that are in practice today. The general benefits and detractors of liquid cooling vs. traditional air cooling as well as the benefits and pitfalls of the various liquid cooling technologies will be discussed. Categorization of the various liquid cooling implementations at all levels within the data center environment: module, system, rack, data center white space, data center facility, and outside ambient; will be provided. Finally, the relatively new ASHRAE liquid cooling operational classes (W1-W5) will be reviewed.

Michael J. Ellsworth, Jr. | IBM Corporation
Senior Technical Staff Member, Technical Manager, Advanced Thermal Energy Efficiency Lab


10:00am-10:30am

Coffee Break in the Exhibit Area

Sponsored by:
Premier Sponsor - Huawei


SESSION 1

HANDHELD/WEARABLE/IMPLANTABLE DEVICES I
Session Chair: Dave Saums, DS&A LLC

10:30am-11:00am Regulatory, Market, Packaging, and Thermal Design for Wearable and Implantable Medical Electronics
Dave Saums, DS&A LLC (George Cintra, Dartmouth Technology Group)
11:00am-11:30am Thermal Performance of Wearable Electronics
Damion Gastelum, Qualcomm (Nader Nikfar)
11:30am-12:00pm Microsoft Surface Pro 4 Thermal Architecture
Andy Delano, Microsoft
12:00pm-12:30pm Phase Change Material (PCM) Implementation within Mobile Devices
Nader Nikfar, Qualcomm (Damion Gastelum, Amy Marconnet)

12:30pm-2:00pm

Lunch

Sponsored by:
Premier Sponsor - Huawei


SESSION 2

THERMAL INTERFACE MATERIALS I
Session Chair: Vadim Gektin, Futurewei Technologies

2:00pm-2:30pm Automation of Die Attach using BondFoil™
Jim Fraivillig, Fraivillig Technologies (Peter Cronin, MRSI Systems; Kent Hutchings, Jeff Dunlap, Rich Koba, Materion)
2:30pm-3:00pm Thermal Interface Material (TIM2) Performance Evaluation
Eduardo De Los Heros, Qualcomm (Guoping Xu, Nader Nikfar)
3:00pm-3:30pm Heat Transfer in Silver-Diamond Composite - WITHDRAWN BY AUTHOR, OCT. 24
Sumeer Khanna, University of Maryland at College Park (Avram Bar-Cohen, Patrick McCluskey, Bao Yang, Michael Ohadi, Michael Manno)

3:30pm-4:00pm

Coffee Break in the Exhibit Area

Sponsored by:
Premier Sponsor - Huawei


SESSION 3

THERMAL MODELING I
Session Chair: Guy Wagner, Electronic Cooling Solutions

4:00pm-4:30pm From Atom to System: First-principles Thermal Modeling with ALMA-BTE
Bjorn Vermeersch, CEA/LITEN (Jesús Carrete, Natalio Mingo)
4:30pm-5:00pm

Challenges Associated With Fan Cooled Electronics System Design
Ben Cook, Software Cradle Co.

5:00pm-5:30pm

Tools of the Trade: A Review of the Tools & Methods to Analyze Electronics Systems
William Villers, TEN TECH LLC


5:30pm-7:00pm

Dinner:
THE LOS GATOS BAR AND GRILL
The Los Gatos Bar & Grill is a two block walk away from the hotel on the main strip in Los Gatos. Attendees will walk over together and walk back in time for the evening session.

Sponsored by:
Premier Sponsor - Henkel Bergquist


SESSION 4

THERMAL MODELING II
Session Chair: Vadim Gektin, Futurewei Technologies

7:00pm-7:30pm Use of Flow Network Modeling (FNM) for System-Level Design of Air- and Liquid-Cooled Electronics
Kanchan Kelkar, Innovative Research, LLC
7:30pm-8:00pm Thermal Model Calibration for Dynamic Response
John Wilson, Mentor Graphics (Byron Blackmore)
8:00pm-8:30pm System in Package Design: Performance-Based Partitioning and Placement
Thomas Tarter, Package Science Services LLC

 

 

 

 


WEDNESDAY, OCTOBER 26


7:00am-8:00pm Registration Open

8:00am-9:00am Continental Breakfast

10:00am-5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2016!

EXHIBITOR HOURS:
Tuesday, October 25: 10:00am-5:00pm (when not in session)
Wednesday, October 26: 10:00am-5:00pm (when not in session)

Henkel Corporation – PREMIER SPONSOR
Huawei Technologies – CORPORATE SPONSOR
Innovative Research, LLC – SUPPORTING SPONSOR

AkroMetrix, LLC
Celsia Technologies
DS&A, LLC
Dexerials America Corporation
ebullient, LLC
Electronic Cooling Solutions, Inc.
Long Win Science and Technology Corporation
Suzhou Tianmai Thermal Technology Co.,Ltd.
Thermal Engineering Associates, Inc.


9:00am-10:00am

KEYNOTE PRESENTATION - Avionics Thermal Management 1970 and 2016:
Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment - Revisited

Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment was the title of a research proposal that was submitted by Collins Radio Company to the United States Air Force System Command in November, 1968. This presentation will describe the electronics cooling approaches addressed in that proposal and how technologies used in avionics have progressed over the nearly half-century since it was written. Lessons learned from reflecting on this previous work, combined with reviewing trends in electronics packaging and aerospace systems, will be used to assess what the future looks like for thermal management of avionics. A version of this presentation was given at the 2016 ITHERM conference.

Ross Wilcoxon | Rockwell Collins
Principal Mechanical Engineer


10:00am-10:30am

Coffee Break in the Exhibit Area

Sponsored by:
Premier Sponsor - Huawei


SESSION 5

SYSTEM-LEVEL THERMAL DESIGN
Session Chair: Marlin Vogel, Juniper Networks

10:30am-11:00am Thermal Management Solutions for Line-Replaceable Unit in Modern Avionics Applications
Vicentiu Grosu, Teledyne Controls (Chris Lindgren, Tamas Vejsz)
11:00am-11:30am Vapor Chamber and Heat Pipe Heat Sink Design Employed For Cooling of Multiple High-Power Heat Sources Under Varying Operating Conditions
Raul Vargas Gonzalez, Futurewei Technologies (Vadim Gektin, Jaana Behm, Chen Chunyang)
11:30am-12:00pm Active Thermal Management for a Miniature Mass Spectrometer
David Stokes, RTI International (Nick Baldasaro, Jason Amsden)
12:00pm-12:30pm Comparison Leakage Power Effects for Higher Ambient Temperatures of Liquid vs. Air Cooled Servers
WITHDRAWN BY AUTHOR
Manasa Sahini, University of Texas at Arlington (Ashwin Siddarth Venugopal)

12:30pm-2:00pm

Lunch


SESSION 6

POWER ELECTRONICS
Session Chair: Nader Nikfar, Qualcomm

2:00pm-2:30pm Integrated Thermal Solutions for Radar / EW Systems
Pablo Hidalgo, Thermacore (Mark North, Nelson Gernert)
2:30pm-3:00pm Packaging of Novel Power Electronics
Sumeer Khanna, University of Maryland at College Park (Patrick McCluskey, Bao Yang, Avram Bar-Cohen, Michael Ohadi, Michael Manno)
3:00pm-3:30pm Specialized Metallic TIMs for Non-Flat Surfaces and Burn-in/Test Applications
Ron Hunadi, Indium Corporation (Tim Jensen, Carol Gowans, Bob Jarrett)

3:30pm-4:00pm

Coffee Break in the Exhibit Area

Sponsored by:
Premier Sponsor - Huawei


SESSION 7

LIQUID COOLING ADVANCES
Session Chair: Guy Wagner, Electronic Cooling Solutions

4:00pm-4:30pm 12 Teraflops in a Desktop: Two-phases, Low Temperatures, No Noise
Tim Shedd, Ebullient, Inc. (Robert Morell)
4:30pm-5:00pm Thermal Management of Hotspots Using Liquid Cooled Heterogeneous Pin-Fin Enhanced Microgaps
Yuanchen Hu, Georgia Institute of Technology (Thomas Sarvey, Muhannad Bakir, Yogendra Joshi)
5:00pm-5:30pm Design of an Improved Flow Control Device for Dynamic Cold Plates to have Distributed Cooling in a Water Cooled Multi Chip Module
Kunal Atulkumar Shah, University of Texas at Arlington (Parth Soni, Shivang Desai, Avinash Veluturla, Sruthi Errukula, Mansi Prajapati, Dereje Agonafer)

5:30pm-7:00pm

Dinner:
THE LOS GATOS BAR AND GRILL
The Los Gatos Bar & Grill is a two block walk away from the hotel on the main strip in Los Gatos. Attendees will walk over together and walk back in time for the evening session.

Sponsored by:
Premier Sponsor - Henkel Bergquist


SESSION 8

STACKED DIE PACKAGING
Session Chair: Kamal Mostafavi, CoolIt Systems Calgary

7:00pm-7:30pm Low-Cost Implementation of Application-Oriented TIM Measurement System
Bernie Siegal, Thermal Engineering Associates, Inc.
7:30pm-8:00pm Diamond Heat-Spreaders: Metallization, Shaping and Integration
Firooz Faili, Element Six Technologies, USA (Russell Mason, Thomas Obeloer and Daniel Twitchen)
8:00pm-8:30pm Thermally Resistant Die Attach for Harsh Environment Applications
Seyed Amir Paknejad, King’s College London

 

 

 

 


THURSDAY, OCTOBER 27


7:00am-5:00pm Registration Open

8:00am-9:00am Continental Breakfast

9:00am-10:00am

KEYNOTE PRESENTATION - Thermal Ground Planes:
Past, Present, Future for Flexible Ground Planes

A flexible thermal ground plane is designed and manufactured using printed circuit board (PCB) technologies. Different flexible TGPs demonstrated will be reviewed with an emphasis on the world's thinnest vapor chamber that is only 0.25 mm thick. Unique features and challenges of this thin and flexible TGP will be discussed.

Future flexible TGPs will be illustrated using an all polymer TGP as an example. The enabling technology for such a TGP is roll-roll atomic layer/molecular deposition (ALD/MLD). How thin can future flexible TGPs reach? Is it 100 um or even thinner? A theoretical analysis will be presented to gain an insight into this opportunity.

Y,C. Lee | University of Colorado
Professor, Mechanical Engineering


10:00am-11:00am

Coffee Break Sponsored by:
Premier Sponsor - Huawei


SESSION 9

INTERACTIVE POSTER SESSION & Coffee Break in Foyer
Session Chair: George Meyer, Celsia Technologies

10:00am-11:00am



All presentations will take place during this 1-hour session. There are not scheduled start/end times but more interactive presentations and open times for question & answer

Poster Sessions & Student Support Sponsored by:
Poster Sponsor - Future Facilities

 

Development and Application of Copper-Graphite Composite Thermal Control Cores for High-Reliability PCBs for GaN RF System
Dave Saums, DS&A LLC (Robert Hay, Parker Hannifin)

Optimization of Heat Sinks, Server Orientations and Channels to Decrease the Junction Temperature for Oil-Immersed Servers
Kunal Atulkumar Shah, University of Texas at Arlington (Supan Shah, Dereje Agonafer)

Optimization of Water and Energy Usage for Indirect Evaporative Cooling System Using CFD Techniques
Mansi Prajapati, University of Texas at Arlington (Dereje Agonafer, Sidhharth Ashwin Venugopal, Shivang Desai, Parth Soni)

Computational Study of the impact of Thermal Shadowing in Non- Directed Flow for Air & Oil Cooled Servers
Chinmay Bhatt, University of Texas at Arlington (Tejas Bhongale, Anirudha Doifode, Jimil Shah, Dereje Agonafer)

An Approach to Develop a Control System for Data Center Cooling
Varun Rahul, University of Texas at Arlington (Anay Darekar; Dereje Agonafer; Ashwin Venugopal Siddarth, Sagar Patil)


SESSION 10

THERMAL INTERFACE MATERIALS II
Session Chair: Ross Wilcoxon, Rockwell Collins, Inc.

11:00am-11:30am Metal Enhanced Thermal Gap Filler Investigation
Ross Wilcoxon, Rockwell Collins
11:30am-12:00pm Tin-Carbon Nanotube Composites as Tin Based Solder Replacements
Daron Spence, Georgia Institute of Technology (Craig Green, Baratunde Cola)
12:00pm-12:30pm High Reliability of Advanced Thermal Interface Materials with Carbon Nanotubes
Daiyu Kondo, Fujitsu Laboratories Ltd.
12:30pm-1:00pm Improved Heat Dissipation for High Power LED Systems Via a Nanocopper-based Metal SMT
Alfred Zinn, Lockheed Martin Space Systems Company (Randy Stoltenberg, Jerome Chang, Yuan-Ling Tseng)

1:00pm-2:00pm

Lunch


SESSION 11

HANDHELD/WEARABLE/IMPLANTABLE DEVICES II
Session Chair: Bill Maltz, Electronic Cooling Solutions

2:00pm-2:30pm Determination of Best Method for Conducting Heat: Heat Pipe vs. Solid High-Conductivity Rod
Guy Wagner, Electronic Cooling Solutions Inc.
2:30pm-3:00pm Phase Change Material Based Thermal Management for Li-Ion Batteries
Yuan Zhao, Henkel Electronics Materials (Junhua Wu, Dan Maslyk, Chris Angus, Sanjay Misra)
3:00pm-3:30pm Design and Testing of an Implantable Thermoelectric Device for Focal Brain Cooling
David Stokes, RTI International (Paul Crocco, Yong Jiang, Dennis Spencer, Hitten Zaveri)

3:30pm-4:00pm

Coffee Break in the Exhibit Area

Sponsored by:
Premier Sponsor - Huawei


SESSION 12

HANDHELD/WEARABLE/IMPLANTABLE DEVICES III
Session Chair: Bill Maltz, Electronic Cooling Solutions

4:00pm-4:30pm Liquid Cooling for 3D-IC with Wave Microchannel
Dan Dan Ma, Beijing University of Technology (Guo Dong Xia)
4:30pm-5:00pm Handheld Mobile Device Cooling Design and Control
Mark Carbone, Intel Corp.
5:00pm-5:30pm Power Dissipation Limits for Tablet Cooling
Guy Wagner, Electronic Cooling Solutions Inc.

5:30pm CLOSING REMARKS

 

Supporting Sponsor:
Sponsor - Innovative Research LLC

 

 


Speaker Dates/Information:

  • Abstract Deadline extended: AUGUST 12, 2016
  • Speaker Notification: September 19, 2016
  • Early Registration & Hotel Deadlines: September 23, 2016
  • 2-3 Sentence BIO Due: October 15, 2016
  • Powerpoint/Presentation file for DOWNLOAD due not later than: October 27, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: September 23, 2016)

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 25, 2016. No refunds will be issued after that date.

Type
Early Fee
Through 9/23/2016
Advance/Onsite Fee
After 9/23/2016
IMAPS Member
$750
$850
Non-Member
$875
$975
Speaker
$525
$625
Chair
$525
$625
Chapter Officer
$525
$625
Student
$300
$400
Exhibits Guest Pass - NO MEALS & NO SESSIONS
Complimentary
Complimentary
Tabletop Exhibit Booth - IMAPS Members
$575
$750
Tabletop Exhibit Booth - Non-Members
$675
$850

 

 


Hotel Information -- Hotel Reservation Deadline Extended to: September 30, 2016

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.

 


 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems