Honeywell

Advanced Technology Workshop and Tabletop Exhibit on
Thermal Management

Toll House
Los Gatos, California - USA
November 6-8, 2018

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Futurewei Technologies
atwprogramchair@gmail.com
Tel: 408-330-5352

Program Committee:

Bill Maltz, President, Electronic Cooling Solutions, Inc.
Kamal Mostafavi, CoolIT Systems
Nader Nikfar, Principal Thermal Engineer, Qualcomm, Inc.
John Peeples, Professor and Chair, Electrical and Computer Engineering, The Citadel
Emil Rahim, Senior Thermal Engineer, Google Inc.
Tejas Shah, Senior Thermal Engineer, nVidia Corporation
Guy Wagner, Director, Electronic Cooling Solutions, Inc.
Ross Wilcoxon, Principal Mechanical Engineer, Advanced Technology Center, Rockwell Collins, Inc.

 


Thank you to our Corporate Sponsors:

Corporate Sponsor - Indium

Corporate Sponsor - Microsoft

 

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge. Beginning in 1992, this Workshop is one of the most successful of the IMAPS ATWs that are held each year on a variety of technical topics.

 


  TUESDAY, NOVEMBER 6

7:00am-
8:00pm
Registration Open

8:00am-
8:45am
Continental Breakfast

10:00am-
5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2018!

A.L.M.T. Corp.
Celsia Inc.
Dynatron Corporation
Future Facilities
Henkel Electronics Materials
Indium Corporation
Long Win Science & Technology Corp.
Polyonics
T-Global Technology
Thermal Engineering Associates, Inc.
W.L. Gore

 

EXHIBITOR HOURS:
Tuesday, November 6:
10:00am-5:00pm (when not in session)

Wednesday, November 7:
10:00am-4:00pm (when not in session)

 

Installation Hours:
Tuesday, November 6 - Morning/Before 10am


8:45am-
9:00am
Welcome & Opening Remarks:
Dave Saums, DS&A LLC (General Chair) &
Vadim Gektin, Futurewei Technologies (Program Chair)

9:00am-
10:00am

KEYNOTE PRESENTATION:
Controlled Enhancement of Two-Phase and Air-Side Heat Transfer

Ari Glezer, Georgia Institute of Technology

In recent years, novel approaches to enhancement of both two-phase (boiling and/or condensation) and air-side heat transfer that have been inspired by modern active and passive flow control technologies have been developed at Georgia Tech and have shown significant performance improvements in a range of controlled experiments. Two-phase heat transfer involving boiling and condensation in a liquid pool (in the presence and absence of forced convection) is prevalent in high-density electronics because of its potential to enable high heat fluxes in relatively small volumes and using relatively simple hardware. However, coupling to the system-level heat transfer of this attractive heat transfer approach is hampered by the dynamics of both vapor formation and condensation. Vapor formation is restricted by the critical heat flux (CHF) limit on the maximum heat transfer during vapor formation owing to the dynamics of the vapor bubbles that form on the heated surface, while vapor condensation is normally limited by the subcooled temperature of the embedding fluid and the diffusion-convection heat transfer at the liquid vapor interface vapor bubbles. The investigations at Georgia Tech have shown substantial two-phase heat transfer enhancement by independent control and regulation of vapor formation, and by augmenting vapor condensation using lowpower acoustic actuation of the liquid-gas interface. It is shown that acoustic actuation greatly extends the critical heat flux limit and provides for control of vapor bubble generation rate and advection, and independently can accelerate the rate of direct contact vapor condensation. Both approaches enable reduction in the required volume of subcooled liquid, as well as the overall system dimensions. Heat transport by air convection (forced or natural) from heated surface (e.g., air cooled heat exchangers) is typically limited by the heat transfer coefficient and mixing with the air stream especially. In most cases, these systems operate at low Reynolds numbers to minimize flow losses and cooling power at the cost of nearly-laminar, and therefore less effective, heat transfer. The investigations at Georgia Tech have demonstrated that heat transfer at the surface and in the bulk stream can be radically enhanced by deliberate formation and advection of small-scale flow motions by harnessing mechanical energy from the embedding flow to drive aeroelastic flutter of simple self-oscillating reeds. Such small-scale heat transfer enhancement by passive reeds was demonstrated in air-cooled heated ducts at with significant heat transfer enhancement and only a slight increase in the channel pressure drop. A unique element of this approach is the reeds which are cantilevered across the span of the rectangular channels harness mechanical energy from the passage of the cooling air flow to drive the aeroelastically induced flutter and significantly increase the local heat transfer coefficient and mixing with the global flow, both of which effects contribute to significantly enhanced overall heat transfer performance.


10:00am-
10:30am

Coffee Break in the Exhibit Area

Sponsored by:

Corporate Sponsor - Indium

 


SESSION 1

TWO-PHASE COOLING
Session Chair: Emil Rahim, Google Inc.

10:30am-
11:00am
Embeddable Heat Transfer Devices based on Self-Organizing Thermodynamic Complex System and Artificial Intelligence Algorithm
Peng Cheng, Coolanyp L.L.C.
11:00am-
11:30am
Out-of-plane bends' effect on the thermal performance of flat plate oscillating heat pipe
Joe Boswell, ThermAvant Technologies, LLC (Dr. Corey Wilson, Daniel Pounds, Dr. Bruce L. Drolen)
11:30am-
12:00pm

**STUDENT COMPETITION WINNER**

Computational Modeling And Experimental Validation Of Single Phase And Boiling Flows In Microgap Cooling Layers
Daniel Lorenzini, Georgia Institute of Technology (Yogendra Joshi)

12:00pm-
12:30pm
Comprehensive numerical analysis of an impinging cold-plate using 6SigmaET
Kourosh Nemati, Future Facilities (Yaser Hadad, Ananth Sridhar)

12:30pm-
1:30pm

Lunch

Sponsored by:

Corporate Sponsor - Indium

 


SESSION 2

HIGH CONDUCTIVITY MATERIALS
Session Chair: Bill Maltz, Electronic Cooling Solutions, Inc.

1:30pm-
2:00pm
High Temperature Reliability of Thermal Interface Materials
Tom Rogers, Polyonics (Robert Guyette)
2:00pm-
2:30pm
Improved z-axis thermal conductivity of TIM-materials by
active particle alignment

Henrik Hemmen, CondAlign (Marie-Audrey Raux, and
Linn Cecilie Sørvik)
2:30pm-
3:00pm
Practical Evaluation of Thermally-Conductive Plastics for Thermal Component Design
Guy R. Wagner, Electronic Cooling Solutions Inc. (David Saums)
3:00pm-
3:30pm
A Thermal Model Profiling Temperature of High Power Density ASIC Device Mounted on Multi-layered Diamond Enhanced Heat Spreader
Firooz Faili, Element Six Technologies, USA (Thomas Obeloer, Alex Muhr, Daniel Twitchen)

3:30pm-
4:00pm

Coffee Break in the Exhibit Area

Sponsored by:

Break Sponsor - Dexerials


SESSION 3

PACKAGE COOLING
Session Chair: Guy Wagner, Electronic Cooling Solutions, Inc.

4:00pm-
4:30pm
Software framework for rapid design of multi-chip modules
Isaac Ehrenberg, Draper
4:30pm-
5:00pm
CCGA Braided Copper Compliant Solder Columns - High Thermal Conductivity Interconnect Transfers Heat and Absorbs Stress Caused by CTE Mismatch Between Large Area Array IC Package and PC Board
Matthew Wyatt Pearson, TopLine (Martin Hart)
5:00pm-
5:30pm
Thermal and electrical impact of printed metals for electrical interconnect
Daniela Torres, Draper (Brian R. Smith, Vinh Nguyen)

5:30pm-
7:00pm

Welcome Reception

Sponsored by:

Corporate Sponsor - Indium

 


 

 

 

 


WEDNESDAY, NOVEMBER 7


7:00am-
8:00pm
Registration Open

8:00am-
9:00am
Continental Breakfast

10:00am-
5:00pm

Exhibits Open -- – Be sure to visit these companies in the foyer during your time at Thermal 2018!

A.L.M.T. Corp.
Celsia Inc.
Dynatron Corporation
Future Facilities
Henkel Electronics Materials
Indium Corporation
Long Win Science & Technology Corp.
Polyonics
T-Global Technology
Thermal Engineering Associates, Inc.
W.L. Gore

 

EXHIBITOR HOURS:
Tuesday, November 6:
10:00am-5:00pm (when not in session)

Wednesday, November 7:
10:00am-4:00pm (when not in session)

 

Installation Hours:
Tuesday, November 6 - Morning/Before 10am

 


 

9:00am-
10:00am

KEYNOTE PRESENTATION:
Liquid Cooling Challenges in HPC World

Geoff Lyon, CoolIT

Demand for utilizing liquid cooling in data centers has been raised significantly as a result of increases in the power density of the chip, server and rack levels. However multi-dimensional implications of this change in power density presents new challenges for liquid cooling designs. At the chip level, advances in chip packaging mandates innovation on the liquid cooled coldplates to be able to efficiently absorb heat from high power chips within smaller die sizes. Consequently, the power density at server level will be increased and then compounded by server manufacturers increasing the number of those processors per server. Additionally, other contributors to the server solution complexity are increasing demands for cooling other lower heat components in the server like voltage regulation, memory and fabric components. Recent growth in the areas of Artificial Intelligence (AI), data mining, machine learning, and self-driving cars are driving the demand for these HPC solutions which will require practical approaches in order to enable the continued trend of higher density at the chip, server and rack levels. In this presentation, several examples of these types of solutions will be presented and some commentary will be provided on emerging trends in the field.


10:00am-

10:30am

Coffee Break in the Exhibit Area

Sponsored by:

Corporate Sponsor - Microsoft

 


SESSION 4

LIQUID & SYSTEM-LEVEL COOLING
Session Chair: Ross Wilcoxon, Rockwell Collins, Inc.

10:30am-
11:00am
Performance of Single Phase Liquid Cold Plates for High Power MOSFETs
Stephan Fatschel, MKS Instruments (Dave Coffta, Alex Rozanov)
11:00am-
11:30am
Innovation, the Hype Cycle, and Liquid Metal Cooling; Part 1: The Hype Cycle in Electronics Cooling Innovations
Ross Wilcoxon, Rockwell Collins, Inc.
11:30am-
12:00pm
Innovation, the Hype Cycle, and Liquid Metal Cooling; Part 2: The Hype Cycle of Liquid Metal Cooling
Ross Wilcoxon, Rockwell Collins, Inc.
12:00pm-
12:30pm
Tear Down and Evaluation of a Wireless Home Router
Justin Dixon, Electronic Cooling Solutions, Inc.

12:30pm-
2:00pm

Lunch

Sponsored by:

Corporate Sponsor - Microsoft

 


SESSION 5

SYSTEM-LEVEL COOLING
Session Chair: Nader Nikfar, Qualcomm, Inc.

2:00pm-
2:30pm
Experimental Studies of Electronics Cooling Capabilities at High Altitude
Hedy H.Y. Jhang, Long Win Science and Technology Corporation (Joseph F.S. Lee, Larry S.H. Lee, John C.H. Lee, Govz C.C. Lee)
2:30pm-
3:00pm
Computational Fluid Dynamics in Drone Design
Guy R. Wagner, Electronic Cooling Solutions Inc.
3:00pm-
3:30pm
The Necessity for Thermal-Electrical Multiphysics for Board Heating in a Server
Jared Harvest, ANSYS, Inc. (Satyajeet Padhi, Wade Smith)

3:30pm-
4:00pm

Coffee Break in the Exhibit Area


SESSION 6

THERMAL MODELING AND ANALYSIS
Session Chair: Vadim Gektin, Futurewei Technologies

4:00pm-
4:30pm
Comparison of Advanced Thermal Solutions for Laminate Designs
Eric Eilenberg, Macom Technology (Jessica Aldrich, Abimael Reyes, Paul Hogan)
4:30pm-
5:00pm
Reduced Order Thermal Finite Element Models Using Modal Reduction
Bernard Antkowiak, Draper
5:00pm-
5:30pm
Dielectric vs thermal conductivity index
Enrico Brega, BLV Licht GmbH

5:30pm-
7:00pm

Dinner Break in Los Gatos, Independently, on Attendees' Schedules


SESSION 7

EVENING SESSION: DATA CENTER THERMAL MANAGEMENT
Session Chair: Dave Saums, DS&A LLC

7:00pm-
7:30pm

**STUDENT COMPETITION WINNER**

Methodology to develop Neural Network models for predictive cooling of data centers
Vibin Shalom Simon, University of Texas Arlington (A. Walekar, A. Siddarth, D. Agonafer, University of Texas at Arlington; A. Guhe, Mestex Inc.)

7:30pm-
8:00pm

**STUDENT COMPETITION WINNER**

Life Estimation of Wet Cooling MEdia in Evaporative Cooling Applications
Shriya Prasad Joshi, University of Texas Arlington (H. Dakshinamurthy, A. Siddarth, D. Agonafer, University of Texas at Arlington; A. Guhe, J. Hoverson, Mestex Inc.)

8:00pm-
8:30pm
Thermal Destratification Of Air Streams To Improve The Cooling Provisioning Of Air-Cooled Data Centers
A. Barigala Charles Paulraj, University of Texas Arlington (P. Kaulgud, A. Siddarth, D. Agonafer)
 

 

 

 

 


THURSDAY, NOVEMBER 8


7:00am-
12:00pm
Registration Open

8:00am-
9:00am
Continental Breakfast

9:00am-
10:00am

KEYNOTE PRESENTATION:
Making Room for Innovation

Andy Delano, Microsoft

In this presentation I will talk about Surface Pro's revolutionary cooling system as a case study to highlight the techniques I utilize to innovate. In brief it is up to the individual to make room in their day for innovation by effectively managing time within their overall organization. But it doesn’t stop there, the time made for innovation must now be utilized to manifest game changing contributions from an unlimited sea of ideas. The effective innovator balances linear thinking with the non-linear creative process, and I will describe my approach. Abstract: This presentation will discuss the thermal design of the Pro product line as a case study to highlight the techniques utilized to make room for innovation. In brief it is up to the individual engineer to make room in their day to innovate by finding an effective balance between meeting the near term technical requirements of a specific program while also managing one's overall time within the organization.


10:00am-
10:30am

Coffee Break

 

SESSION 8

MOBILE & HANDHELD DEVICES' COOLING
Session Chair: Tejas Shah, nVidia Corporation

10:30am-
11:00am
Power management and thermal considerations used on Lights L16 computational imaging camera
Juan L Cruz, Light Labs Inc.
11:00am-
11:30am
Thermal Modeling of Devices Contacting the Skin
Guy R. Wagner, Electronic Cooling Solutions Inc. (Justin Dixon)
11:30am-
12:00pm

**STUDENT COMPETITION WINNER**

New Challenge after the 0.15mm Vapor Chamber: Foldable Vapor Chamber
Ali Nematollahisarvestani, University of Colorado Boulder (Ryan John Lewis, Yung-Cheng (YC) Lee)

12:00pm-
12:30pm
Case Study: Anomalous Behavior of Mobile Heat Pipes in Low Power and Low Ambient Conditions
Erin Hurbi, Microsoft

12:30pm-
2:00pm

Lunch

Sponsored by:


SESSION 9

MATERIALS' CHARACTERIZATION
Session Chair: John Peeples, The Citadel

2:00pm-
2:30pm
Design of Thermal Diffusivity Measurement of the Material
Wei-Keng Lin, T-Global Technology(Ming-Hsien Hsiao, Wen-Hua Zhang, Pei-Hsun Wu, Ching-Huang Tsai)
2:30pm-
3:00pm
Automated Discovery of Negative CTE Microstructures
Isaac Ehrenberg, Draper
3:00pm-
3:30pm
Addressing Challenging Mechanical Reliability Requirements for Thermal Interface Materials Developed for Semiconductor Test/Burn-in Applications
Dave Saums, DS&A LLC (Tim Jensen, Ron Hunadi, Carol Gowans, Mohamad Abo Ras)

3:30pm-
4:00pm

Coffee Break


SESSION 10

FUTURE TRENDS
Session Chair: Ross Wilcoxon, Rockwell Collins, Inc.

4:00pm-
4:30pm
Energy 2050, A Call for Macro-Scale Thermal Managers
John W. Peeples, PhD, P.E., The Citadel, the Military College of South Carolina
4:30pm-
5:00pm
Transportation Energy Consumption, No Easy Answer
John W. Peeples, PhD, P.E., The Citadel, the Military College of South Carolina
5:00pm-
5:30pm
Power Electronics Directions: Implications for Thermal Management Developments
Dave Saums, DS&A LLC

5:30pm CLOSING REMARKS

 



Engineering and Science University Student Abstract Competition:

Each year since 2004, the IMAPS ATW Thermal has included a competition for engineering and science university student abstracts. This portion of the program has been very well received by Workshop attendees and a number of past winners have returned to participate in the Workshop program again. This competition is open to both undergraduate and graduate engineering and science students. Stipends are provided to each winning author (one stipend per winning presentation, even when there are multiple co-authors) and can be used for travel expense coverage or as the author may otherwise choose.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Authors must be currently enrolled in either an undergraduate or graduate program. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. Only those abstract marked as being submitted as student abstracts will be considered for this competition. The organizing committee will evaluate student abstracts submitted and award between $500 and $1000 stipend per award. The winning authors must attend the event and present the winning topics in order to receive the stipend award.

The Microelectronics Foundation

Speaker Dates/Information:

  • Abstract Deadline Extended To: SEPTEMBER 7, 2018
  • Speaker Notification: September 15, 2018
  • Early Registration Deadline: October 24, 2018
  • Powerpoint/Presentation file for DOWNLOAD due not later than: November 8, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: October 24, 2018)

Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, any receptions, dinners and lunches. Also includes one Download of the post-workshop presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration.All prices below are subject to change.

Cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before October 1, 2017. No refunds will be issued after that date.

Type
Early Fee
Through 10/1/2018
Advance/Onsite Fee
After 10/1/2018
IMAPS Member
$775
$875
Non-Member
$875
$975
Speaker
$550
$650
Chair
$550
$650
Chapter Officer
$550
$650
Student
$300
$400
Exhibits Guest Pass - NO MEALS & NO SESSIONS
Complimentary
Complimentary
Tabletop Exhibit Booth - IMAPS Members
$775
$875
Tabletop Exhibit Booth - Non-Members
$875
$975
PREMIER Sponsor
$6500
$6500
CORPORATE Sponsor
$4500
$4500

 

 


Exhibit Information:

Limited to 11 Tabletops this year - NOW SOLD OUT

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems. This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. A tabletop exhibition has been a part of this workshop since 2008.

Exhibits Open When Session "off" / During Breaks
Be sure to visit the companies in the foyer during your time at Thermal 2018!

A.L.M.T. Corp.
Celsia Inc.
Dynatron Corporation
Future Facilities
Henkel Electronics Materials
Indium Corporation
Long Win Science & Technology Corp.
Polyonics
T-Global Technology
Thermal Engineering Associates, Inc.
W.L. Gore

EXHIBITOR HOURS:
Tuesday, November 6:
10:00am-5:00pm (when not in session)

Wednesday, November 7:
10:00am-4:00pm (when not in session)

Full exhibit hours/details once the program is published

Installation Hours:
Tuesday, November 6 - Morning/Before 10am

 


Hotel Information

Toll House
140 S. Santa Cruz Ave,
Los Gatos, CA 95030 - USA

 

TAXI from SJC airport is a reasonable proposition. The hotel is about eight miles from SJC. The quoted fares are $34-42, each way, for a taxi.

Parking instructions: if you check-in to the hotel and are staying over night, you will receive a parking pass from the front desk. If you are not staying, you can also stop at the front desk and mention that you are with IMAPS group and they will provide you a parking pass to enter the lot/garage. Space is limited at the hotel. There is complimentary street parking and other lots nearby although we believe there is a two-hour limit at these spots.


 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems