Advanced
Technology Workshop and Tabletop Exhibition on
Thermal Management
Student
Competition
DEADLINE
FOR ABSTRACTS EXTENDED: August 22, 2008
The Cabaña Hotel & Resort (A Crowne Plaza Resort)
Palo Alto, California - USA
October 13 - 16, 2008
General
Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
|
Program
Chair
Vadim Gektin
Sun Microsystems, Inc.
vadim.gektin@sun.com
Tel: 408-276-6580
|
Submit
Student Competition Abstract
Hotel Reservations (Deadline September 15th)
The 2008 Advanced Technology Workshop on Thermal Management is offering a limited number of stipends for university students. Stipend funding is provided by Celsia Technologies, DS&A LLC, Electronics Cooling Solutions, Hewlett-Packard Laboratories, IMAPS, Sun Microsystems, Inc., and The Microelectronics Foundation. The stipends will be in the form of a cash grant to be used towards the cost associated with attending the workshop. The amount of the grant will depend upon the number of winning submissions chosen by the ATW organizing committee, but will not be less than $600 per student. Applicants must be pursuing a college degree (B.S., M.S., or Ph.D.) in Science or Engineering. To compete for the stipend, candidates should submit an extended abstract with references of no more than five (5) pages on a topic of relevance to workshop attendees. Topics of relevance follow the paper solicitation topics for the workshop and are shown below. Winning submissions will be required to present their research at the workshop in October 2008.
A two-paragraph summary abstract must be submitted to: IMAPS abstract webpage at www.imaps.org/abstracts.htm.
A maximum of six pages of extended abstract must be submitted to the General and Program Chairs; their e-mail addresses are above.
DEADLINE
FOR ABSTRACT SUBMISSION TO COMPETITION:
August 22, 2008
TECHNICAL SESSION TOPICS:
High Conductivity, Low Expansion Materials
Liquid and Phase-Change Cooling
Telecommunications Systems
Thermal Interface Materials
Consumer Electronics
Refrigeration Cooling
Data Center Cooling
Computing Systems
Market Drivers
ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:
- Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
- Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing. Metallic, metal matrix and polymer matrix materials.
- High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
- Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
- Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
- Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
- System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
- Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.
- Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
- Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
- Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than August 22, 2008. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.
Abstracts must be submitted online at http://www.imaps.org/abstracts.htm.
Questions: contact Jackki Morris-Joyner with questions: jmorris@imaps.org or 305-382-8433. You may also contact the workshop chairs.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
DEADLINE
FOR ABSTRACT SUBMISSION TO COMPETITION:
August 22, 2008
Submit Abstract(s)
Hotel Information -- Cut off: Monday Sept. 15, 2008
The Cabana Hotel Palo Alto – A Crowne Plaza Resort
4290 El Camino Real
Palo Alto, CA 94306
Rate: Single/Double $190
Phone Reservations: (800) 593-5447, mention International Microelectronics and Packaging Society
Online Reservations – www.cppaloalto.crowneplaza.com Group Code – IMA
