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Advanced Technology Workshop and Tabletop Exhibition on
Thermal Management

Student Competition
Abstract Deadline: July 24, 2009

Dinah's Garden Hotel
Palo Alto, California - USA
October 5 - 8, 2009

General Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
Program Chair
Vadim Gektin
Sun Microsystems, Inc.
vadim.gektin@sun.com
Tel: 408-276-6580

Submit Student Competition Abstract | Download Competition PDF
Hotel Reservations (Deadline September 18th)

Electronics Cooling Solutions, Sun Microsystems, Inc., DS&A LLC, and The Microelectronics Foundation are offering a limited number of stipends for university students to the 2009 Advanced Technology Workshop on Thermal Management. The stipends will be in the form of a cash grant to be used towards the cost associated with attending the workshop. The amount of the grant will depend upon the number of winning submissions chosen by the ATW organizing committee, but will not be less than $600 per student. Applicants must be pursuing a college degree (B.S., M.S., or Ph.D.) in Science or Engineering. To compete for the stipend, candidate should submit an extended abstract with references of no more than five (5) pages on a topic of relevance to workshop attendees. Topics of relevance follow the paper solicitation topics for the workshop and are shown below. Winning submissions will be required to present their research at the workshop in October 2009.

A two-paragraph summary abstract must be submitted to: IMAPS abstract webpage at www.imaps.org/abstracts.htm.

A maximum of six pages of extended abstract must be submitted to the General and Program Chairs; their e-mail addresses are above.

 

DEADLINE FOR ABSTRACT SUBMISSION TO COMPETITION:
July 24, 2009

TECHNICAL SESSION TOPICS:
Market Drivers
Thermal Analysis and Modeling
Thermal Interface Materials and Testing
High Conductivity Materials
Liquid, Phase-Change, and Refrigeration Cooling
System Cooling
Data Center Cooling
Military and Aerospace Apps
Telecommunications and Consumer Electronics

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
  • Thermal Analysis and Modeling: Tools for thermal analysis, practical techniques for thermal modeling and empirical work, and case studies of difficult thermal design problems with proposed and final solutions.
  • Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing.  Metallic, polymer matrix, CNT, thermal adhesives, and other materials.
  • High Conductivity Materials: Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
  • Liquid, Phase-Change, and Refrigeration Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.        
  • Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
  • Telecommunications and Consumer Electronics: Component- and system-level thermal solutions for telcom, consumer, handheld, display, router, and similar systems.

PREPARATION OF ABSTRACT:

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 24, 2009. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 4, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted online at http://www.imaps.org/abstracts.htm.

Questions: contact Jackki Morris-Joyner with questions: jmorris@imaps.org or 305-382-8433. You may also contact the workshop chairs.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

DEADLINE FOR ABSTRACT SUBMISSION TO COMPETITION:
July 24, 2009

Submit Abstract(s)


Hotel Information --Cut off: September 18, 2009

Dinah’s Garden Hotel
4261 El Camino Real
Palo Alto, CA 94306

Room Rate: $120 per night plus tax (Single/Double)

Call: 1-800-227-8220 or Local: 1-650-493-2844, ask for “IMAPS October Meeting”
www.dinahshotel.com

 


Student Stipend Funding provided by:

Electronic Cooling Solutions, Inc.

Sun Microsystems

DS&A


The Microelectronics Foundation


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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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