KESTER

Advanced Technology Workshop on
Electronic Packaging for Wearable Electronics

Doubletree Suites by Hilton Austin
Austin, Texas - USA
June 15-16, 2015


General Chair:
Greg Caswell
DfR Solutions
General Co-Chair:
Jan Vardaman
Techsearch International
Committee:
Susie Johansson, Starkey Hearing Technologies
Voya Markovich, Consultant
Ted Tessier, Flip Chip International



Thank You to the Wearables Workshop Sponsors:

Dinner/Workshop Sponsor:

Dinner & Event Sponsor: ASE US, Inc.

Supporting Sponsor:

Supporting Sponsor: TechSearch International

 

We tend to be fascinated by the newest technologies to come along in the various electronics markets. The wearables market is no different. We are enamored by the futuristic outfits in Tron to the latest high tech fashion-Google glass. What are the requirements of a typical wearable electronics device? They must be non-restrictive, portable, always be accessible, easily controllable, and have both localized communication and possibly wireless communications capabilities. The various applications must be able to withstand rain, sand and dust, thermal shock, solar radiation (UV exposure), icing, high and low temperatures, fungus growth, water immersion, mechanical shock and electromagnetic (EMC) compatibility. Electronic packaging is the heart of these applications and potential issues. This workshop will address matrials, packaging approaches, applications from commercial to medical, the various environments and what this new market segment needs to do to be successful.

 

Monday, June 15

Registration Open: 8:00 am - 5:45 pm

Continental Breakfast & Coffee: 8:30 am - 9:00 am

Introduction and Greetings: Presenting the Issues: 9:00 - 9:15 am
Jan Vardaman, President of TechSearch International, Inc.

State of the art in SiP packaging for Wearables
9:15-9:45am -- Dick James, Chipworks

The Tip of the Iceberg: The Opportunity for Smart Textiles
9:45-10:15am -- Nicholas Langston, TE Connectivity (PRESENTED REMOTELY)

Textile Systems for eHealth
10:15-10:45am -- Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration (C. Kallmayer)

Morning Break: 10:45 am – 11:00 am

Textile Integration for Wearable Energy Harvesting and ECG
11:00-11:30am -- Ryan Hodges, North Carolina State University (Jesse Jur, Murat Yokus, Amanda Myers)

Low Profile 3D Silicon Substrate Technology for Medical Implants
11:30am-12:00pm -- Catherine Bunel, IPDiA (Franck Murray)

Lunch Break: 12:00 pm - 1:15 pm

Bill Chen, ASE

Keynote Presentation: 1:15pm - 1:45pm
SiP for Wearables

Bill Chen, ASE Group
William Chen (Bill) is an ASE Fellow, and currently holds the position of Senior Technical Advisor at ASE Group. Prior to joining ASE, Bill was Director of the Institute of Materials Research & Engineering (IMRE), located in the National University of Singapore. Previously, Bill spent over thirty three years performing various R&D and management positions at IBM Corporation, where he was elected to the IBM Academy of Technology. He is currently the co-chair of the International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging International Technical Working Group. Bill has been an associate editor of the IEEE/CPMT transactions, and ASME Journal of Electronic Packaging, and has published extensively in the fields of microelectronics packaging and mechanics of materials. He held the position of President of the IEEE Components Packaging and Manufacturing Technology Society (CPMT) from 2006-2009. Bill has been elected a Fellow of IEEE and a Fellow of ASME. In 2011, he was awarded the University Medal from Binghamton University.

Bill held adjunct faculty appointments at Cornell University, Binghamton University, University of Washington, and a visiting faculty appointment at Hong Kong University of Science of Technology. He received his B.Sc. at University of London, M.Sc at Brown University and PhD at Cornell University.

 

Si-Based Capacitors @ 1uF/mm2 Density
1:45-2:15pm -- Khanh Tran, Maxim Integrated (Anu Srivastava, Kiyoko Ikeuchi, Arkadii Samoilov)

Afternoon Break: 2:15 pm – 2:45 pm

Thin Fine Pitch Flex Substrate for Wearable
2:45-3:15pm -- Hiroyuki Okabe, Shindo Electronics Co., Ltd.

Materials for Wearable Devices
3:15-3:45pm -- Hidenori Abe, Hitachi Chemical Co.,Ltd. (Go Yatabe)

Wearable Flexible Hybrid Electronics Monitor for Recording Human Biometrics
3:45-4:15pm -- James Turner, Binghamton University (Kanad Ghose, Zhanpeng Jin, Mohit Garg, Qiong Gui, Steve Czarnecki, Mark Poliks, Binghamton University; Ana Arias,Yasser Khan, U. California at Berkeley; Frank Egitto, Mark Schadt, Paul Hart, Robert Welte, Bill Wilson, i3 Electronics)

Failure Modes of Wearable Electronics
4:15-4:45pm -- Greg Caswell, DfR Solutions (Craig Hillman)

PANEL DISCUSSION - Manufacturing and Reliability: 4:45-5:45 pm
Moderator
: Deborah Patterson, Patterson Group LLC

Panelists:
Greg Caswell, DfR Solutions
Bill Chen, ASE
Dick James, Chipworks
Mark Schaffer, iNEMI

Jan Vardaman, TechSearch International, Inc.

 

BBQ Dinner at the IRONWORKS: 6:30-9:00pm (Downtown Austin)
THANK YOU TO OUR DINNER SPONSOR:

Dinner & Event Sponsor: ASE US, Inc.

 

Day2: Tuesday, June 16
POTENTIAL SOLUTIONS

Registration Open: 8:00 am - 12:45 pm

Continental Breakfast & Coffee: 8:30 am - 9:00 am

Ink Jet Printing as a Tool for Fabrication of Wearable Devices
9:00-9:30am -- Donald Hayes, MicroFab Technologies Inc.

iSTRETCH(R) Cables - Cables in Motion
9:30-10:00am -- Paul Wagner, Minnesota Wire

Chip Packaging for Wearables - Choosing the Lowest Cost Package
10:00-10:30am -- Chet Palesko, SavanSys Solutions LLC (Amy Palesko)

Morning Break: 10:30 am – 10:45 am

Attaching Small Devices Using Aerosol Jet Deposition
10:45-11:15am -- Kurt Christenson, Optomec (David Sessoms, Mike Renn)

New Options in Adhesive Film for Electronic Applications
11:15-11:45am -- Mike Moren, HB Fuller (Doug Lange)

Developments in Safe Energy for Wearable Electronics
11:45am-12:15pm -- Tim Chin, Rechargeable Power Energy North America (Mike Horan)
COMPANY WILL NOT SHOW TO PRESENT WORK

New Battery Developments - TBD
12:15-12:45pm -- SPEAKER TBD

Closing Remarks: 12:45 pm

 

 


Speaker Dates/Information:

  • Abstract Deadline Extended: April 17, 2015
  • Speaker Email Notification: April 24, 2015
  • Early Registration Deadline: May 22, 2015
  • Hotel Cut-off: May 22, 2015
  • Speaker 2-3 sentence biography due not later than: June 10, 2015
  • Powerpoint/Presentation file for CD-Rom due not later than: June 17, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Registration Information: (Early Registration Deadline: May 22, 2015)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 5/22/15
Advance/Onsite Fee
After 5/22/15
IMAPS Member
$600
$700
Non-Member
$700
$800
Speaker
$75
$100
Session Chair
$250
$300
Student
$125
$150
Chapter Officer
$400
$500
Premier Event/Dinner Sponsorship
(includes: 2 attendee registrations, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages, Sponsorship of BBQ Dinner on Day 1)
$2000
$2000

 



Hotel Reservations (Hotel Deadline: May 22, 2015)

Reservations must be made directly with the:

Doubletree Suites by Hilton Austin
303 W. 15th Street
Austin, Texas 78701 - USA

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems