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IMAPS Webinar on
Stud Bumping: Expanding Flip Chip Into New Applications

Presented on Thursday, November 1, 2007
12:00 noon - 12:30 pm EST
Download: $25 IMAPS Members / $50 Non-Members

Sponsored by Kulicke & Soffa Industries, Inc.

Webcast Sponsor - Kulicke & Soffa Industries, Inc.
Kulicke & Soffa Industries Inc.
1005 Virginia Drive
Fort Washington, PA 19034 USA
215-784-6000 | 215-659-7588 (F)
www.kns.com

Program Description

Some years ago, SAW Filter manufacturers needed an interconnect methodology that performed better than the formerly used wedge bonding methodology. They turned to flip chip technology, using wafer level stud bumpers and thermosonic flip chip attach machines.  These first-generation flip chip machines worked well for SAW filters, which, by and large, represented most of the installed base. The technology was also used in a few smaller-scale applications as well as at various labs. 

In 2004/2005, a new generation of flip chip equipment was introduced with more features and greater speed, driving down the customer’s COO (cost of ownership). At the same time, other applications were eyeing flip chip because of its better performance connection - the shorter electrical path resulted in lower resistance and inductance.  Most flip chip applications are still processed using solder bumps or electroplated bumps. In many applications, though, stud bumping is now the most cost effective way to bump a wafer.  The combination of wafer mapping of Known Good Die, better flip chip machines and more options for second level assembly has increased designers’ confidence in using stud bumping. 

Now a few years later, the application base is expanding into a broader range of markets. While SAW Filters still play an important role, CMOS image sensors, high brightness LEDs and RFID tags are among applications continuing to stimulate flip chip popularity. A more broad-based industry adoption of stud bumping is forecast for the future.

Presenter

Vince McTaggart is the Product Marketing Manager for Kulicke and Soffa's Microelectronics group located in Fort Washington, PA.  He has been with K&S for 14 years in various positions.  His present responsibilities as a product manager include the company's stud bumper, large area ball bonder, and wedge bonder product lines.  Prior to joining K&S, Vince was employed at Quad Systems and GE Astro.  Mr. McTaggart holds a bachelor's degree in mechanical engineering from Drexel University, Philadelphia, PA. He can be contacted at vmctaggart@kns.com.

Download


Sponsored by Kulicke & Soffa Industries, Inc.

Webcast Sponsor - Kulicke & Soffa Industries, Inc.
Kulicke & Soffa Industries Inc.
1005 Virginia Drive
Fort Washington, PA 19034 USA
215-784-6000 | 215-659-7588 (F)
www.kns.com




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