IMAPS - Lunch and Learn Series on Addressing Cost and Performance Driven Semiconductor Packaging Challenges through the Supply Chain

How Is the Cost of Packaging Impacting Your Business?
Complimentary insight on how several companies are addressing the costs of microelectronic packaging. Featuring speakers from NanoNexus, Gartner/Dataquest and IBM Systems and Technology Group.

IMAPS Lunch and Learn Series on
Addressing Cost and Performance Driven Semiconductor Packaging
Challenges through the Supply Chain

Thursday, February 21, 2008
12:00 noon - 12:45 pm EST
Registration: Complimentary Registration provided by IMAPS
Registration Deadline: Tuesday, February 19, 2008, at 5:00 pm Eastern

Global Business Council – GBC
www.imaps.org/gbc

Program Description

This virtual meeting will feature three speakers from the upcoming GBC Spring Conference. They will present short programs highlighting their full presentations given during the March GBC meeting.

The agenda for this e-meeting will be:

12:00 pm - 12:05 pm – Introduction
12:05 pm - 12:15 pm – Bill Bottoms, Chief Executive Officer, NanoNexus
The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors
12:15 pm - 12:25 pm – Jim Walker, Vice President Research, Gartner/Dataquest
Packaging the Supply Chain
12:25 pm - 12:35 pm – Scottie Ginn, Vice President of Design Enablement and Packaging,
IBM Systems and Technology Group
Common Platform Alliance for Semiconductor Packaging Technology
12:35 pm - 12:45 pm – Question/Answer and Closing Remarks

This virtual meeting is a teleconference on February 21st to discuss presentation slides that will be made available for download prior to the meeting. You must register in advance to gain access to the presentation slides.

The GBC Spring 2008 Spring Conference Addressing Cost and Performance Driven Semiconductor Packaging Challenges through the Supply Chain will be held in conjunction with the Device Packaging Conference. The GBC Conference will run March 16-17 addressing the following questions:

What are the specific areas where assembly and packing cost needs to be addressed to enable the growth of the industry?
Where are the applications where performance rather than cost is the absolute driver?
What and where are the opportunities within the supply chain to meet these challenges and how many companies benefit from providing solutions?

Register On-line
Registration Deadline: Tuesday, February 19, 2008, at 5:00 pm Eastern