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IMAPS PDC Webinar Series on
Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity

This two-session on-line Professional Development Course (PDC) webinar was held:
Tuesdays, October 13 and 20, 2009

All webinars were held 10:00 am - 11:00 am EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375 (includes one-year complimentary individual membership in IMAPS)

Purchase Webinar Download/Replay

Program Description

Successful and low-cost design of electronic packages and boards requires (in addition to thermal and thermo-mechanical issues), a good understanding of the root causes of signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) issues, as well as methods to analyze, prevent or solve them.

The objective of this course is to provide methods for accurate and efficient electrical modeling, measurement and analysis of packages and PCBs, under consideration of SI, PI and EMI/EMC issues. Techniques for characterizing dielectric materials in dependent on frequency and temperature will also be discussed. Finally, guidelines for optimizing the electrical performance of high-speed packages and PCBs will be provided.

Outline of Sessions:

  • Root causes of SI, PI and EMI/EMC problems, and how they affect system performance.
  • Methods for electrical modeling, simulation and measurement of packaging structures under consideration of SI, PI and EMI/EMC issues.
  • Examples of packaging structures that will be considered include: Transmission lines, layer stack-up with power-ground plane pairs, decoupling capacitors, vias and solder balls.
  • Methods for extracting the relative dielectric constant and loss tangent of dielectric materials in dependent on temperature and frequency.
  • Guidelines for optimizing the electrical performance of high-speed packages and PCBs.

Who Should Attend?

Engineers, scientists, researchers, designers and managers involved in the process of electrical modeling, layouts and/or design of single-chip packages, system packages (e.g., SiPs, SoPs, MCMs), PCBs and their interconnections.


Dr. Ivan Ndip - Ivan Ndip obtained his M.Sc. and Ph.D. with the highest distinction (Summa Cum Laude) in electrical engineering from the Technische Universitaet Berlin, Germany. In 2002, he joined the Fraunhofer-Institute for Reliability and Microintegration (IZM) Berlin as a research engineer and in 2005 he was appointed Group Manager. Since then, he has been responsible for developing and leading research projects at IZM that focus on modeling, simulation, measurement, design and optimization of RF/high-speed packages and PCBs, integrated antennas and passive RF front-end components.

In addition to his research at IZM, Dr. Ndip also teaches graduate courses on Electromagnetic Reliability (EMR) of Microsystems at the Technische Universitaet Berlin.

He has won 4 best paper awards at leading international conferences. He is also a recipient of the Tiburtius-Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin.

Prof. Ege Engin - Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. He received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany in 2004.

Dr. Engin has worked as a research engineer with the Fraunhofer-Institute for Reliability and Microintegration in Berlin, Germany and at Georgia Tech. He is currently an Assistant Professor in the Electrical and Computer Engineering Department of San Diego State University. He has more than 60 publications in the areas of signal and power integrity modeling and simulation and 4 patent applications. He has co-authored the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007.

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