Program Description:

Three leading industry professionals will provide call participants industry insights that may be used to gain a competitive advantage for both product development and marketing.  The call will last about 40 minutes: 10 minutes for each presentation and 10 minutes for questions.

Presenters:

“Summary of a case study on collaboration in development and deployment of next generation high density package-on-package (PoP) technology."
Mr. Lee Smith, Vice President of Business Development
Amkor Technology, Inc.
Lee is an industry expert in 3-D packaging, with nearly 30 years of diverse technology and market development experience. Over the past ten years he held 3-D packaging technology and business development responsibilities at Amkor, Texas Instruments, and Tessera with market emphasis in handsets. Lee is recognized for leading the technology and infrastructure development of the widely adopted package-on-package (PoP) technology. He successfully drove co-development of the supply chain to launch PoP into production, just fifteen months after defining the concept. Lee has been instrumental in the infrastructure development for PoP including: JEDEC standards, SMT stacking, board level reliability and new customer adoption - helping PoP become the fastest growing new package in Amkor’s 40 year history. Lee Smith has authored or co-authored numerous patents, technical papers, and industry publications in advanced and 3-D packaging technologies as well as teaches 3-D packaging workshops at industry conferences.

“Market Demand, Applications and Requirements for 3D Packaging and 3D IC.”
Ms. Jan Vardaman, President
TechSearch International
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987. She is co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. TechSearch International has published two reports on developments in through silicon via technology and has published numerous papers and articles on the topic. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

“Highlights of the ITRS SiP White Paper and the ITRS TSV Roadmap Requirements.”
Mr. W. R. “Bill” Bottoms, CEO
NanoNexus 
W. R.(Bill) Bottoms, Chairman 3MTS received his Ph.D in Physics from Tulane University. In 1981, after serving for several years on the faculty of Princeton University, Dr. Bottoms was named the first President of the newly formed Semiconductor Equipment Group of Varian Associates. Dr. Bottoms was General Partner of Patricof & Co. Ventures Inc., an international venture capital firm, from 1985 until he joined Credence Systems Corporation as its Chairman and CEO in July of 1996. He has participated in the founding of several companies in the semiconductor industry including Credence Systems Corporation and Tessera. Dr. Bottoms has been appointed to a number of government committees and was Chairman of the Technical Advisory Committee to the U.S. Export Control Commission for Semiconductor Equipment and Materials. He has served as Chairman of the National Research Council Board on Assessment of NIST Programs; Co-chair of the Sematech Supplier Roundtable for Assembly and Packaging; Chairman of the iNEMI Packaging Roadmap Committee and Chairman of the ITRS Technical Working Group for assembly and packaging. Dr. Bottoms has served on the Board of Directors of several companies both public and private. He currently is a member of the board of Tulane University and currently serves on the Boards several private corporations.

10-Minute Question and Answer Session

This virtual meeting was a teleconference on February 3 to discuss presentation slides downloadable above.

The GBC is pleased to announce its 2009 Spring Conference on Supply Chain Development for 3D Packaging. The Spring Conference will be held March 8-9, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. Participants can gain industry, management, and technical insight to gain a competitive advantage.  Participants can network in receptions, meals, and golf outing on Sunday, March 8.  To review the agenda of the last GBC Spring Conference, please see http://www.imaps.org/programs/gbc09spring.htm