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IMAPS PDC Webinar Series on
Polymers for Semiconductor Packaging

This three-session on-line Professional Development Course (PDC) webinar was held:
Thursdays, July 9, 16, 23, 2009

All webinars were held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: July 8, 2009


Key Words/Topics

Polymers, thermosets, thermosetting polymers, adhesives, coatings, mold compounds, die attach, mechanical properties of polymers, curing, cure kinetics, epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts, rheology, adhesion

Program Description

These 3 one-hour PDC lectures can be taken in total or separately, but to gain the most benefit it is recommended to attend the whole series in order. Each session is scheduled for 50 minutes of presentation followed by 10 minutes of Questions and Answers. A brief description of each session follows:

Session 1 of 3: Thursday, July 9 -- 12:00-1:00 PM EDT

Overview of Polymers used in Electronic Packaging
This session will provide a broad overview of polymers and the important structure-property-process-performance relationships for electronic packaging.  Topics to be covered:

  • Thermosetting polymers versus thermoplastics
  • Temperature dependence of physical properties
  • Thermosetting polymers; curing, curing mechanisms (heat and light cured), network formation
  • Overview of key chemistries used (epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts) 

Session 2 of 3: Thursday, July 16 -- 12:00-1:00 PM EDT

Polymer-based Materials for Semiconductor Packaging
This session will build on the previous webinar and go into more details for specific applications.  We will cover in more depth the chemistries, material properties, and process considerations for:
  • Adhesives (both paste and film)
  • Capillary Underfills
  • Packaging Substrate Materials
  • Encapsulants (mold compounds) and coatings

Session 3 of 3: Thursday, July 23 -- 12:00-1:00 PM ED

Rheological and Adhesion Requirements for Polymers used in Semiconductor Packaging
This session will provide an introduction to two critical areas governing the performance of polymer-based materials used in packaging semiconductors.  In most cases, adhesives, underfills, mold compounds and coatings are applied as a viscous liquid and then cured.  The flow properties of these materials is critical to performance in high volume manufacturing.  Additionally, the adhesive properties are critical for long-term reliability performance.  This session will cover the basics in:

  • Introduction to the rheological properties of adhesives (shear thinning, viscosity, time dependence, rheology changes during curing)
  • Introduction to rheological characterization methods (various types of rheometers, and basic techniques)
  • Introduction to Adhesion Science
  • Polymer chemistries of typical adhesives, bonding mechanisms

Who Should Attend?

Packaging engineers involved in the development, production, and reliability testing of semiconductor packages would benefit from the series. Those interested in gaining a basic understanding of the role of polymers and polymer-based materials used in electronic packaging will also find this series valuable.

Thomas Green

Presenter

Dr. Jeff Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success directing new product development, leading to multi-million dollar revenues. He has global experience developing new products having established a full function R&D and Applications Engineering lab in Shanghai, China for Ablestik Laboratories. Jeff has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies.

Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to speak at prestigious Gordon Research Conferences (Thermosetting Polymers and Composites). He has presented numerous lectures and short courses at national technical conferences.   Jeff was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993.  He taught Six Sigma Black Belt and Green Belt at California State University at Fullerton from 2001-2006, and teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA. 

Jeff is a member of the Product Development and Management Association (PDMA), American Chemical Society (ACS), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), and the International Microelectronics and Packaging Society (IMAPS).

Jeff has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 7 patents pending. 

Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical Engineering/Materials Science from Marquette University.




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