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IMAPS PDC Webinar Series on
Lead-Free Soldering

This two-session on-line Professional Development Course (PDC) webinar will be held:
Thursdays, June 18 and 25, 2009

All webinars will be held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: June 17, 2009

Register On-line


Key Words

Lead-free solder joint reliability, lead-free backward compatibility, reflow soldering, inter-metallic layer (IMC) thickness, drop testing, CSP, BGA

Program Description

Establishing and improving the reliability of solder interconnections is vital to the $1.3 trillion electronics industry.  Unfortunately, determining the reliability of solder interconnections is one of the most difficult and complicated problems in microelectronics interconnection and packaging. This webinar will present the speaker’s research results on lead-free solder joint reliability.

Session 1 of 2: Thursday, June 18 -- 12:00-1:00 PM EDT

The first part of this webinar will focus on the reliability of lead-free backward compatibility, or soldering lead-free component with tin-lead paste. High-reliability applications such as medical equipment, automotive, aerospace, military equipment, and high-end computers are presently exempted from Europe's Restriction of Hazardous Substances (RoHS), primarily because the reliability of lead-free solder interconnections under extreme environmental conditions is not well understood. These products will continue to be built with conventional tin-lead (SnPb) solder paste. However, some components are not available in SnPb finish because electronics component manufacturers have migrated to total lead-free production. Thus, it is necessary to investigate the reliability of lead-free backward compatibility. This lecture focuses on the BGA/CSP component backward compatibility. The mechanism of SnAgCu BGA/CSP sphere collapse during soldering with SnPb paste will be presented. The liquidus temperature of the mixed compositions, which is the minimum solder joint temperature to achieve a sufficient amount of SnAgCu solder sphere collapse and a complete mixing with SnPb solder paste, will be calculated.  The microstructure and reliability data using SnAgCu BGA/CSP sphere with SnPb paste will be reviewed.  The effect of Pb content in the mixed compositions on solder joint reliability will be discussed as well. An applet developed to calculate mixed alloy composition and its liquidus temperature for various BGA/CSP assemblies will be demonstrated.

Session 2 of 2: Thursday, June 25 -- 12:00-1:00 PM EDT

The second part of this webinar will address two topics: 1) drop impact reliability of edge-bonded lead-free chip scale packages, and 2) the effects of thermal conditioning (reflow profile, thermal shock, and thermal aging) on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints. Detailed drop test reliability data and failure analysis for edge-bonded 0.5 mm pitch lead-free CSPs on a standard JEDEC drop reliability test board will be presented. Experimental results of the thickness growth of IMC layer at different thermal conditions will be discussed.

Who Should Attend?

Engineers, scientists, and managers in R&D, process development, and manufacturing who are involved in lead-free soldering.

Thomas Green

Presenter

Dr. Jianbiao (John) Pan is an associate professor in the Department of Industrial and Manufacturing Engineering at Cal Poly, San Luis Obispo, CA. He received a PhD in Industrial Engineering from Lehigh University, Bethlehem, PA. He worked in the optoelectronics center at Lucent Technologies/Agere Systems as a member of technical staff before joining Cal Poly in 2003. His research interests include the materials, processes, and reliability of microelectronics and optoelectronics packaging, lead-free solder joint reliability, and LED packaging. He has published over 30 technical papers in peer-referred journals and conference proceedings. He has served on the National Technical Committee for IMAPS since 2003. He is a senior member of IEEE, IMAPS, and SME, and a member of ASEE. Dr. Pan is a recipient of the 2004 M. Eugene Merchant Outstanding Young Manufacturing Engineer Award from the Society of Manufacturing Engineers (SME). He is a Highly Commended Winner of the Emerald Literati Network Awards for Excellence 2007. He is also an invitee of the National Academy of Engineering (NAE) Frontiers in Engineering Symposium in 2007.



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