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IMAPS PDC Webinar Series on
4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems

This three-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, June 9, 16 and 23, 2009

All webinars will be held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: June 8, 2009

Register On-line


Key Words/Topics

  • Passive and Active SMT and BTCs
  • Why Conversion to Lead-free Solders is Necessary and its Impact on Materials and Assembly Processes
  • Principles and Practice of Manufacturing Processes such as Reflow, Selective Soldering, Flux and Cleaning and No Clean and Repair
  • Key strategies in Design and Manufacturing processes to prevent field returns

Program Description

There is no doubt that lead free has impacted on almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronics products and equipment including the military and medical industry.

The lead free train has been moving fast, even if you work in a currently exempt industry you need to get onboard or risk losing market share to competitors particularly when the leaded products and components you are using become only available in lead free.

Learn how to resolve issues for an effective implementation of SMT including Bottom Terminations surface mount components such as QFN, DFN and MLF in a lead free world at a lower cost and higher yield. 

Designing for SMT and BTC can involve trial and error and lot of frustration.  Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead Free has compounded the designer’s task. 

The objective of this course is to identify the design and process issues in SMT, BGA, BTCs, fine pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free.

This is not a theoretical course it is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients, this course deals with "real-world" problems in lead free implementation.

Session 1 of 3: Tuesday, June 9 -- 12:00-1:00 PM EDT

  • Passive and Active SMT and BTCs
  • Why Conversion to Lead-free Solders is Necessary and its Impact on Materials and Assembly Processes

Session 2 of 3: Tuesday, June 16 -- 12:00-1:00 PM EDT

  • Design Issues for Lead Free: Laminates for Lead Free, Lead Free Surface Finishes and Component Considerations
  • Principles and Practice of Manufacturing Processes such as Wave, Reflow and Selective Soldering

Session 3 of 3: Tuesday, June 23 -- 12:00-1:00 PM EDT

  • Flux and Cleaning and No Clean and Repair
  • Key strategies in Design and Manufacturing processes to prevent field returns

How You Will Benefit

After completing this course you will be able to:

  • Get an overview of BGA, CSP and emerging technologies such as BTCs (QFN, MLF)
  • Troubleshoot SMT and Lead free problems in manufacturing
  • Determine best way to deal with backward and forward compatibility situations (Lead Free and tin-lead components on the same board).
  • Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment.

Who Should Attend?

Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of design and manufacturing issues in SMT, BTCs (QFN, MLF), fine pitch, and BGA for building assemblies in-house or at a subcontractor will benefit from this course.

Thomas Green

Presenter

Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years.  He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products.  He also developed and taught DFM and SMT manufacturing courses to Intel engineers.  For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove.  He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.   

A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA” and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF . 

He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.   

Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.  

Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA.  He is a registered Professional Metallurgical Engineer.



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