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IMAPS PDC Webinar Series on
Precious Metal Powders/Flakes and their Applications in Microelectronic Packaging

This two-session on-line Professional Development Course (PDC) webinar will be held:
Mondays, June 22 and 29, 2009

All webinars will be held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadline: June 19, 2009

Register On-Line


Program Description

The webinar course covers both fundamental knowledge and practical applications that utilize precious metal powder and flakes, including detailed analytical/characterization skills. Therefore, it is not only suitable for microelectronic packaging engineers and managers, but also system designers who need to be familiar with the basic building blocks of electrical/thermal management technologies. Newcomers may also take it to jump start their careers.

These 2 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 2: Monday, June 22 -- 12:00-1:00 PM EDT

Precious metal powder and flakes with defined parameters and properties.

  • Introduction of precious metal powders and flakes, as basic building blocks in microelectronic packaging applications.
  • Metallic powder and flake materials from chemistry and mechanical routes of fabrication.
  • Surface treatments for deagglomeration/dispersion in different polymer bases.
  • Physical and chemical properties of precious metal powder and flakes: understand their characterization methods and instrumentations.
  • To customize your needs in thermal and electrical packaging applications: what parameters to look for and how to define and specify the precious metal powder/flake materials.

Session 2 of 2: Monday, June 29 -- 12:00-1:00 PM EDT

Precious metal powder and flakes in microelectronic packaging applications.

  • Introduction of technology and consumption trends of precious metal powder and flakes in microelectronic packaging applications.
  • The important material properties in EMI shielding, ceramic interconnect and microelectronic passive component applications.
  • Technology designs of precious metal powder and flakes in electrically and thermally conductive die attach and adhesives applications.
  • Printed conductive inks and thick film paste for low/high fire applications.
  • The expanded role of precious powder and flakes materials in solar cell metallization.

Presenters

Guixiang Yang

Guixiang Yang received his PhD in Aerosol Science and Technology from University of Cincinnati in 1998. He joined DuPont in 1998 as R&D Scientist working on engineering and chemistry technologies to manufacture powder materials. In 2006, he worked for US Air Force Research Lab to investigate magnetodielectric material that is designed as polymer matrix with nano inclusions of high aspect ratio ferromagnetic particles, flakes and nanowires. In 2007, he assumed as R&D Director with Technic, Inc. covering chemistry research lab, analytical chemistry lab, analytical physics lab, SEM research lab and microelectronic packaging lab. Under his leadership, dozens of new products have been developed including series of nano powders and flakes, in addition to core-shell structured composites of different precious metals, base metals and ceramics. His late research interest is new generation of thermal and electric conductive materials for microelectronic packaging applications.

Gary Hemphill

Gary Hemphill received his MS in Metallurgical Engineering from Colorado School of Mines in 1984, He joined Handy and Harman as Research Engineer and started his career researching improved method for refining precious metals. Some of this work lead to novel products such as the first true alloy silver/palladium flake. In 1992 the powders group was acquired by Technic. Gary accepted the position of Production Manager and moved the facility to Rhode Island. In 1994, he was promoted to the General Manager/Vice President position.


Register On-Line


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
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Phone: 202-548-4001