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IMAPS PDC Webinar Series on
Guide to Component Chip Attach – Including Flip Chip

This two-session on-line Professional Development Course (PDC) webinar was held:
Tuesdays, September 22 and 29, 2009

All webinars were held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: September 21, 2009


Key Words

Chip attach, die attach, direct chip attach, flip chip, bonders, polymer adhesives, epoxy bonding, silver glass, die eutectics, dispensing, curing, SMT, UBM, ICA, ACA, underfill, stud bumping, wafer bumping, lot travelers, SMEMA, cleanroom, 883 Test Methods

Program Description

This course provides an industry-proven training guide to successful component chip attach for use by engineers and senior technicians in a prototype or manufacturing environment. It is also designed for entry level personnel with little or no experience. Students will learn various definitions, details of techniques, materials, processes and equipment used in traditional component chip attachment of passives (capacitors, inductors, resistors), actives (diodes, transistors, ICs, ASICs, microprocessors) and rework methods. Topics covered include: SMT solder reflow, pick/place, dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control. Examples of actual process procedures and industry lot travelers are included.

Special attention will be given to Flip Chip (Direct Chip Attach) and Flip Chip packaging applications. Students will learn definitions (WLP, C4, UBM, ICA, ACA, UF & stud bumping), techniques, processes, materials, substrates and equipment used in flip chip die attachment and underfill using both solder and polymers. Included: types of wafer bumping, pick/place, solder reflow, polymer cure, underfilling, and process control methodology.

Reliability testing and screening methods as well as analysis techniques for various types of component attach are discussed using optical, die shear, scanning electron microscopy and scanning acoustic microscopy. Operator issues include: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety. Figures, photos and diagrams enhance the learning experience. Extensive references are included.

Students will have access to all course slides and in addition will receive a complete set of references/web links providing not only the source material but links to additional detailed information on all main topics covered. Also included is a complimentary detailed Glossary of Chip Component Packaging Terms.

This on-line PDC is a series of 2 one-hour lectures that can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 2: Tuesday, September 22 -- 12:00-1:00 PM EDT

  • Passive and Active Chip Components in New Advanced Applications
  • When a Chip is Not a Chip
  • Overview of Microelectronics Process
  • Back End Of Line (BEOL) Component Related Processing (Backside Treatments, Backgrinding, Bumping, MEMS)
  • Overview of Assembly Process (Dicing, Chip Attach, Wire Bond, Seal)
  • Substrates
  • Details of Chip Attach Assembly Processes
    • Polymers: Epoxy Die Bonding, Types of Equipment, Manual Dispensing Bonders, Screening/Stenciling, Transfer/Stamping, Auto Equipment, Curing, Detailed Epoxy Die Bonder Set Up Procedure and Process, Proven Industry Process Lot Traveler, Paste vs. Film Use, Generic Recommendations,Troubleshooting Process Problems, Avoiding Bleed, Adhesives for Advanced Applications, Evaluation and Acceptance Procedures for Polymeric Adhesives
    • Silver Glass: Glass Frit, Equipment and Process
    • Eutectic: General, Materials, Manual Eutectic Die Attach, Auto Equipment, Die Collets, Problems and Solutions, Detailed Eutectic Set Up Procedure and Process
    • Solder: SMT Process, Soft Solder and Polymers, Which Process to Use for Active and Passive Components
  • Glossary of Current Chip Attach Terminology – Including Flip Chip
  • References

Session 2 of 2: Tuesday, September 29 -- 12:00-1:00 PM EDT

  • Details of Chip Attach Assembly Processes (continued)
    • Flip Chip: C4, Applications, Substrates,Types of Under Bump Metallization (UBM), Bumping, Different Types of FC Bonds, ICA, NCA, ACA, Stud Bump Bonding, Underfill, Flux Residue and Underfill, Reworkable Underfill, Failure Modes, Example of Detailed Proven Industry FC Process Traveler
  • Automated Assembly of Chip Components
    • SMEMA Assembly Equipment
    • Pick/Place Requirements: Solder vs. Polymer
    • General Solder Processing: Which Solder to Use, Solderability, Solder Processing, Solder Paste
    • Rework and Repair
    • Cleanroom Operation: Operator, Handling Techniques, Cleanroom Recommendations, Plasma Cleaning
  • Chip Attach Process Control
    • Reliability Issues and Testing
    • Screen Tests
    • Visual Inspection: Test Method 2017
    • Die Shear Strength: Test Method 2019
    • Radiography: Test Method 2012
    • Ultrasonic Inspection of Die Attach (C-SCAN, SLAM, C-SAM): Test Method 2030
    • Flip Chip Pull-Off: Test Method 2031
    • Generic Failure Analysis
  • Glossary of Current Chip Attach Terminology – Including Flip Chip
  • References

 

Who Should Attend?

This course is designed for the attendee who has little initial familiarity with microelectronics packaging assembly processes at the chip component and flip chip level. Ideal for entry-level technicians and engineers but also for people in quality assurance, sales, marketing, purchasing, safety, administration and program management. Emphasis will be on visual aids.

No prior knowledge of microelectronics chip attach is required since this course is designed for the student who has little initial familiarity with process and materials specifics of chip attach. The course uses simple terms for ease of understanding yet includes aspects of advanced packaging for senior engineers new to the field and needing a running start in packaging technology.

Thomas Green

Presenter

Phillip Creter has over 30 years of microelectronics packaging experience and is a Life member of IMAPS. He was elected a Fellow of the Society, National Treasurer and President of the New England Chapter (twice). He received a BS in Chemistry with honors from Suffolk University and has published numerous papers, holds a U.S. patent, has made many technical presentations (received IMAPS Best Paper of Session award) and chaired numerous technical sessions for symposia. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (receiving coveted corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager and Manufacturing Engineer. Phil currently teaches courses at microelectronics events and is an experienced Webinar instructor. He is also an active certified instructor for the Department of Homeland Security currently teaching courses locally.



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