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IMAPS PDC Webinar Series on
Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World

This two-session on-line Professional Development Course (PDC) webinar were held:
Thursdays, February 18, and 25, 2010

All webinars were held 12:00 noon - 1:30 pm EST

Registration:
IMAPS Members: $150 per webinar; 2-course series $250
Non-members: $275 per webinar; 2-course series $500

Registration Deadlines: February 17, 2010


Program Description

SMT has been in use in high volume since 1985 and BGA has been in use in high volume since 1995. But even after all these years of high volume experience, less than 10% of companies have yield over 90%. That means 90% of companies are doing too much rework.  And this problem will get worse as we are getting into volume manufacturing with BTC.

The electronic assembly if done correctly produces high quality assemblies at a very high speed.  But when something goes wrong, and something does go wrong the same line will produce scrap at the same high speed. And the problem is further compounded with the advent of Lead free and wide spread use of Bottom Termination Components such as QFN, DFN etc as being developed in IPC 7093 currently chaired by Ray Prasad.

This course focuses on three major areas of defects in SMT: design, assembly and the quality of incoming materials. We elaborate on defects related to in coming material quality including surface finishes, and reflow and wave soldering and delve into some unsettled issues in lead free wave soldering and show you finding the root cause of the defects to build products with high and consistent quality to reduce cost and improve reliability.  

The objective of this course is to provide an understanding of root causes of major defects in SMT and through hole tin-lead and Lead Free assemblies and ways to prevent them. After completing this course you will be able to:

  • Advance your understanding of root causes of defects
  • Implement corrective actions in design, assembly and material purchases
  • Take necessary actions to improve yield and reduce product cost.

You are also encouraged to bring your pesky defects for discussion and root cause analysis.

Topics covered:

  • Major Yield Drivers
    • Defects related to DFM
    • Defects related to incoming materials
    • Defects related to Manufacturing Processes
    • Defects related to Lead Free Conversion
  • Case Histories & Examples of Defects
    • Design For Manufacturing
      • Land Pattern
      • Surface Finish
    • Incoming Materials
      • PCB
      • Components
      • Solderability
      • Alloys
    • Manufacturing Processes
      • Paste Printing
      • Reflow Soldering
      • Wave Soldering
      • Rework: Hot Air Vs Laser
  • Path to Yield Improvement
    • Total Quality Management (TQM) Principles and Statistical Quality Control Tools
    • Quality Assurance Vs Quality Control
    • Role of Testing and Inspection in Yield Improvement
    • Why Only Two Defects for Monitoring Yield?

Who Should Attend?

Manufacturing, process, design, test, quality engineering personnel and their managers who are involved in designing or producing tin-lead/Lead Free SMT and mixed-technology assemblies and want to reduce product cost and improve process yield should attend this course.

Thomas Green

Presenter

Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years.  He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products.  He also developed and taught DFM and SMT manufacturing courses to Intel engineers.  For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove.  He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.   

A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA” and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF . 

He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.   

Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.  

Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA.  He is a registered Professional Metallurgical Engineer.



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