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IMAPS PDC Webinar Series on
Design for Manufacturability in a Lead Free World

This two-session on-line Professional Development Course (PDC) webinar were held:
Thursdays, January 28 and February 4, 2010

All webinars were held 12:00 noon - 1:30 pm EDT

IMAPS Members: $150 per webinar; 2-course series $250
Non-members: $275 per webinar; 2-course series $500

Registration Deadlines: January 27, 2010

Program Description

Designing for SMT can involve trial and error and lot of frustration.  Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead Free has compounded the designer’s task.  This one day course is based on Ray's book Surface Mount Technology: Principles and Practice, Second Edition, and the IPC Land Pattern and Design document (now IPC-7351) initially chaired by Ray.  It draws on his experience in developing DFM and Land Patterns at Intel Corporation where he was the SMT Program Manager and the course provides detailed DFM guidelines for both tin-lead and lead free assemblies. 

These 3 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Topics Covered

  • Introduction
    • General DFM Considerations
    • Major Impact of LF on Soldering Process
    • LF Vs Tin-Lead Impact on Reliability
  • DFM for Lead Free Only
    • Laminates for Lead Free
    • Lead Free Surface Finishes
    • Component Considerations
    • Effect on MSL Level & Reflow Profile Due to Lead Free
  • DFM for both Tin-Lead and Lead Free Soldering
    • Layer count and Via Size Considerations
    • Orientation and Inter-package Spacing
    • Land Pattern and Stencil Considerations
    • Design for test, Repair and cleaning

How You Will Benefit

This course can help you establish a strong internal infrastructure in DFM for SMT, fine pitch and BGA using both tin lead and lead free components.   After completing this course you will be able to:

    • Understand factors in selecting appropriate components and PCB laminates and how lead free affects your choices for components, laminates and surface finishes
    • Learn the principles of land pattern design
    • Ensure your boards are designed for manufacturability and yield
    • Improve yield and reduce product cost
    • Set up your own in-house DFM

    Who Should Attend?

    Anyone in management, engineering, purchasing, design, process, quality and manufacturing who are working with tin-lead or lead free using SMT, fine pitch and BGA or plans to get into it in the future will benefit from this course.  Attendees will learn technical details to help solve design and manufacturing problems and develop the internal DFM document to help develop a self-sustaining internal infrastructure which is critical in achieving design and manufacturing process stability in a constantly changing technology and organizational environment.

    Thomas Green


    Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years.  He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products.  He also developed and taught DFM and SMT manufacturing courses to Intel engineers.  For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove.  He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.

    Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.   

    A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA” and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF . 

    He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.   

    Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.  

    Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA.  He is a registered Professional Metallurgical Engineer.

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