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IMAPS PDC Webinar Series on
Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity

This three-session on-line Professional Development Course (PDC) webinar was held:
Tuesdays, June 15, 22 and 29, 2010

All webinars were held 12:00 noon - 1:00 pm EDT

IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500 (includes one-year complimentary individual membership in IMAPS)

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Program Description

Successful and low-cost design of electronic packages and boards requires (in addition to thermal and thermo-mechanical issues), a good understanding of the root causes of signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) issues, as well as methods to analyze, prevent or solve them.

The objective of this course is to provide methods for accurate and efficient electrical modeling, measurement and optimization of packages and PCBs, under consideration of SI, PI and EMI/EMC issues. Techniques for extracting the relative dielectric constant and loss tangent of packaging materials will also be discussed. Finally, guidelines for optimizing the electrical performance of high-speed packages and PCBs will be provided.

Outline of Sessions:

  • High-speed design challenges
  • Modeling and optimization of packaging structures for SI
    • Lossy transmission lines considering surface roughness and tapered cross section
    • Signal vias considering their return-current paths
    • Through silicon vias (TSVs)
  • Modeling and optimization of packaging structures for PI
    • Power-ground plane pairs and simultaneous switching noise (SSN)
    • Electromagnetic band gap (EBG) structures and photonic crystal power/ground layers (PCPLs) for suppressing SSN coupling
  • Modeling and extraction of relative dielectric constant and loss tangent of packaging materials.

Who Should Attend?

Engineers, scientists, researchers, designers and managers involved in the process of electrical modeling, layouts and/or design of single-chip packages, system packages (e.g., SiPs, SoPs, MCMs), PCBs and their interconnections.

Dr. Ivan Ndip


Dr. Ivan Ndip obtained his M.Sc. and Ph.D. with the highest distinction (Summa Cum Laude) in electrical engineering from the Technische Universitaet Berlin, Germany. In 2002, he joined the Fraunhofer-Institute for Reliability and Microintegration (IZM) Berlin as a research engineer and in 2005 he was appointed Group Manager. Since then, he has been leading a team of research engineers/scientists and has also been responsible for developing and leading research projects at IZM that focus on modeling, design and optimization of RF/high-speed packages and PCBs, integrated antennas and passive RF front-end components.

Dr. Ndip is also a lecturer at the Technische Universitaet Berlin, where he teaches graduates courses on the application of electromagnetic field and circuit theory for high-frequency design and measurement of electronic packaging structures.

He has more than 70 publications and has won 5 best paper awards at leading international conferences. Dr. Ndip is also a recipient of the Tiburtius-Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin, Germany.

Dr. Ege Engin

Dr. Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. He received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany in 2004.

Dr. Engin has worked as a research engineer with the Fraunhofer-Institute for Reliability and Microintegration in Berlin, Germany and at Georgia Tech. He is currently an Assistant Professor in the Electrical and Computer Engineering Department of San Diego State University. He has more than 60 publications in the areas of signal and power integrity modeling and simulation and 4 patent applications. He has co-authored the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007.

Dr. Antonio Ciccomancini Scogna

Dr. Antonio Ciccomancini Scogna received the Laura and Ph.D. degrees in electrical engineering from the University of L’Aquila, L’Aquila, Italy, in 2001 and 2005, respectively.

He is currently a Principal Engineer at Computer Simulation Technology (CST) of America, Framingham, MA. His research interests include electromagnetic compatibility numerical modeling, printed and integrated circuits, electromagnetic packaging effects, signal integrity and power integrity analysis in high-speed digital systems. He has authored or coauthored more than 50 publications in IEEE journal transactions, IEEE conference proceedings, and Electronic Design Automation (EDA) magazines.

Dr. Ciccomancini is a member of Applied Computational Electromagnetic Society (ACES), Institution of Engineering and Technology (IET), EMC TC-9 and TC-10 Committees. In 2004, he received the CST University Publication Award for the use of the finite-integration technique in signal integrity applications. He is the recipient of DesignCon Finalist Best Paper Award in 2007 and DesignCon Best Paper Award in 2008.


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