Registration:IMAPS PDC Webinar Series on
Guide to Component Chip Attach – Including Flip Chip

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, September 14 and 21, 2010
All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: September 13, 2010

Register On-line

Key Words

Chip attach, die attach, direct chip attach, flip chip, bonders, polymer adhesives, epoxy bonding, silver glass, die eutectics, sintered nanosilver, dispensing, curing, SMT SMEMA, UBM, ICA, ACA, underfill, stud bumping, wafer bumping, lot travelers, cleanroom, 883 Test Methods

Program Description

This course provides an industry-proven training guide to successful hands-on component chip attach including flip chip for use by engineers and senior technicians in a prototype or manufacturing environment. It uses simple terms for ease of understanding yet includes aspects of advanced packaging for more experienced engineers needing an update in technology. It is also of value for people in quality assurance, sales, marketing, purchasing, safety, administration, and program management.

After a brief review of the overall assembly process, details will be presented on traditional component chip attachment of passives (capacitors, inductors, resistors), actives/die (diodes, transistors, ICs), and rework methods. Current fundamental chip attach materials will be examined: polymer (epoxy), silver glass frit, eutectic (hard solder), solder and polymer SMT, and an update on sintered nanosilver material. Special attention will be given to Flip Chip and Flip Chip packaging applications. Participants will learn definitions of all related terminology (WLP, C4, UBM, ICA, ACA, UF & stud bumping), techniques, processes, materials, substrates and equipment used in flip chip die attachment and underfill using both solder and polymers. Included: types of wafer bumping, pick and place, solder reflow, polymer cure, and underfilling. Topics include: SMT solder reflow, pick and place, dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control methodology. Examples of actual process procedures and industry lot travelers are included.

Reliability testing and screening methods as well as analysis techniques for various types of component attach are discussed using optical, die shear, scanning electron microscopy and scanning acoustic microscopy. Operator issues include: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety.

Participants will have access to all course slides, an expanded glossary of chip attach terminology, and in addition will receive a set of 100+ technical references/Internet links providing not only the source material but links to additional detailed information on all main topics covered.

Session 1 of 2: Tuesday, September 14 -- 12:00-1:00 PM EDT

• Passive and Active Chip Components in New Advanced Applications
• When a Chip is Not a Chip
• Overview of Microelectronics Process
• Back End Of Line (BEOL) Component Related Processing (Backside Treatments, Backgrinding/Thinning, Bumping, MEMS)
• Overview of Assembly Process (Dicing, Chip Attach, Wire Bond, Seal)
• Substrates
• Details of Chip Attach Assembly Processes
  • Polymers: Epoxy Die Bonding, Types of Equipment, Manual Dispensing Bonders, Screening/Stenciling, Transfer/Stamping, Auto Equipment, Curing, Detailed Epoxy Die Bonder Set Up Procedure and Process, Proven Industry Process Lot Traveler, Paste vs. Film Use, Generic Recommendations,Troubleshooting Process Problems, Avoiding Bleed, Adhesives for Advanced Applications, Evaluation and Acceptance Procedures for Polymeric Adhesives
  • Silver Glass: Glass Frit, Equipment and Process
  • Eutectic: General, Materials, Manual Eutectic Die Attach, Auto Equipment, Die Collets, Problems and Solutions, Detailed Eutectic Set Up Procedure and Process
  • Solder: SMT Process, Soft Solder and Polymers, Which Process to Use for Active and Passive Components

Session 2 of 2: Tuesday, September 21 -- 12:00-1:00 PM EDT

• Details of Chip Attach Assembly Processes (continued)
  • Sintered Nanosilver: Properties, Comparisons, Process, Applications, Safety Concerns and Key References
  • Flip Chip: C4, Applications, Substrates, Types of Under Bump Metallization (UBM), Bumping, Different Types of FC Bonds, ACA, ICA, NCA, Stud Bump Bonding, Underfill, Flux Residue and Underfill, Reworkable Underfill, Failure Modes, Example of Detailed Proven Industry FC Process Traveler, Automated SMEMA Assembly Example, Pick/Place Requirements (Solder vs. Polymer), Wafer Bump Processing, Solder Reflow, Solder Paste
• Rework and Repair: Epoxy and Eutectic
• Cleanroom Operation: Operator, Handling Techniques, Cleanroom Recommendations, Plasma Cleaning
• Reliability Issues and Testing
• MIL-STD-883 Test Methods
• Common Die Attach Related Failure Mechanisms
• Chip Attach Process Control Methods
• Visual Inspection: Test Method 2017
• Die Shear Strength: Test Method 2019
• Radiography: Test Method 2012
• Ultrasonic Inspection of Die Attach (C-SCAN, SLAM, C-SAM): Test Method 2030
• Flip Chip Pull-Off: Test Method 2031
• Generic Failure Analysis Tools

Who Should Attend?

This course is designed for the participant minimal familiarity with microelectronics packaging assembly processes at the chip component and flip chip level. The course uses simple terms for ease of understanding yet includes aspects of advanced packaging for senior engineers new to the field and needing a running start in packaging technology. Ideal for entry-level technicians through senior engineers but also for people in quality assurance, sales, marketing, purchasing, safety, administration and program management.

Presenter Phillip Creter has over 30 years of microelectronics packaging experience. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (received GTE Corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager, and Manufacturing Engineer. He has published more than a dozen technical papers, holds a U.S. patent, has given over twenty technical presentations, and has chaired numerous technical sessions for symposia. He has been teaching microelectronics courses at the college level since 1997 and since 2004, has continuously taught professional development courses at various symposia and workshops, recently adding online microelectronics webinars. He is an active certified instructor for the Department of Homeland Security currently teaching courses locally. He is a Life member of IMAPS. He was elected Fellow of the Society, National Treasurer and President of the New England Chapter (twice).

Register On-line