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IMAPS PDC Webinar Series on
Hybrid and Microwave Module Design for Manufacturability (DFM)

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, April 19 and Wednesday, April 20, 2011

All webinars wil be held 12:00 noon - 1:00 pm EST

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375 (includes one-year complimentary individual membership in IMAPS)

Registration Deadline: April 18, 2011

Register On-line


Program Description

Hybrids, microwave modules and Class III medical implants along with other complex microelectronic assemblies all require a lot of thinking and design trade offs prior to full scale manufacturing. There have been many instances where designers have unknowingly placed tremendous burdens on manufacturing that translate into yield loss, production delays, reliability problems and unhappy customers. This two day webinar is intended to sensitize designers to the issues important to manufacturing. Hybrid circuit designers must “design with the process in mind”. Any circuit that can’t be assembled within reasonable cost and schedule constraints is a bust. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Tuesday, April 19, 12:00-1:00 PM EST

Rationale and significance of DFM

Typical problems encountered during hybrid manufacturing and how they can be prevented!

Package Design Issues
- Deep access vs. conventional bonding
- Plating requirements and common mistakes

Substrate Selection
- Problems with Duroid and other soft board substrates and how to avoid

Soldering Processes
- Vacuum solder vs scrub assisted eutectic processes
- Mixing flux and non flux processes   

Tuesday, April 20, 12:00-1:00 PM EST

Die, substrate and package compatibility
- Coefficient of Thermal Expansion (CTE)

Thermal impedance and importance of minimizing junction temperature

Wire and Ribbon Bonding
- Guidelines for wire and ribbon selection
- Design rules for die and wirebond layout and placement

Design for rework and maximum process yields.

Who Should Attend?

This webinar is a must for inexperienced designers or those not familiar with standard hybrid manufacturing practices. Designers along with process and quality engineers will benefit from the instructor’s years of experience and insight into manufacturing Hi Rel Hybrids and RF MMIC modules.

Thomas Green

Presenter

Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran owned small business. He has over twenty-eight years of experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified Hybrid microcircuits for military and commercial applications. Tom has demonstrated expertise in sub fab, die bond wirebond, seam sealing and leak testing processes. For a complete CV and Client listing visit www.tjgreenllc.com.

Register On-line




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