Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Microelectronics Foundation
Contact Us

IMAPS Webinar on
How to Design for Thermal Cycling

This webinar will be held:
Tuesday, May 24, 2011

Webinar will be held 12:00 pm - 1:00 pm EDT
(Repeated as EVENING SESSION - 8:00-9:00 PM EASTERN)

IMAPS Members: $50
Non-members: $75

Registration Deadline: May 23, 2011

Register On-line for 12 NOON EASTERN Day Session | Register On-line for 8:00 PM EASTERN Evening Session


One of the most impressive aspects of modern electronic design is the complexity and multitude of connections. It is these artifacts that are the backbone of the success of this industry. All of these connections, however, have one nemesis: changes in temperatures. Two materials joined together will eventually try to pull themselves apart when exposed to thermal cycling. It is therefore a requisite of good design to delay this event as long as possible through appropriate architecture and materials. In this webinar, Dr. Blattau will review the fundamental drivers for themo-mechanical fatigue. Using physics of failure, Dr. Blattau will then relate these drivers to predictive algorithms in regards to creep and fatigue mechanisms. Having knowledge of these equations, Dr. Blattau will demonstrate how designers can be more proactive and confident of the ability of their designs to be sufficiently robust against thermal cycling environments.

This Webinar lecture is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.


Dr. Blattau has been involved in the packaging and reliability of electronic equipment for over eight years. Dr. Blattau is also experienced in failure analysis and accelerated testing methods. His primary research interests are in the areas of design-for-reliability in electronic packaging, nonlinear finite element analysis, solder joint reliability, fracture, and fatigue mechanics of materials.

  • Ph.D., Mechanical Engineering (University of Maryland)
  • M.S., Mechanical Engineering (University of Maryland)
  • B.S., Civil Engineering (University of Maryland)

Nathan Blattau | Telephone: 301-474-0607 | Email:

Register On-line for 12 NOON EASTERN Day Session | Register On-line for 8:00 PM EASTERN Evening Session

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001