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IMAPS PDC Webinar Series on
Microelectronic Packaging Issues and Failure Analysis

This two-session on-line Professional Development Course (PDC) webinar was held:
Tuesday, December 18 and Wednesday, December 19, 2012

All webinars were held 12:00 noon - 1:00 pm EASTERN

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375 (includes one-year complimentary individual membership in IMAPS)

Download Webinar Replay/Recording


Program Description

The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This webinar is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing, qualification and the unfortunate field failures, and present the FA tools and techniques that are utilized to understand root cause and guide corrective actions.

The instructor shares his years of experience directing microelectronic packaging related root cause FA investigations. Mismatched CTEs  and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect.  Careful delid, visual inspection followed by SEM and EDAX/Auger are required to identify root cause.  Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and, resist the temptation to rush to judgment, which often happens destroying valuable evidence along the way.  The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution.

Webinar Outline:

Introduction to Microelectronic Packaging

Terminology and Product Definitions
-- Hybrids, Microwave Modules, MEMS, Optoelectronic Devices, Class III implants

Typical Package Related Defects and Failures

Failure Analysis (FA) Process Flow
-- Review of common FA equipment and procedures

Specific Examples of Package Related Failures and FA Investigation

-Die, substrate and package compatibility issues
-- Coefficient of Thermal Expansion (CTE) problems  
-- Voiding under the die
-- Sliver dendrites growing from silver loaded epoxy   

- Wire and ribbon bond failures
-- Bond lifts due to contamination
-- Heel cracks
-- Excessive intermetallic formation

- Package plating issues
-- Plating issues that lead to wirebond  failures
-- Au embrittlement

- Loose conductive particles and Murphy’s law
-- Foreign material identification and control

- Hermetic package seal issues
-- Moisture related failures
-- Outgassing problems

- Using Residual Gas Analysis (RGA) as an FA tool and process indicator

Who Should Attend?

This intermediate course is intended for reliability engineers, design, quality and process engineers and responsible mid level managers.

Thomas Green

Presenter

Mr. Thomas Green is the principle at TJ Green Associates LLC (www.tjgreenllc.com) a Veteran Owned Small Business focused on training and consulting for military, space and medical microelectronic devices. He has thirty years of experience in the field of microelectronics packaging and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military and commercial applications. Tom has demonstrated expertise in substrate fabrication, die bond, wirebond, seam sealing, leak testing and failure analysis processes.

Download Webinar Replay/Recording




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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001