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IMAPS PDC Webinar Series on
Basics of Component Chip Attach:
Epoxy, Silver Glass, Eutectic, SMT, Nanosilver and Flip Chip

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesday, April 9, and Thursday, April 11, 2013

All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadline: April 8, 2013


Key Words

Chip attach, die attach, direct chip attach, flip chip, bonders, actives, passives, 01005 components, epoxy bonding, silver glass, die eutectics, sintered nanosilver, dispensing, curing, SMT, UBM, ICA, ACA, underfill, stud bumping, wafer bumping, SAC solder, copper pillars, lot travelers, cleanroom, 883 Test Methods

Program Description

This popular topic has been UPDATED and includes 2012 and recent 2013 developments. It provides an industry-proven training guide to successful hands-on component chip attach including flip chip for use by engineers and senior technicians in a prototype or manufacturing environment. It uses simple terms for ease of understanding but includes aspects of advanced packaging for more experienced engineers needing an update in technology. This course is also of value for people in quality assurance, sales, marketing, purchasing, safety, administration, and program management.

Attendees will learn various definitions, details of techniques, materials, processes and equipment used in traditional component chip attachment of passives (capacitors, inductors, resistors), actives (diodes, transistors, ICs), and rework methods. Current fundamental chip attach materials will be examined: epoxy, silver glass frit, die eutectic (hard solder), solder and polymer SMT, with an update on sintered nanosilver materials.

Special attention will be given to Flip Chip packaging applications. Specific Flip Chip processes, materials and equipment, used in Flip Chip attachment and underfill using solder, copper pillars and polymers, will be reviewed, including definitions (WLP, C4, UBM, ICA, ACA, UF, WUF, MUF, NCP, NCF and stud bumping). Types of wafer bumping, pick and place, solder reflow, polymer cure, underfilling, and process control methodology will be detailed.

Other topics include: SMT solder reflow, pick and place (including 01005 component equipment), dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control. Examples of actual process procedures and industry lot travelers are included. Reliability testing, including ElectroMigration (EM) results are discussed. Screening methods as well as analysis techniques for various types of component attach are reviewed using optical, die shear, scanning electron microscopy and scanning acoustic microscopy. Operator issues include: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety.

Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Attendees will have access to all course slides and 100+ technical references/Internet links providing not only the source material but links to additional detailed information on all main topics covered.

Session 1 of 2: Tuesday, April 9 -- 12:00-1:00 PM EASTERN

  • Passive and Active Chip Components in New Advanced Applications
  • Overview of Microelectronics Process
  • Back End Of Line (BEOL) Component-Related Processing (Backside Treatments, Backgrinding/Thinning, Bumping, MEMS)
  • Overview of Assembly Process (Dicing, Chip Attach, Wire Bond, Seal)
  • Substrates
  • Details of Chip Attach Assembly Processes
    • Epoxy Die Bonding: Types of Equipment, Manual Dispensing Bonders, Screening/Stenciling, Transfer/Stamping, Auto Equipment, Curing, Detailed Epoxy Die Bonder Set Up Procedure and Process, Proven Industry Process Lot Traveler, Paste vs. Film Use, Generic Recommendations, Troubleshooting Process Problems, Avoiding Bleed, Adhesives for Advanced Applications, Evaluation and Acceptance Procedures for Polymeric Adhesives
    • Silver Glass: Glass Frit, Equipment and Process
    • Eutectic: General, Materials, Manual Eutectic Die Attach, Auto Equipment, Die Collets, Problems and Solutions, Detailed Eutectic Set Up Procedure and Process
    • SMT Process: Soft Solder and Polymers, Which Process to Use for Active and Passive Components
    • Sintered Nanosilvers: Properties, Comparisons, Process, Applications, Safety Concerns and Key References

Session 2 of 2: Thursday, April 11 -- 12:00-1:00 PM EASTERN

  • Details of Chip Attach Assembly Processes (continued)
    • Flip Chip: C4, Applications, Substrates, Types of Under Bump Metallization (UBM), Bumping, Different Types of FC Bonds, ACA, ICA, NCA, Stud Bump Bonding, Underfill, MUF, WUF, NCP, NCF, Flux Residue and Underfill, Reworkable Underfill, Failure Modes, Example of Detailed Proven Industry FC Process Traveler, Automated SMEMA SMT Assembly Example, Pick/Place Requirements (Solder vs. Polymer), Wafer Bump Materials including Copper Pillars, Various Solders & Polymers
  • Rework and Repair: Epoxy and Eutectic
  • Cleanroom Operation: Operator Issues, Handling Techniques, Cleanroom Recommendations, Plasma Cleaning
  • Reliability Issues and Testing: Including Latest Electromigration Results of Copper Pillars Compared to Different Flip Chip Bumps
  • MIL-STD-883 Test Methods
  • Common Die Attach Related Failure Mechanisms
  • Chip Attach Process Control Methods
  • Visual Inspection: Test Method 2017
  • Die Shear Strength: Test Method 2019
  • Radiography: Test Method 2012
  • Ultrasonic Inspection of Die Attach (C-SCAN, SLAM, C-SAM): Test Method 2030
  • Flip Chip Pull-Off: Test Method 2031
  • Generic Failure Analysis Tools

Who Should Attend?

This course is designed for the participant who has little initial familiarity with microelectronics packaging assembly processes at the chip component and flip chip level. Ideal for entry-level technicians and engineers and staff in quality assurance, sales, marketing, purchasing, safety, administration and program management. No prior knowledge of microelectronics chip attach is required. The course uses simple terms for ease of understanding yet includes aspects of advanced packaging for senior engineers new to the field and needing a running start in packaging technology.

Thomas Green


Phillip Creter has over 30 years of microelectronics packaging experience. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (received GTE Corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager, and Manufacturing Engineer. He has published more than a dozen technical papers, holds a U.S. patent, has given over twenty technical presentations, and has chaired numerous technical sessions for symposia. He has been teaching microelectronics courses at the college level since 1997 and since 2004, has continuously taught professional development courses at various symposia and workshops, recently adding online microelectronics webinars. He is an active certified instructor for the Department of Homeland Security currently teaching courses locally. He is a Life member of the International Microelectronics And Packaging Society (IMAPS). He was elected Fellow of the Society, National Treasurer and President of the New England Chapter (twice).



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