IMAPS Webinar Series and Virtual Meetings

• Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
• Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
• Real-time — featuring current and up-to-date information.

From audio-only Virtual Meetings to regularly scheduled Audio/Web seminars, IMAPS brings microelectronics professionals the information you need with the on-line convenience to meet the demands of your high-speed profession!

With our Virtual Meetings, IMAPS provides the slides in advance of the meetings, and you simply dial-in through your phone on the day of the presentation and follow along with your downloaded materials.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at bschieman@imaps.org.

Upcoming Programs:

PDC Webinar Series on
Polymers for Semiconductor Packaging
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, September 8, 15 and 22, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip
Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, September 14, and 21, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on
Precious Metal Financing and Hedging
Presented by: Paul Angland, HSBC Bank USA
This corporate webinar will be held September 16, 2010. This webinar will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Component Authentication and Screening
Presented by: Bhanu Sood, University of Maryland, CALCE
**NEW DATES**
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, October 6 and 13, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: September 2010 (TBD). All webinars will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Rheology Issues in Electronic Packaging -- Details Available Soon
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, November 16, 23 and 30, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Archived Webinars and Virtual Meetings Downloads:

PDC Webinar Series on Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, Computer Simulation Technology (CST) of America | June 15, 22, and 29, 2010

PDC Webinar Series on Conformal Coating Applications, Inspection, Rework & Quality Control
Bob Willis, ASKbobwillis.com Consulting | May 18 and May 19, 2010

PDC Webinar Series on RF/Microwave Hybrids: Materials and Processing
Richard Brown, Richard Brown Associates | April 6, and 13, 2010

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Moody Dreiza, Amkor Technology | March 18, 25 and April 1, 2010

PDC Webinar Series on Ball Grid Array Inspection Lead-Free Defect Guide
Bob Willis, ASKbobwillis.com Consulting | March 23, and 24, 2010

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Dr. Ray Prasad, Ray Prasad Consultancy Group | February 18, and 25, 2010

PDC Webinar Series on Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates | February 3, 10, and 17, 2010

PDC Webinar Series on Design for Manufacturability in a Lead Free World
Dr. Ray Prasad, Ray Prasad Consultancy Group | January 28, and February 4, 2010

PDC Webinar Series on Wire Bonding
Lee Levine, Process Solutions Consulting | December 1, 8 and 15, 2009

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages
Tom Green, TJ Green Associates, LLC | November 17 and 24, 2009

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University | October 13, 20, 2009

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates | September 22, 29, 2009

PDC Webinar Series on Polymers for Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC | July 9, 16, 23, 2009

PDC Webinar Series on Precious Metal Powder/Flakes and their Application in Microelectronic Packaging
Dr. Guixiang Yang and Gary Hemphill, Technic, Inc. | June 22, 29, 2009

PDC Webinar Series on Lead-Free Soldering
Dr. Jianbiao (John) Pan, Cal Poly State University | June 18, 25, 2009

PDC Webinar Series on 4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems
Dr. Ray Prasad, Ray Prasad Consultancy Group | June 9, 16, 23, 2009

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems
Dr. Lei Shan, IBM T J Watson Research Center | May 6, 20, 2009

PDC Webinar Series on: Introduction to Multilayer Ceramics
Dr. Fred Barlow, University of Idaho | April 1, 8, 15, 2009

PDC Webinar Series: Lead-free Electronics – Technology, Manufacturing & Reliability
Dr. Jennie Hwang, H-Technologies Group | March 18, 25, 2009

PDC Webinar Series: Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates | February 10, 17, and 24, 2009

PDC Webinar Series: Wire Bonding
Lee Levine, Process Solutions Consulting | January 29 and February 5, 2009

GBC Virtual Meeting: Supply Chain Development for 3D Packaging
Global Business Council (GBC) | February 3, 2009

PDC Webinar Series: Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Moody Dreiza, Amkor Technology | January 13, 20, and 27, 2009

PDC Webinar Series: Hermeticity Packaging Concepts
Tom Green, TJ Green Associates, LLC | October 6, 14, and 21, 2008

Webinar: Stud Bumping: Expanding Flip Chip Into New Applications
Sponsored by: Kulicke & Soffa Industries, Inc. | November 1, 2007