Micross

IMAPS Webinar Series

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.


From audio-only Virtual Meetings to regularly scheduled Audio/Web seminars, IMAPS brings microelectronics professionals the information you need with the on-line convenience to meet the demands of your high-speed profession!

With our Virtual Meetings, IMAPS provides the slides in advance of the meetings, and you simply dial-in through your phone on the day of the presentation and follow along with your downloaded materials.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at bschieman@imaps.org.


Upcoming Programs:


More webinars will be scheduled soon. Please check back


Archived Webinars and Virtual Meetings Downloads:

INTERESTED IN DOWNLOAD/REPLAY OF THE FOLLOWING ARCHIVED WEBINARS?
Contact bschieman@imaps.org

PDC Webinar Series on Best of "2013 Packaging Advances, Updates & Trends"
Featuring
4 separate webinars on: 3D, Flip Chip, MEMS, & Embedded Chips
Instructor: Phillip Creter, Creter and Associates

Webinar 1 - 3D: January 7 & 9, 2014 at 12:00 NOON EASTERN
Webinar 2 - Flip Chip: January 14 & 16, 2014 at 12:00 NOON EASTERN
Webinar 3 - MEMS: January 21 & 23, 2014 at 12:00 NOON EASTERN
Webinar 4 - Embedded Chips: January 28 & 30, 2014 at 12:00 NOON EASTERN

Each webinar consists of two sessions/days.
Take each series separately or register for all 4 webinars at a discounted rate!

PDC Webinar Series on Microelectronic Packaging Issues and Failure Analysis
Tom Green, TJ Green Associates, LLC | December 18 and December 19, 2012

Complimentary Download/Replay
Corporate Webinar on
High-Reliability Component Attachment Process for <5µm Placement Accuracy
June 13 & , October 31, 2012 | Sponsored and Presented by: Palomar Technologies, Inc.

Palomar

PDC Webinar Series on Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates | May 16, and Thursday, May 17, 2012.

PDC Webinar Series on Rheology Issues in Electronic Packaging
Dr. Jeff Gotro, InnoCentrix, LLC | April 5, 12 and 19, 2012.

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associate | March 28 and April 4, 2012.

PDC Webinar Series on Wire Bonding
Lee Levine, Process Solutions Consulting | March 20, 22, 27, and 29, 2012

Corporate Webinar on Why Wedge Bond?
Sponsored and Presented by: Hesse & Knipps | November 10, 2011.

Hesse & Knipps

PDC Webinar Series on Polymers in Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC | September 7, 14, and 21, 2011.

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates | September 8, and 15, 2011.

Florida Chapter Webinar on Plasma Technology for Microelectronics Packaging
Sponsored and Presented by: Nordson March | September 13, 2011

Nordson March

Webinar on How to Design for Thermal Cycling
Nathan Blattau, DfR Solutions | May 24, 2011

Webinar on How to Mitigate the Risk of Counterfeit Electronic Parts
Phil Zulueta, Jet Propulsion Laboratory, California Institute of Technology | May 20, 2011

PDC Webinar Series on Hybrid and Microwave Module Design for Manufacturability (DFM)
Tom Green, TJ Green Associates, LLC | April 19-20, 2011

PDC Webinar Series on Introduction to Microelectronics Packaging Including Industry Updates and Trends
Phillip Creter, Creter and Associates | April 4, 11 and 18, 2011

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Moody Dreiza, Amkor Technology | March 29, April 5, and 12, 2011

PDC Webinar Series on Wire Bonding
Lee Levine, Process Solutions Consulting | February 8, 10, and 15, 2011

PDC Webinar Series on Rheology Issues in Electronic Packaging
Dr. Jeff Gotro, InnoCentrix, LLC
| November 16, 23 and 30, 2010

PDC Webinar Series on Component Authentication and Screening
Bhanu Sood, University of Maryland, CALCE | October 6 and 13, 2010

PDC Webinar Series on Polymers for Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC | September 8, 15 and 22, 2010

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates | September 14, and 21, 2010

PDC Webinar Series on Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, Computer Simulation Technology (CST) of America | June 15, 22, and 29, 2010

PDC Webinar Series on Conformal Coating Applications, Inspection, Rework & Quality Control
Bob Willis, ASKbobwillis.com Consulting | May 18 and May 19, 2010

PDC Webinar Series on RF/Microwave Hybrids: Materials and Processing
Richard Brown, Richard Brown Associates | April 6, and 13, 2010

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Moody Dreiza, Amkor Technology | March 18, 25 and April 1, 2010

PDC Webinar Series on Ball Grid Array Inspection Lead-Free Defect Guide
Bob Willis, ASKbobwillis.com Consulting | March 23, and 24, 2010

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Dr. Ray Prasad, Ray Prasad Consultancy Group | February 18, and 25, 2010

PDC Webinar Series on Introduction to Microelectrnics Packaging Technology
Phillip Creter, Creter and Associates | February 3, 10, and 17, 2010

PDC Webinar Series on Design for Manufacturability in a Lead Free World
Dr. Ray Prasad, Ray Prasad Consultancy Group | January 28, and February 4, 2010

PDC Webinar Series on Wire Bonding
Lee Levine, Process Solutions Consulting | December 1, 8 and 15, 2009

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages
Tom Green, TJ Green Associates, LLC | November 17 and 24, 2009

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University | October 13, 20, 2009

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates | September 22, 29, 2009

PDC Webinar Series on Polymers for Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC | July 9, 16, 23, 2009

PDC Webinar Series on Precious Metal Powder/Flakes and their Application in Microelectronic Packaging
Dr. Guixiang Yang and Gary Hemphill, Technic, Inc. | June 22, 29, 2009

PDC Webinar Series on Lead-Free Soldering
Dr. Jianbiao (John) Pan, Cal Poly State University | June 18, 25, 2009

PDC Webinar Series on 4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems
Dr. Ray Prasad, Ray Prasad Consultancy Group | June 9, 16, 23, 2009

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems
Dr. Lei Shan, IBM T J Watson Research Center | May 6, 20, 2009

PDC Webinar Series on: Introduction to Multilayer Ceramics
Dr. Fred Barlow, University of Idaho | April 1, 8, 15, 2009

PDC Webinar Series: Lead-free Electronics – Technology, Manufacturing & Reliability
Dr. Jennie Hwang, H-Technologies Group | March 18, 25, 2009

PDC Webinar Series: Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates | February 10, 17, and 24, 2009

PDC Webinar Series: Wire Bonding
Lee Levine, Process Solutions Consulting | January 29 and February 5, 2009

GBC Virtual Meeting: Supply Chain Development for 3D Packaging
Global Business Council (GBC) | February 3, 2009

PDC Webinar Series: Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Moody Dreiza, Amkor Technology | January 13, 20, and 27, 2009

PDC Webinar Series: Hermeticity Packaging Concepts
Tom Green, TJ Green Associates, LLC | October 6, 14, and 21, 2008

Webinar: Stud Bumping: Expanding Flip Chip Into New Applications
Sponsored by: Kulicke & Soffa Industries, Inc. | November 1, 2007

INTERESTED IN DOWNLOAD/REPLAY? Contact bschieman@imaps.org

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems